There are provided a continuous fiber-reinforced silicon carbide member and the like which allow sufficient improvement in a mechanical property and environmental resistance. The continuous fiber-reinforced silicon carbide member of an embodiment is a tubular shape and has a first composite material layer and a second composite material layer. In the first composite material layer, continuous fibers of silicon carbide are combined with a matrix of silicon carbide. In the second composite material layer, continuous fibers of carbon are combined with a matrix of silicon carbide. Then, the first composite material layer and the second composite material layer are stacked.

A method for joining a metal component to a ceramic component is presented. The method includes disposing a metallic barrier layer on a metallized portion of the ceramic component, and joining the metal component to the metallized portion of the ceramic component through the metallic barrier layer. The metallic barrier layer comprises nickel and a melting point depressant. The metallic barrier layer is disposed by a screen printing process, followed by sintering the layer at a temperature less than about 1000 degrees Celsius. A sealing structure including a joint between a ceramic component and a metal component is also presented.

A Cu/ceramic bonded body according to the present invention is formed by bonding a copper member made of copper or a copper alloy and a ceramic member made of AlN or Al.sub.2O.sub.3 using a bonding material containing Ag and Ti, in which a Ti compound layer made of a Ti nitride or a Ti oxide is formed at a bonding interface between the copper member and the ceramic member, and Ag particles are dispersed in the Ti compound layer.

The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.

A method of forming a hybrid metal composite structure including at least one metal ply. The method includes forming at least one metal ply, forming the at least one metal ply comprising forming at least one perforation in the at least one metal ply, abrasively blasting at least one surface of the at least one metal ply to coarsen the at least one surface of the metal ply, and exposing the at least one metal ply to at least one of an acid or a base. The method further includes disposing at least one fiber composite material structure adjacent the at least one metal ply. Related methods of forming a portion of a rocket case and related hybrid metal composite structures are also disclosed.

A SiAlON sintered body according to the present invention is represented by Si.sub.6-zAl.sub.zO.sub.zN.sub.8-z (0<z4.2) and has an open porosity of 0.1% or less and a relative density of 99.9% or more. A ratio of a total of intensities of maximum peaks of components other than SiAlON to an intensity of a maximum peak of the SiAlON in an X-ray diffraction diagram is 0.005 or less.

A method of producing a bonded body is disclosed in which a ceramic member made of ceramics and a Cu member made of Cu or a Cu alloy are bonded to each other, the method including: a laminating step of laminating the ceramic member and the Cu member in a state where a CuP-based brazing filler material containing 3 mass % to 10 mass % of P and an active metal material are interposed therebetween; and a heating step of heating the ceramic member and the Cu member which are laminated.

A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

An assembly, comprising: a first ceramic body and a second ceramic body connected by means of a joint of an active hard solder, or braze, wherein the active hard solder, or braze, averaged over a continuous main volume, which includes at least 50% of the volume of the joint, has an average composition C.sub.M with a liquidus temperature T.sub.l(C.sub.M). An edge region of the joint, which contacts at least one of the ceramic bodies, has an average composition C.sub.E with a liquidus temperature T.sub.l(C.sub.E), which lies not less than 20 K, preferably not less than 50 K, and especially preferably not less than 100 K above the liquidus temperature T.sub.l(C.sub.M) of the average composition C.sub.M of the main volume.

Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.