A method of forming a composite component is provided. The method includes locating a fibrous preform, providing a slurry, mixing the slurry with sacrificial fibers, injecting the slurry into the fibrous preform, heating the fibrous preform, forming channels in the fibrous preform, and densifying the fibrous preform. The sacrificial fibers are suspended in the fibrous preform along an injection pathway such that heating the sacrificial fibers forms the channels along the injection pathway as the sacrificial fibers are burned away.

Ceramic matrix composite articles include, for example a first plurality of plies of ceramic fibers in a ceramic matrix defining a first extent, and a local at least one second ply in said ceramic matrix defining a second extent on and/or in said first plurality of plies with the second extent being less than said first extent. The first plurality of plies has a first property, the at least one second ply has at least one second property, and said first property being different from said at least one second property. The different properties may include one or more different mechanical (stress/strain) properties, one or more different thermal conductivity properties, one or more different electrical conductivity properties, one or more different other properties, and combinations thereof.

Electronic devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-titanium-tungsten-silicon oxide.

An improved method for embedding one or more sensors in SiC is provided. The method includes depositing a binder onto successive layers of a SiC powder feedstock to produce a dimensionally stable green body have a true-sized cavity. A sensor component is then press-fit into the true-sized cavity. Alternatively, the green body is printed around the sensor component. The assembly (the green body and the sensor component) is heated within a chemical vapor infiltration (CVI) chamber for debinding, and a precursor gas is introduced for densifying the SiC matrix material. During infiltration, the sensor component becomes bonded to the densified SiC matrix, the sensor component being selected to be thermodynamically compatible with CVI byproducts at elevated temperatures, including temperatures in excess of 1000? C.

In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

A composite green sheet includes a green sheet, and a bulk metal film provided on the green sheet. Examples of the metal forming the metal film may include aluminum, aluminum alloys, copper, copper alloy, or the like.

A process of producing a hot gas path turbine component. The process includes forming a void in a first ceramic matrix composite ply and forming a void in a second ceramic matrix composite ply. The second ceramic matrix composite ply is positioned on the first ceramic matrix composite ply such that the positioning aligns the voids to at least partially define a cavity in the component. A third ceramic matrix composite ply is positioned on the first ceramic matrix composite ply and the first ceramic matrix composite ply, the second ceramic matrix composite ply and the third ceramic matrix composite ply are densified to form a densified body. The cavity is present in the densified body. A ceramic matrix composite having cavities therein is also disclosed.

A method of producing a hermetic package of the present invention includes the steps of: preparing a ceramic base; preparing a glass cover; forming, on the glass cover, a sealing material layer having a total light transmittance in a thickness direction at a wavelength of laser light to be radiated of 10% or more and 80% or less; arranging the glass cover and the ceramic base so that the glass cover and the ceramic base are laminated on each other through intermediation of the sealing material layer; and irradiating the sealing material layer with the laser light from a glass cover side to soften and deform the sealing material layer, to thereby hermetically integrate the ceramic base and the glass cover with each other to obtain a hermetic package.

A multilayer ceramic substrate that includes a first layer positioned at a surface of the multilayer ceramic substrate, a second layer adjacent the first layer and positioned inward of the first layer, and a surface layer electrode disposed on a surface of the first layer. The first layer has a porosity of 13% or less and a maximum pore size of 10 m or less. The second layer has a porosity of 14% or less and a maximum pore size of 11 m or less.

One aspect relates to a composite, including a ceramic body having a first layer surface and a second layer surface and at least one cermet conductor that electrically connects the surfaces. The composite includes a first layer with the first layer surface, a first ceramic, a first hole and a first cermet element in the first hole, a second layer with the second layer surface, a second ceramic, a second hole and a second cermet element in the second hole, and an intermediate layer that is located between the first and the second layer. The intermediate layer includes an intermediate layer ceramic, an intermediate hole and one intermediate cermet element in the intermediate hole. A projection of the cross-section of the first hole and a projection of the cross section of the second hole onto a plane P.sub.x,y are arranged offset to each other.