The disclosure relates to microchemical (or microfluidic) apparatus as well as related methods for making the same. The methods generally include partial sintering of sintering powder (e.g., binderless or otherwise free-flowing sintering powder) that encloses a fugitive phase material having a shape corresponding to a desired cavity structure in the formed apparatus. Partial sintering removes the fugitive phase and produces a porous compact, which can then be machined if desired and then further fully sintered to form the final apparatus. The process can produce apparatus with small, controllable cavities shaped as desired for various microchemical or microfluidic unit operations, with a generally smooth interior cavity finish, and with materials (e.g., ceramics) able to withstand harsh environments for such unit operations.

A ceramic electronic component that includes a plurality of ceramic layers which are stacked together, and an internal conductor layer disposed between two adjacent ceramic layers among the plurality of ceramic layers, and in which a ceramic layer that is adjacent to the internal conductor layer includes a plurality of pores.

A method of producing a ceramic matrix composite component. The method includes positioning a first plurality of ceramic matrix composite plies on top of one another, disposing a filler pack on the first plurality of ceramic matrix composite plies, and positioning a second plurality of ceramic matrix composite plies on top of the filler pack. One of the first plurality of ceramic composite plies or the second plurality of ceramic composite plies includes a bend angle, to define an interstice between the plurality of ceramic matrix composite plies with the filler pack disposed in the interstice. The filler pack includes one or more sacrificial fibers disposed therein, that subsequent to removal provide a functional feature, such as a cooling manifold in the filler pack. The method further includes forming one or more channels coupled to the one or more functional features for the flow of a cooling fluid therethrough. A ceramic matrix composite is also disclosed.

A method of manufacturing an electrostatic chuck includes: preparing a first ceramic plate having a first hole formed therein; preparing a second ceramic plate having a second hole formed at a position different from a position of the first hole in a horizontal direction; forming a first slurry layer on the first ceramic plate or the second ceramic plate with a first slurry, the first slurry layer having a flow path formed therein to connect the first hole and the second hole; stacking the first ceramic plate and the second ceramic plate one above the other via the first slurry layer, and bonding the first ceramic plate and the second ceramic plate stacked one above the other via the first slurry layer.

A method for forming a hole within a ceramic matrix composite component includes forming a first core portion for a ceramic matrix composite component; embedding a hollow member into the first core portion at a desired location; wrapping the first core portion with a first ceramic matrix composite material; inserting a rod through the hollow member and into the first core portion; removing the hollow member; assembling a second core portion to the first core portion such that the rod extends into the second core portion; and wrapping the first core portion and the second core portion with a second ceramic matrix composite material.

This patent document relates to systems, structures, devices, and fabrication processes for ceramic matrix composites suitable for use in a nuclear reactor environment and other applications requiring materials that can withstand high temperatures and/or highly corrosive environments. In one exemplary aspect, a method of joining and sealing ceramic structures is disclosed. The method comprises forming a joint of a ceramic structure and an end plug using a sealing material, wherein the end plug has a hole that goes through a top surface and a bottom surface of the end plug; filling the ceramic structure with a desired gas composition through the hole; heating a material into a molten form using a heat source; and directing the material into the hole, wherein the material solidifies to seal the end plug.

Methods of forming ceramic matrix composite structures include joining at least two lamina together to form a flexible ceramic matrix composite structure. Ceramic matrix composite structures include at least one region of reduced inter-laminar bonding at a selected location between lamina thereof. Thermal protection systems include at least one seal comprising a ceramic matrix composite material and have at least one region of reduced inter-laminar bonding at a selected location between lamina used to form the seal. Methods of forming thermal protection systems include providing one or more such seals between adjacent panels of a thermal protection system.

The invention provides a ceramic device enabling more complex, elaborate patterns for resistance heating elements or electrodes. A ceramic device includes a ceramic substrate consisting of a ceramic sintered body and including at least a base layer, an intermediate layer laminated over the base layer, and an overlayer laminated over the intermediate layer; and an electrifiable resistance heating element or electrode having a predetermined pattern extending in a planar shape and being embedded in the ceramic substrate. A horizontal surface is defined in the upper surface of the intermediate layer, along which the resistance heating element or electrode is arranged, and the overlayer is laminated onto the upper surface of the intermediate layer to cover the resistance heating element or electrode.

A multilayer ceramic substrate that includes a first layer positioned at a surface of the multilayer ceramic substrate, a second layer adjacent the first layer and positioned inward of the first layer, and a surface layer electrode disposed on a surface of the first layer. The first layer has a porosity of 13% or less and a maximum pore size of 10 μm or less. The second layer has a porosity of 14% or less and a maximum pore size of 11 μm or less.

A shower plate according to the present disclosure includes a ceramic sintered body, the ceramic sintered body comprising a first surface, a second surface facing the first surface, and a through hole positioned between the first surface and the second surface. An inner surface of the through hole includes a protruding crystal grain which protrudes more than an exposed part of a grain boundary phase existing between crystal grains. In addition, a semiconductor manufacturing apparatus according to the present disclosure includes the shower plate mentioned above.