C04B2237/70

METHOD FOR PRODUCING METAL/CERAMIC CIRCUIT BOARD

After a copper plate 14 is bonded to at least one surface of a ceramic substrate 10 via an active metal containing brazing filler metal 12 which contains silver, the unnecessary portion of the copper plat 14 and active metal containing brazing filler metal 12 is removed, and thereafter, an unnecessary portion of the copper plate 14 is removed by chemical polishing so as to cause the active metal containing brazing filler metal 12 to protrude from the side face portion of the copper plate 14, and then, a silver layer 18 adhered to the surface of the copper plate 14 by the chemical polishing is removed.

Ceramic circuit substrate and its production method

A method for producing a ceramic circuit substrate comprising the steps of forming brazing regions each comprising brazing material powder and an organic binder on a ceramic substrate; setting metal plates on the ceramic substrate via the brazing regions, and heating the ceramic substrate, the brazing regions and the metal plates to bond the metal plates to the ceramic substrate via brazing layers made of the brazing material, thereby forming a bonded body; and cleaning the bonded body with a hypochlorite-containing agent.

WAVELENGTH CONVERSION MEMBER AND LIGHT-EMITTING DEVICE
20180180975 · 2018-06-28 ·

Provided is a wavelength conversion member that can reduce strain under stress occurring at the interface between a substrate and a phosphor layer and is therefore less susceptible to breakage during use. The wavelength conversion member 1 comprises a substrate 10 and a phosphor layer 20 bonded on the substrate 10, the phosphor layer 20 including inorganic phosphor powder 22 dispersed in a glass matrix 21. In a temperature range of 30? C. to a setting point of the phosphor layer 20, a relation ?10?10.sup.?7?(?.sub.1??.sub.2)?10?10.sup.?7 (/? C.) is satisfied where ?.sub.1 represents a coefficient of thermal expansion of the substrate 10 and ?.sub.2 represents a coefficient of thermal expansion of the phosphor layer 20. The setting point is defined by Tf?(Tf?Tg)/3 (where Tg represents a glass transition point and Tf represents a deformation point).

Method for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic Substrate
20180093927 · 2018-04-05 ·

A method for producing a metal-ceramic substrate includes attaching a metal layer to a surface side of a ceramic layer, the metal layer being structured into a plurality of metallization regions respectively separated from one another by at least one trench-shaped intermediate space to form conductive paths and/or connective surfaces and/or contact surfaces. The method further includes filling the at least one trench-shaped intermediate space with an electrically insulating filler material, and covering first edges of the metallization regions facing and adjoining the surface side of the ceramic layer in the at least one trench-shaped intermediate space, as well as at least one second edge of the metallization regions facing away from the surface side of the ceramic layer in the at least one trench-shaped intermediate space, by the electrically insulating filler material.

LITHIUM TANTALATE SINGLE CRYSTAL SUBSTRATE, BONDED SUBSTRATE, MANUFACTURING METHOD OF THE BONDED SUBSTRATE, AND SURFACE ACOUSTIC WAVE DEVICE USING THE BONDED SUBSTRATE

The lithium tantalate single crystal substrate is a rotated Y-cut LiTaO.sub.3 single crystal substrate having a crystal orientation of 36 Y-49 Y cut characterized in that: the substrate is diffused with Li from its surface into its depth such that it has a Li concentration profile showing a difference in the Li concentration between the substrate surface and the depth of the substrate; and the substrate is treated with single polarization treatment so that the Li concentration is substantially uniform from the substrate surface to a depth which is equivalent to 5-15 times the wavelength of either a surface acoustic wave or a leaky surface acoustic wave propagating in the LiTaO.sub.3 substrate surface.

Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method

A copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of an aluminum nitride, wherein, the copper member and the ceramic member are bonded to each other, and a Mg solid solution layer is provided between the copper member and the ceramic member and contains Mg in a state of a solid solution in a Cu primary phase.

Method for producing inorganic fiber-bonded ceramic material

Provided is a method for producing an inorganic fiber-bonded ceramic material, which can produce, at a high yield, an inorganic fiber-bonded ceramic material with fewer defects, and with an end part and a central part equivalent to each other in microstructure and mechanical properties, and also makes it possible to increase the ceramic material in size. The method for producing an inorganic fiber-bonded ceramic material is characterized in that it includes: a first pressing step of setting, in a carbon die, a laminate to be surrounded by a ceramic powder, the laminate obtained by stacking a coated inorganic fiber shaped product including an inorganic fiber part of inorganic fibers that have a pyrolysis initiation temperature of 1900 C. or lower, and a surface layer of an inorganic substance for bonding the inorganic fibers to each other, and pressing the laminate at a temperature of 1000 to 1800 C. and a pressure of 5 to 50 MPa in an inert gas atmosphere; and a second pressing step of pressing a ceramic coated laminate obtained in the first pressing step at a temperature of 1600 to 1900 C., which is higher than that in the first pressing step, and at a pressure of 5 to 100 MPa in an inert gas atmosphere.

Layered deposition for reactive joining of composites

A method including applying layers of multiple constituents where the constituents are capable of producing a non-equilibrium condition on the contacting surfaces of a ceramic matrix composite component and a gas turbine engine component where one outer coating includes a first constituent and the other outer coating includes a second constituent; forming a component assembly with the ceramic matrix composite component coupled to the gas turbine engine component with contact between the outer coatings; adding an energy to facilitate an equilibrium reaction between the first constituent of the first outer coating and the second constituent of the second outer coating; and as a result of adding the energy, forming a bond structure in the component assembly with a product of the equilibrium reaction where the bond structure affixes the ceramic matrix composite component to the gas turbine engine component between the first constituent and the second constituent.

MULTILAYER CERAMIC CAPACITOR

A multilayer ceramic capacitor that includes a laminate which has a plurality of dielectric layers and a plurality of internal electrode layers respectively laminated. The dielectric layers are a perovskite type structure containing Ba, Sr, Zr, Ti and Hf, and optionally Ca, and further include V, wherein (number of moles of Sr)/(number of moles of Ba+number of moles of Ca+number of moles of Sr) is 0.6 to 0.95, (number of moles of Zr)/(number of moles of Zr+number of moles of Ti+number of moles of Hf) is 0.9 to 0.98, thicknesses of the dielectric layers are 1 m or less, and an average particle size of dielectric particles constituting the dielectric layers is 0.8 m or less.

Continuous fiber-reinforced silicon carbide member, manufacturing method thereof, and nuclear reactor structural member

There are provided a continuous fiber-reinforced silicon carbide member and the like which allow sufficient improvement in a mechanical property and environmental resistance. The continuous fiber-reinforced silicon carbide member of an embodiment is a tubular shape and has a first composite material layer and a second composite material layer. In the first composite material layer, continuous fibers of silicon carbide are combined with a matrix of silicon carbide. In the second composite material layer, continuous fibers of carbon are combined with a matrix of silicon carbide. Then, the first composite material layer and the second composite material layer are stacked.