Use of highly oriented graphite including graphite layers placed on top of one another and containing only a small amount of water allows for production of an electronic device that includes, as an element, highly oriented graphite in which no delamination occurs, that is highly reliable in use, and that has a good heat dissipation capability.

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

Implementations of semiconductor packages may include a metallic baseplate, a first insulative layer coupled to the metallic baseplate, a first plurality of metallic traces, each metallic trace of the first plurality of metallic traces coupled to the electrically insulative, one or more semiconductor devices coupled to each one of the first plurality of metallic traces, a second plurality of metallic traces coupled to the one or more semiconductor devices, and a second insulative layer coupled to the metallic traces of the second plurality of metallic traces.

A composite has a) a PMC layer, and b) a tile layer comprising a plurality of Ox/Ox CMC tiles each has: i) a central portion, ii) an outer portion disposed surrounding the central portion, the bottom surface of the outer portion is disposed flush with the bottom surface of the central portion, the tile layer forms a smooth continuous top surface and a smooth continuous bottom surface, and the tiles are disposed with respect to one another such that each tile is inverted with respect to an adjoining tile, and iii) one or more overlap joints formed by the overlapping of the outer portions of adjoining tiles, so that hot gases entering the smooth top surface of the tile layer between abutting outer and central periphery segments must travel laterally between the overlapping outer portions of adjoining tiles to reach the top surface of the PMC layer.

Use of highly oriented graphite including graphite layers placed on top of one another and containing only a small amount of water allows for production of an electronic device that includes, as an element, highly oriented graphite in which no delamination occurs, that is highly reliable in use, and that has a good heat dissipation capability.

The disclosure provides seals for devices that operate at elevated temperatures and have reactive metal vapors, such as lithium, sodium or magnesium. In some examples, such devices include energy storage devices that may be used within an electrical power grid or as part of a standalone system. The energy storage devices may be charged from an electricity production source for later discharge, such as when there is a demand for electrical energy consumption.

A vessel comprises a ceramic body and a glass bottom. The glass bottom is formed of a first glass portion and a second glass portion which are fused together.

Ceramic welding methods and welded articles are disclosed. The present disclosure shows that transparent and diffuse ceramics can be successfully joined using lasers. The diffuse ceramic welding can be aided by introducing a small gap for optical penetration while no gap is necessary in the transparent ceramics case. Laser welding is more versatile on transparent ceramics since one can focus through the material allowing the joining of more complex geometries and over multiple interaction zones, increasing the ultimate weld volumes.

A skin assembly that includes a first ceramic-matrix-composite skin panel including one or more first fingers extending along a first direction. The skin assembly further includes a second ceramic-matrix-composite skin panel including one or more second fingers extending along the first direction. The one or more second fingers interdigitated with the one or more first fingers to define a plurality of staggered expansion gaps between the first ceramic-matrix-composite skin panel and the second ceramic-matrix-composite skin panel wherein the plurality of staggered expansion gaps are configured to accommodate thermal expansion of at least a portion of the skin assembly.

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.