A method of forming a ceramic matrix composite includes preparing a plurality of fibrous ceramic plies by applying a binder solution loaded with ceramic particles to each of a first subset of plies, and applying the binder solution without ceramic particles to each of a second subset of plies. The method further includes arranging the plurality of plies to form a preform with a gradient along a thickness direction of the preform by stacking the first subset of plies to form a first zone of the preform, and stacking individual ones of the second subset of the plies on both sides of the first zone to form a second zone on each side of the first zone. Loading of the ceramic particles is higher in the first zone than in the second zones. The method further includes densifying the preform with a ceramic matrix.

In joining composite ceramic bodies, at least one ceramic body is a compositionally graded with varying concentrations between two or more ceramic materials. The compositionally graded ceramic body terminates at an interfacial layer that is substantially composed of a single ceramic material. The compositionally graded ceramic body is joined to another ceramic body that may also be compositionally graded or made of a single ceramic material, and an interfacial layer of the other ceramic body is identical in composition with the interfacial layer of the compositionally graded ceramic body. In some embodiments, the ceramic bodies may be joined by diffusion bonding. In some embodiments, the ceramic bodies include a ceramic platen and ceramic stem of a wafer pedestal implemented in a plasma processing apparatus.

The present invention relates to a molded body with a color profile for use in the production of dental restorations obtainable by sintering a press-molded body comprising two or more color-different ceramic powder layers, wherein each powder layer comprises at least 80 wt. % of ZrO.sub.2 and is essentially free of iron oxide, characterized in that at least one powder layer comprises terbium oxide (Tb.sub.4O.sub.7).

A thermal protection system that reduces a mismatch of thermal expansion coefficients CTE between a first material layer (CTE1) and a second material layer (CTE2) at a first layer-second layer interface. A portion of aluminum borosilicate (abs) or another suitable additive (add), whose CTE value, CTE(add), satisfies (CTE(add)CTE1)(CTE(add)CTE2)<0, is distributed with variable additive density, (z;add), in the first material layer and/or in the second material layer, with (z;add) near the materials interface being relatively high (alternatively, relatively low) and (z;add) in a region spaced apart from the interface being relatively low (alternatively, relatively high).

Provided is a ceramic substrate. The ceramic substrate includes a core layer, made of zirconia toughened alumina; and surface layers, symmetrically located on an upper and a lower surfaces of the core layer, made of Al.sub.2O.sub.3. The core layer has a chemical composition of 0 wt %<ZrO.sub.240 wt % and 60 wt %Al.sub.2O.sub.3<100 wt %. A method for manufacturing the ceramic substrate and a power module including the ceramic substrate are also provided.

The present invention provides a zirconia pre-sintered body having suitable shades, translucency, and strength. The present invention relates to a zirconia pre-sintered body comprising a layered structure of at least three layers containing zirconia and a stabilizer capable of preventing a phase transformation of zirconia, the layered structure including at least two layers that differ from one another in the content of the stabilizer relative to the total mole of the zirconia and the stabilizer, the layered structure including at least two layers having substantially the same stabilizer content relative to the total mole of the zirconia and the stabilizer, the zirconia pre-sintered body containing a coloring component in all of the layers having substantially the same stabilizer content, and the layers having substantially the same stabilizer content differing from one another in the composition of the coloring component.

A wafer support includes a base material including at least boron nitride as a machinable ceramic, a protective layer covering a surface of the base material, and a conductive member placed at least partially inside the base material. The base material includes a first layer and a second layer between the first layer and the protective layer. The protective layer includes a material that is less corrodible by plasma than the base material. The following formula is satisfied: 5W1W235 where the proportion of boron nitride contained in the first layer is represented by W1 [mass %] and the proportion of boron nitride contained in the second layer is represented by W2 [mass %].

The present disclosure relates to a gas turbine part, which can be exposed to high temperatures and centrifugal forces within a gas turbine. The gas turbine part can include plural sliced parts, wherein at least one of said sliced parts is made from a ternary ceramic called MAX phase, having the formula M.sub.n+1AX.sub.n, where n=1, 2, or 3, M is an early transition metal such as Ti, V, Cr, Zr, Nb, Mo, Hf, Sc, Ta, and A is an A-group element such as Al, Si, P, S, Ga, Ge, As, Cd, In, Sn, Tl, Pb, and X is C and/or N.

The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a CuPSn-based brazing filler material and a Ti material, wherein a CuSn layer, in which Sn forms a solid solution with Cu, is formed at a bonded interface between the ceramic member and the Cu member, and intermetallic compounds containing P and Ti are dispersed in the CuSn layer.

According to a method for producing a circuit carrier arrangement, a carrier which has a surface section formed by an aluminum/silicon carbide metal matrix composite material is provided. A circuit carrier, which has an insulation carrier with a lower side onto which a lower metallization layer is applied, is also provided. A bonding layer, which contains a glass, is generated on the surface section. A material-fit connection between the bonding layer and the circuit carrier is produced by means of a connecting layer.