A ceramic-metal structure in which a metallic body (2) is inserted into or disposed above a through hole (4h) of a ceramic substrate (4) and which includes an annular pad layer (6) disposed around the through hole; an annular ring member (8) joined to the pad layer via a first brazing filler portion (10) and having a coefficient of thermal expansion smaller than that of the metallic body; a second brazing filler portion (12) intervening between the ring member and metallic body; and brazing filler flow prevention layers (7a, 7b) covering an outer surface of the pad layer so as to expose a central region (6c) of the outer surface of the pad layer facing the first brazing filler portion. The first brazing filler portion joins the central region and the ring member without projecting to a radially inner or outer side of the flow prevention layers.

A method for producing a gas sensor element (10), the gas sensor element including a diffusive porous layer (113) disposed in a measurement chamber (111) and exposed to the outside and a ceramic insulating layer (115) forming sidewalls of the measurement chamber. The method includes transferring green diffusive porous layer pieces (113x) cut in advance so as to have prescribed dimensions onto a first ceramic green sheet (110x); applying an insulating paste which later becomes the ceramic insulating layer to the first ceramic green sheet; laminating the first ceramic green sheet onto a second ceramic green sheet (120x) to form a ceramic laminate (200x); cutting the ceramic laminate along prescribed cutting lines C to obtain a plurality of gas sensor element pieces 10x; and firing the gas sensor element pieces.

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400 C. to about 700 C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400 C. to about 1,900 C. for up to 6 hours; and a cool down portion at a rate of up to 5/minute from a maximum sintering temperature down to about 1,000 C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.

A graphite article which can be compressed by more three (3%) percent at a contact pressure of 100 KPa or less without damaging the graphite article reducing the thermal impedance exhibited by the article. Also a graphite article comprising graphitized polymer having a thickness of at least 75 microns. Preferably the graphite has a density of less than 1.50 g/cc and a compressibility of more than 3% at a contact pressure of 100 KPa. Also the article has a generally sheet like shape. These articles may be used in a thermal management system to dissipate heat from a heat source.

The present disclosure relates to a multilayer ceramic substrate preparation method. The multilayer ceramic substrate preparation method according to the present disclosure includes firing a plurality of ceramic green sheets, to create a plurality of ceramic thin films; forming a via hall in each of the plurality of ceramic thin films; filling the via hall of the plurality of ceramic thin films with conductive paste, and heat treating the via hall filled with the conductive paste, to form a via electrode; printing a pattern on a cross section of each of the plurality of ceramic thin films, and heat treating the printed pattern, to form an inner electrode; applying a bonding agent on the cross section of each of the ceramic thin films excluding an uppermost ceramic thin film of the plurality of ceramic thin films; aligning and laminating each of the plurality of ceramic thin films such that each of the plurality of ceramic thin films is electrically connected through the via electrode and the inner electrode; and firing or heat treating the laminated plurality of ceramic thin films.

A gas turbine engine ceramic panel assembly includes a ceramic liner that has a slot and includes a hole. An insert is received in the slot and provides a female fastening element aligned with the hole. A method of manufacturing a ceramic panel assembly includes the steps of forming a ceramic liner with a slot, installing an insert into the slot, and securing the ceramic liner to a structure using a fastening assembly.

The present disclosure is directed to a method for forming a passage in a composite component. The method includes forming a cavity in a fiber preform. The cavity forms a portion of the passage. The method also includes inserting a core into the cavity and placing one or more fiber plies onto the fiber preform to form a fiber preform assembly. The method further includes thermally processing the fiber preform assembly and densifying the fiber preform assembly to form the composite component. The method also includes removing the core from the composite component.

A multilayer substrate that includes a first ceramic layer that is a dense body, a second ceramic layer that has open pores, and a resin layer adjacent the second ceramic layer, wherein a material of the resin layer is present in the open pores of the second ceramic layer.

A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.

A ceramic electrode comprising a support member as a mechanically stabilizing component, a dielectric layer having a thickness (D) which is less than or equal to 150 m, and an electrode layer.