A toughened ceramic component having a residual compressive stress and methods of forming the toughened ceramic component is disclosed. The ceramic component may include an internal portion having a first coefficient of thermal expansion (CTE) and an external portion substantially surrounding the internal portion and forming an exterior surface of the ceramic component. The external portion may have a second CTE that is less than the first CTE. Additionally, the external portion may be in compressive stress.

The present invention relates to a pre-sintered multi-layered dental mill blank comprising a top layer, a bottom layer, and at least one intermediate layer. The pre-sintered multi-layered dental mill blank or a part prepared thereof has one or more desirable properties when being fully sintered by a speed sintering process. The present invention also relates to a process for preparing a dental restoration using the pre-sintered multi-layered dental mill blank as well as to a dental restoration as such. The present invention further relates to a process for sintering a dental restoration precursor.

A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding layer. A porosity of the interface bonding layer is substantially smaller than or equal to 25%.

Components for a gas turbine engine and method for producing the components are provided. The components may include a substrate and a thermal barrier coating (TBC) having at least a first layer secured to a surface of the substrate. The first layer is formed of a ceramic material with a first microstructure that includes a plurality of interconnected unit cells having struts that have a relative density of greater than 98 percent and a closed cell porosity of 10 percent or greater. The TBC is secured to the substrate subsequent to formation of the TBC.

A method including applying layers of multiple constituents where the constituents are capable of producing a non-equilibrium condition on the contacting surfaces of a ceramic matrix composite component and a gas turbine engine component where one outer coating includes a first constituent and the other outer coating includes a second constituent; forming a component assembly with the ceramic matrix composite component coupled to the gas turbine engine component with contact between the outer coatings; adding an energy to facilitate an equilibrium reaction between the first constituent of the first outer coating and the second constituent of the second outer coating; and as a result of adding the energy, forming a bond structure in the component assembly with a product of the equilibrium reaction where the bond structure affixes the ceramic matrix composite component to the gas turbine engine component between the first constituent and the second constituent.

In joining composite ceramic bodies, at least one ceramic body is a compositionally graded with varying concentrations between two or more ceramic materials. The compositionally graded ceramic body terminates at an interfacial layer that is substantially composed of a single ceramic material. The compositionally graded ceramic body is joined to another ceramic body that may also be compositionally graded or made of a single ceramic material, and an interfacial layer of the other ceramic body is identical in composition with the interfacial layer of the compositionally graded ceramic body. In some embodiments, the ceramic bodies may be joined by diffusion bonding. In some embodiments, the ceramic bodies include a ceramic platen and ceramic stem of a wafer pedestal implemented in a plasma processing apparatus.

A pressure sensor, including a platform of ceramic, a measuring membrane arranged on the platform, a pressure measuring chamber enclosed in the platform under the measuring membrane, and at least one metal body connected with the platform via a pressure-tight, preferably elastomer free, mechanical connection. Thermomechanical stresses arising from the connection are reduced by features including that the pressure-tight, mechanical connection occurs via an adapting body arranged between the platform and the metal body. The adapting body has a thermal expansion coefficient, which rises in direction (z) extending from the platform to the metal body from a coefficient of expansion corresponding to a thermal coefficient of expansion of the ceramic of the platform to a coefficient of expansion corresponding to the thermal coefficient of expansion of the metal body, and the adapting body is connected by a first joint with the platform and by a second joint with the metal body.

There is disclosed a plugged honeycomb structure. A plugged honeycomb structure includes a honeycomb structure body of a segment structure and plugging portions disposed in open ends of cells formed in the honeycomb structure body, the honeycomb structure body has outer segments and inner segments disposed on an inner side than the outer segments in a cross section of the honeycomb structure body, and a material constituting the outer segments has a smaller heat capacity per unit volume than a material constituting the inner segments.

Provided is a porous plate-shaped filler that can be used as a material for a heat-insulation film having excellent heat insulation performance. In a porous plate-shaped filler 1 having a plate shape, an aspect ratio is 3 or higher, a minimum length is 0.5 to 50 m, and an overall porosity is 20 to 90%, and the porosity is lower in the circumferential part than in the center part. When this porous plate-shaped filler 1 of the present invention is contained in a heat-insulation film, the infiltration of a matrix into the filler is reduced, and thus the thermal conductivity can be lowered. Therefore, even a thin heat-insulation film can have a greater heat-insulation effect than before.

In some aspects, the techniques described herein relate to a semiconductor device assembly including: a direct-bonded-metal (DBM) substrate including: a ceramic layer; a first metal layer disposed on a first surface of the DBM substrate, the first metal layer having a uniform thickness; and a second metal layer disposed on a second surface of the DBM substrate opposite the first surface, the second metal layer including: a first portion having a first thickness; and a second portion having a second thickness, the second thickness being greater than the first thickness, the second portion of the second metal layer including a metal alloy having a coefficient of thermal expansion (CTE) in a range of 7 to 11 parts-per-million per degrees Celsius (ppm/ C.); and a semiconductor die having a first surface coupled with the second portion of the second metal layer.