C04B2237/62

Coil component and method for manufacturing coil component

A coil component includes a porous ceramic portion having pores, a coil portion embedded in the porous ceramic portion, and outer electrodes which are provided on an outer surface of the porous ceramic portion and electrically connected to the coil portion. The porous ceramic portion has a porosity of 10% by volume or more and 90% by volume or less (i.e., from 10% by volume to 90% by volume), and the pores are filled with a cured product of a resin composition containing a cycloaliphatic epoxy resin and an acid anhydride-based curing agent.

ARTICLES FOR CREATING HOLLOW STRUCTURES IN CERAMIC MATRIX COMPOSITES
20190071363 · 2019-03-07 ·

The present disclosure relates to a method of fabricating a ceramic composite components. The method may include providing at least a first layer of reinforcing fiber material which may be a pre-impregnated fiber. An additively manufactured component may be provided on or near the first layer. A second layer of reinforcing fiber, which may be a pre-impregnated fiber may be formed on top the additively manufactured component. A precursor is densified to consolidates at least the first and second layer into a densified composite, wherein the additively manufactured material defines at least one cooling passage in the densified composite component.

SILICA GLASS MEMBER, PROCESS FOR PRODUCING THE SAME, AND PROCESS FOR BONDING CERAMIC AND SILICA GLASS

The present invention relates to a silica glass member including: a main body including a silica glass and having a bonding part for bonding to another member; and a bonding film which is provided on the bonding part, has a thickness of 0.2 m to 10 m, and includes Au and a glass formed through melting of glass frit, in which the bonding film is produced from Au powder having an average particle diameter of 3 m or less and glass frit having a softening point of 850 C. or lower, a process for producing a silica glass member, and a process for bonding a ceramic and a silica glass.

Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Semiconductor Processing Applications
20190066980 · 2019-02-28 ·

A composite assembly of a relatively inexpensive ceramic, such as alumina, with a skin, or covering, of a high wear ceramic, such as sapphire, adapted to be used in semiconductor processing environments subjected to high levels of corrosion and/or erosion. The design life of the composite assembly may be significantly longer than previously used components. The composite assembly may have its ceramic pieces joined together with aluminum, such that the joint is not vulnerable to corrosive aspects to which the composite assembly may be exposed.

MONOLITHIC CERAMIC GAS DISTRIBUTION PLATE

A monolithic ceramic gas distribution plate for use in a process chamber wherein semiconductor substrates can be processed includes a monolithic ceramic body having an upper surface, a lower surface, and an outer cylindrical surface extending between the upper surface and the lower surface. The lower surface includes first gas outlets at uniformly spaced apart first locations and the first gas outlets are in fluid communication with first gas inlets in the upper surface by a first set of vertically extending through holes connecting the first gas inlets with the first gas outlets. The lower surface also includes second gas outlets at uniformly spaced second locations adjacent the first locations and the second gas outlets are in fluid communication with an inner plenum in the monolithic ceramic body by a second set of vertically extending through holes connecting the second gas outlets with the inner plenum. The inner plenum is in in fluid communication with a second gas inlet located in a central portion of the upper surface and the inner plenum is defined by an inner upper wall, an inner lower wall, an inner outer wall, and a set of pillars extending between the inner upper wall and the inner lower wall. Each through hole of the first set of vertically extending through holes passes through a respective one of the pillars to isolate the first and second gases.

DEVICES COMPRISING TRANSPARENT SEALS AND METHODS FOR MAKING THE SAME

Disclosed herein are methods for making a sealed device (200), the methods comprising positioning a sealing layer comprising at least one metal between a first glass substrate (201a) and a second substrate (201b) to form a sealing interface; and directing a laser beam operating at a predetermined wavelength onto the sealing interface to form at least one seal (207) between the first and second substrates and to convert the at least one metal to metal nanoparticles. Sealed devices having a seal comprising metal nanoparticles having a particles size of less than about 50 nm are also disclosed herein, as well as display devices comprising such sealed devices.

ADDITIVELY MANUFACTURED CASTING CORE-SHELL MOLD AND CERAMIC SHELL WITH VARIABLE THERMAL PROPERTIES

The present disclosure relates to a method of forming a cast component and a method of forming a casting mold. The method is performed by connecting at least one wax gate component to a ceramic core-shell mold. The ceramic core-shell mold includes at least a filter, first core portion, a first shell portion, and at least one first cavity between the core portion and the first shell portion. The core-shell mold may manufactured using an additive manufacturing process and may include an integrated ceramic filter. At least a portion of the ceramic core-shell mold and the wax gate component is coated with a second ceramic material. The wax gate component is then removed to form a second cavity in fluid communication with the first cavity.

EMBEDDING SENSORS IN 3D-PRINTED SILICON CARBIDE

An improved method for embedding one or more sensors in SiC is provided. The method includes depositing a binder onto successive layers of a SiC powder feedstock to produce a dimensionally stable green body have a true-sized cavity. A sensor component is then press-fit into the true-sized cavity. Alternatively, the green body is printed around the sensor component. The assembly (the green body and the sensor component) is heated within a chemical vapor infiltration (CVI) chamber for debinding, and a precursor gas is introduced for densifying the SiC matrix material. During infiltration, the sensor component becomes bonded to the densified SiC matrix, the sensor component being selected to be thermodynamically compatible with CVI byproducts at elevated temperatures, including temperatures in excess of 1000? C.

CERAMIC MATRIX COMPOSITES AND THEIR PREFORMS

A preform comprising a first sub-laminate comprising a plurality of layers and a second sub-laminate comprising a plurality of layers. The first sub-laminate comprises a first unit cell comprising a first volume fraction of tows, where the first volume fraction of tows comprise first tows having a first tow spacing between successive first tows. The second sub-laminate comprises a second unit cell comprising a second volume fraction of tows, where the second volume fraction of tows comprise second tows having a second tow spacing between successive second tows. The first volume fraction of tows in the first unit cell is equal to the second volume fraction of tows in the second unit cell. The second tow spacing is less than the first tow spacing.

POLYCRYSTALLINE DIAMOND COMPOSITE SHEET HAVING RIPPLE-SHAPED GRADIENT LAYER AND PREPARATION METHOD THEREOF

The disclosure relates to a polycrystalline diamond composite sheet having a ripple-shaped gradient layer and a preparation method thereof. The polycrystalline diamond composite sheet consists of a cemented carbide substrate, a ripple-shaped gradient layer of a multi-layer structure, and a polycrystalline diamond layer from bottom to top. In the ripple-shaped gradient layer, a content of polycrystalline diamond increases from bottom to top, and a content of cemented carbide decreases from bottom to top. In the ripple-shaped gradient layer, an amplitude of a ripple-shaped structure is 0.2 to 0.6 mm, a wavelength is 1 to 2 mm, a spacing between an upper ripple and a lower ripple of a top layer is set to a gradient of (t/2 to t) mm to t mm from a peak to a trough, and spacings between an upper ripple and a lower ripple of remaining layers are all t mm, wherein t is 0.05 to 0.4.