Patent classifications
C04B2237/60
ELECTROCHEMICAL ENERGY STORAGE DEVICES
Provided herein are energy storage devices. In some cases, the energy storage devices are capable of being transported on a vehicle and storing a large amount of energy. An energy storage device is provided comprising at least one liquid metal electrode, an energy storage capacity of at least about 1 MWh and a response time less than or equal to about 100 milliseconds (ms).
INTEGRAL CERAMIC MATRIX COMPOSITE FASTENER WITH NON-POLYMER RIGIDIZATION
A method of forming an integral fastener for a ceramic matrix composite component comprises the steps of forming a fiber preform with an opening, forming a fiber fastener, inserting the fiber fastener into the opening, and infiltrating a matrix material into the fiber preform and fiber fastener to form a ceramic matrix composite component with an integral fastener. A gas turbine engine is also disclosed.
CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
A ceramic substrate is provided with a flat plate-shaped insulating base including a ceramic, a first brazing material layer provided on a first main surface of the insulating base, a second brazing material layer provided on a second main surface of the insulating base, a first metal layer including a metal and being fixed through the first brazing material layer to the insulating base on a first main surface-side, and a second metal layer including a metal and being fixed through the second brazing material layer to the insulating base on a second main surface-side. A difference between a thickness of the first brazing material layer and a thickness of the second brazing material layer at a given point is 4.0 .Math.m or less.
INTEGRAL CERAMIC MATRIX COMPOSITE FASTENER WITH POLYMER RIGIDIZATION
A gas turbine engine component includes a gas turbine engine component body formed of a ceramic matrix composite material having at least one fastener integrally formed with the gas turbine engine component body as a single-piece structure. The gas turbine engine component body initially comprises a rigidized preform structure formed from a polymer based material. The at least one fastener connects the gas turbine engine component body to an engine support structure.
Ceramic circuit board, method for manufacturing ceramic circuit board, and module using ceramic circuit board
A ceramic circuit substrate and power module with excellent heat cycle resistance characteristics, which is formed by bonding a ceramic substrate and a copper plate via a brazing material including Ag, Cu, and an active metal, wherein the bond void fraction is no greater than 1.0% and the diffusion distance of the Ag, which is a brazing material component, is 5-20 μm. Also, a method for manufacturing a ceramic circuit substrate characterized in that the heating time in a temperature range 400-700° C. in a process for raising the temperature to a bonding temperature is 5-30 minutes and bonding is performed by maintaining the bonding temperature at 720-800° C. for 5-30 minutes.
Integral ceramic matrix composite fastener with non-polymer rigidization
A method of forming an integral fastener for a ceramic matrix composite component comprises the steps of forming a fiber preform with an opening, forming a fiber fastener, inserting the fiber fastener into the opening, and infiltrating a matrix material into the fiber preform and fiber fastener to form a ceramic matrix composite component with an integral fastener. A gas turbine engine is also disclosed.
Ceramic and ceramic composite components
Thermally-conductive ceramic and ceramic composite components suitable for high temperature applications, systems having such components, and methods of manufacturing such components. The thermally-conductive components are formed by a displacive compensation of porosity (DCP) process and are suitable for use at operating temperatures above 600° C. without a significant reduction in thermal and mechanical properties.
BONDED SUBSTRATE, AND METHOD FOR MANUFACTURING BONDED SUBSTRATE
A bonded substrate includes: a silicon nitride ceramic substrate; a copper plate; and a bonding layer bonding the copper plate to the silicon nitride ceramic substrate, wherein the bonding layer has a first interface in contact with the silicon nitride ceramic substrate and a second interface in contact with the copper plate, and contains a nitride and a silicide of an active metal as at least one metal selected from the group consisting of titanium and zirconium, an atomic fraction of nitrogen of the bonding layer is greatest at the first interface and is smallest at the second interface, and a sum of atomic fractions of the active metal and silicon of the bonding layer is smallest at the first interface and is greatest at the second interface.
Method for producing a gas-tight metal-ceramic join and use of the gas-tight metal-ceramic join
A method for producing a gas-tight metal-ceramic join is disclosed. In an embodiment a method includes providing at least one ceramic main body having a first end face and a second end face, applying a metallization to at least a partial region of the end faces of the main body, applying a nickel layer to the metallized partial region of the end faces, applying a brazing paste to the metallized partial region of the first end face and/or the second end face of the main body, drying the brazing paste, and firing the brazing paste.
BONDING DISSIMILAR CERAMIC COMPONENTS
Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.