Implementations of semiconductor packages may include a metallic baseplate, a first insulative layer coupled to the metallic baseplate, a first plurality of metallic traces, each metallic trace of the first plurality of metallic traces coupled to the electrically insulative, one or more semiconductor devices coupled to each one of the first plurality of metallic traces, a second plurality of metallic traces coupled to the one or more semiconductor devices, and a second insulative layer coupled to the metallic traces of the second plurality of metallic traces.

Systems and methods provide for forming layered structures. Textured tapes may be fabricated, having cast and/or embossed patterns that provide for desired flow characteristics in an assembly of stacked, rolled, and/or otherwise assembled tapes. In some cases, shear thinning materials may be formed into textured tapes using localized shear stress to induce shear thinning during a pattern formation. A pattern may be maintained after removal of the shear force due to the high viscosity of the material at low shear stress.

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

A shock absorbing member 50 having a ceramic bonded body 15 having: a plurality of first sheet-like members 5 each having a ceramic containing 60 mass % or more of boron carbide and each having a thickness of 0.1 to 50 mm; and a bonding layer arranged between the first sheet-like members 5 adjacent to each other, the bonding layer bonding surfaces to be bonded facing each other of the first sheet-like members adjacent to each other, wherein the bonding layer has a bonding material containing at least one metal selected from the group consisting of aluminum, copper, silver, and gold.

A method of manufacturing a conversion element is disclosed. A precursor material is selected from one or more of lutetium, aluminum and a rare-earth element. The precursor material is mixed with a binder and a solvent to obtain a slurry. A green body is formed from the slurry and the green body is sintered to obtain the conversion element. The sintering is performed at a temperature of more than 1720° C.

The present invention provides a zirconia sintered body that has less excess material to be removed when making a prosthesis by milling, providing a reduction of work time, more durability for a working tool, and a faster treatment for patients, and that undergoes little deformation during firing, and provides enhanced aesthetics. The present invention relates to a columnar zirconia sintered body having a base and a side face, the base having a surface shape that is neither square nor rectangular but has at least one straight portion.

A wiring substrate includes an insulating substrate, a conductor layer and an interlayer. The insulating substrate contains AlN. The conductor layer contains Cu. The interlayer is located between the insulating substrate and the conductor layer. In the interlayer, between a first region near the insulating substrate and a second region near the conductor layer, Cu concentration is higher in the second region than in the first region, and Al concentration is higher in the first region than in the second region.

A configuration for joining a ceramic layer has a thermal insulating material to a metallic layer. The configuration includes an interface layer made of metallic material located between the ceramic layer and the metallic layer, which includes a plurality of interlocking elements on one of its sides, facing the ceramic layer, the ceramic layer comprising a plurality of cavities aimed at connecting with the corresponding interlocking elements of the interface layer. The configuration also includes a brazing layer by means of which the interface layer is joint to the metallic layer. The invention also refers to a method for obtaining such a configuration.

A ceramic matrix composite seal is disclosed. The ceramic matrix composite seal including a ceramic matrix and a number of ceramic fiber fabrics embedded in the ceramic matrix. The ceramic matrix composite seal is formed into a strip with a desired geometry such that the seal strip is configured to be assembled with a number of components to create a seal between the components.

The invention concerns an article (20) formed of a ceramic matrix composite structure having a plurality of ceramic fiber layers (22) and a binder material (24) interspersed throughout said layers. The ceramic matrix composite material may be sintered. The ceramic fiber layers undulate relative to one or more outer surfaces (38;40) of the article. Thus support features (48) within the article are able to share a load in use between a plurality of layers. The invention may be suited to engine components such as turbine seal segments in a gas turbine engine.