Patent classifications
C04B2237/60
COPPER/CERAMIC JOINED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC JOINED BODY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
There is provided a copper/ceramic bonded body of the present invention in which a copper member made of copper or a copper alloy and a ceramic member made of aluminum nitride or silicon nitride are bonded to each other, in which an active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramic member side between the copper member and the ceramic member, a Mg solid solution layer in which Mg is dissolved in a Cu matrix phase is formed between the active metal nitride layer and the copper member, and the active metal is present in the Mg solid solution layer.
Methods for joining ceramic components to form unitary ceramic components
Methods for forming a unitary ceramic component are provided. The method may include: positioning a braze reactant layer in a contact area between a first densified ceramic component and a second densified ceramic component; positioning a pack material around at least a portion of the first densified ceramic component or the second densified ceramic component; positioning at least one infiltrate source in fluid communication with the braze reactant layer; and thereafter, heating the at least one infiltrate source, the pack material, the first densified ceramic component, and the second densified ceramic component to a braze temperature that is at or above a melting point of at least one phase of the infiltrate composition such that at least one phase of infiltrate composition melts and flows into the braze reactant layer and reacts with a ceramic precursor compound therein to form a ceramic material.
Electrochemical energy storage devices
Provided herein are energy storage devices. In some cases, the energy storage devices are capable of being transported on a vehicle and storing a large amount of energy. An energy storage device is provided comprising at least one liquid metal electrode, an energy storage capacity of at least about 1 MWh and a response time less than or equal to about 100 milliseconds (ms).
Ceramic circuit substrate and method for producing ceramic circuit substrate
A ceramic circuit substrate according to the present invention includes a ceramic substrate, a copper circuit made of a copper-based material bonded, via a bonding layer, to a surface of the ceramic, and a copper heat sink made of the copper-based material bonded, via a bonding layer, to the other surface of the ceramic. The bonding layers each include a brazing material component including two or more kinds of metals, such as Ag, and an active metal having a predetermined concentration. The bonding layers each include a brazing material layer including the brazing material component, and an active metal compound layer containing the active metal. A ratio of a bonding area of the active metal compound layer in a bonding area of each of the bonding layers is 88% or more.
Polycrystalline diamond
An embodiment of a PCD insert comprises an embodiment of a PCD element joined to a cemented carbide substrate at an interface. The PCD element has internal diamond surfaces defining interstices between them. The PCD element comprises a masked or passivated region and an unmasked or unpassivated region, the unmasked or unpassivated region defining a boundary with the substrate, the boundary being the interface. At least some of the internal diamond surfaces of the masked or passivated region contact a mask or passivation medium, and some or all of the interstices of the masked or passivated region and of the unmasked or unpassivated region are at least partially filled with an infiltrant material.
METHOD FOR MAKING A BRAKING BAND OF A BRAKE DISC, METHOD FOR MAKING THE BRAKE DISC, BRAKE DISC, AND BRAKING BAND FOR BRAKE DISC
A method for making a braking band (2) for a brake disc (1) for a disc brake, comprising the following steps: a) preparing a mold (10) having an inner cavity (11), which comprises a first portion (11a) of a shape corresponding to the braking band (2) to be made; b) preparing a band preform (20) comprising a central preform (200), an upper outer preform (201) and a lower outer preform (202), said central preform (200) being made of porous ceramic material comprising silicon carbide (SiC), said upper outer preform (201) and lower outer preform (202) being made of porous ceramic material comprising silicon carbide (SiC) and infiltrated with silicon (SiC+Si), wherein a carbon barrier layer (201a, 200a, 200b, 202a) made of carbon is interposed between the upper outer preform (201) and the central preform (200) and between the lower outer preform (202) and the central preform (200), said preforms (200, 201, 202) having the shape of the braking band (2) to be made; c) placing said band preform (20) inside the mold at the first portion (11a) of said inner cavity (11); and d) injecting a liquid or semi-solid aluminum alloy inside the entire inner cavity (11) of the mold (11) to infiltrate the central preform (200) of said band preform (20) made of porous ceramic material with said aluminum alloy, obtaining at the first portion (11a) an aluminum metal matrix composite reinforced by said central preform (200) which defines the braking band (2) to be made. A braking band and a brake disc are made with at least the aforesaid method.
Method for manufacturing active metal-brazed nitride ceramic substrate with excellent joining strength
A method for manufacturing active metal-brazed a nitride ceramics substrate having excellent joining strength, includes: a step of preparing a mixed raw material; a step of forming a green sheet of the mixed raw material by a tape casting method; a step of removing a binder by performing degreasing; a step of performing sintering; a step of forming an aluminum nitride sintered substrate by performing gradual cooling; and a step of printing a conductive wiring pattern with active metal paste on the aluminum nitride sintered substrate.
SOEC System with Heating Ability
A Solid Oxide Electrolysis System has electrolytes with increased Area Specific Resistance, ASR yet is thin as compared to known electrolytes in the field, to obtain heating of the endothermic reducing process performed in the electrolysis cells directly where it is needed without any extra heating appliances or integrated heating elements, a simple efficient solution which does not increase the volume of the stack.
Method of manufacturing ceramic sintered body, ceramic sintered body, and ceramic heater
A method of manufacturing a ceramic sintered body, includes: a film forming step of forming, on a surface of a heat-resistant metal material, a metal coating film made of a metal material having a standard free energy of formation of metal carbides lower than that of the heat-resistant metal material; a molding step of disposing the heat-resistant metal material provided with the coating film in the film forming step at a predetermined position in powder that serves as a starting material of a ceramic base, and molding a ceramic green body by press-molding the powder; and a sintering step of generating a ceramic sintered body by sintering the ceramic green body molded in the molding step.
Method for producing a connection between two ceramic parts—in particular, of parts of a pressure sensor
A method for producing a connection between two surfaces or surface sections of two ceramic parts comprises: provision of a first ceramic part and of a second ceramic part; provision of an active brazing solder material on at least one surface section of at least one of the ceramic parts; and heating the active brazing solder in a vacuum brazing process. The whole active brazing solder material is provided for connecting the first and the second ceramic part by a sputtering method, wherein at least one surface section of at least one of the ceramic parts, preferably of the two ceramic parts, is layered with a layer sequence of individual components of the active brazing solder material, wherein the average strength of the layers of an individual component of the active brazing solder is no more than 0.5%, in particular not more than 0.2%, preferably not more than 0.1% and especially preferably not more than 0.05% of the strength of the joining region.