A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding layer. A porosity of the interface bonding layer is substantially smaller than or equal to 25%.

A ceramic substrate includes a multilayer body including stacked ceramic layers and a housing portion in an interior of the multilayer body and a heat dissipation portion in the housing portion. A first hollow is provided between at least a portion of an outer surface of the heat dissipation portion and an inner wall surface of the housing portion in an extension direction of the heat dissipation portion.

Set forth herein are materials, systems, and methods for sintering bilayers that include a layer of a metal and a layer of a ceramic.