The disclosure relates to microchemical (or microfluidic) apparatus as well as related methods for making the same. The methods generally include partial sintering of sintering powder (e.g., binderless or otherwise free-flowing sintering powder) that encloses a fugitive phase material having a shape corresponding to a desired cavity structure in the formed apparatus. Partial sintering removes the fugitive phase and produces a porous compact, which can then be machined if desired and then further fully sintered to form the final apparatus. The process can produce apparatus with small, controllable cavities shaped as desired for various microchemical or microfluidic unit operations, with a generally smooth interior cavity finish, and with materials (e.g., ceramics) able to withstand harsh environments for such unit operations.

A fiber-reinforced component for use in a gas turbine engine includes a first braided fiber sleeve forming a cooling channel and a plurality of fiber plies enclosing the first braided fiber sleeve, with the plurality of fiber plies forming first and second walls separated by the first braided fiber sleeve. The fiber-reinforced component further includes a matrix material between fibers of the braided fiber sleeve and the plurality of fiber plies.

A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.

The disclosure relates to microchemical (or microfluidic) apparatus as well as related methods for making the same. The methods generally include partial sintering of sintering powder (e.g., binderless or otherwise free-flowing sintering powder) that encloses a fugitive phase material having a shape corresponding to a desired cavity structure in the formed apparatus. Partial sintering removes the fugitive phase and produces a porous compact, which can then be machined if desired and then further fully sintered to form the final apparatus. The process can produce apparatus with small, controllable cavities shaped as desired for various microchemical or microfluidic unit operations, with a generally smooth interior cavity finish, and with materials (e.g., ceramics) able to withstand harsh environments for such unit operations.

A method is provided in which multiple layers are formed. Each of the layers includes at least a first set of ceramic fibers and a second set of ceramic fibers. The first set is arranged at an angle with respect to the second set. The first set and the second set define a plurality of pores therebetween. The layers are arranged on top of each other to form a porous preform. The pores of the layers arranged on top of each other are aligned. The pores define a plurality of channels extending continuously through the porous preform from a first side of the porous preform to a second side of the porous preform. Each channel comprises one inlet at the first side of the porous preform and one outlet at the second side of the porous preform. The porous preform is infiltrated with a matrix material.

An aluminum nitride sintered body for use in a semiconductor manufacturing apparatus is provided. The aluminum nitride sintered body exhibits, in a photoluminescence spectrum thereof in a wavelength range of 350 nm to 700 nm obtained with 250 nm excitation light, a highest emission intensity peak within a wavelength range of 580 nm to 620 nm.

A ferrite sheet manufacturing method according to the present invention includes (1) stacking a plurality of molded ferrite sheets to prepare a ferrite stack having gas discharge passages between adjacent molded ferrite sheets, and (2) sintering the ferrite stack. According to the present invention, productivity can be increased, and manufacturing costs can be reduced. In addition, a gas generated during combustion of a binder can be discharged using a gas discharge passage between repeatedly uneven portions disposed in one direction, thereby preventing wrinkles or waviness generated in a peripheral portion of a ferrite sheet. Furthermore, since it is possible to improve durability and reliability of an electromagnetic wave shielding material manufactured using the ferrite sheet, the ferrite sheet can be applied to various electronic products.

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400 C. to about 700 C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400 C. to about 1,900 C. for up to 6 hours; and a cool down portion at a rate of up to 5/minute from a maximum sintering temperature down to about 1,000 C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.

A method for producing a metal-ceramic substrate with electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500 C. in which the copper oxide forms a copper body in the holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.

A method for forming a ceramic matrix composite (CMC) component with an internal cooling channel includes forming a first fiber member, forming a first depression in a surface of the first fiber member, covering the first depression with a second fiber member to form a near-net shape fiber preform of a component with an internal channel defined in part by the first depression, and densifying the fiber preform.