C04B2237/84

HIGH OPTICAL POWER LIGHT CONVERSION DEVICE USING A PHOSPHOR ELEMENT WITH SOLDER ATTACHMENT

A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

CERAMIC MATRIX COMPOSITE COMPONENT HAVING LOW DENSITY CORE AND METHOD OF MAKING
20230250726 · 2023-08-10 ·

Disclosed is a ceramic matrix component having a fibrous core and a ceramic matrix composite shell surrounding at least a portion of the fibrous core. The ceramic matrix composite shell comprises a fibrous preform. The fibrous core has a greater porosity than the fibrous preform. A method of making the ceramic matrix component is also disclosed.

Rotor assembly with internal vanes
11339673 · 2022-05-24 · ·

A rotor assembly is provided for a gas turbine engine. This rotor assembly includes a first rotor disk, a second rotor disk, a plurality of rotor blades and a plurality of vanes. The first rotor disk is configured to rotate about a rotational axis. The first rotor disk is configured from or otherwise includes disk material. The second rotor disk is configured to rotate about the rotational axis. The rotor blades are arranged circumferentially around the rotational axis. Each of the rotor blades is axially between and mounted to the first rotor disk and the second rotor disk. The vanes are arranged circumferentially around the rotational axis and axially between the first rotor disk and the second rotor disk. The vanes include a first vane, which first vane is configured from or otherwise includes vane material that is different than the disk material.

MODIFIED SCHEELITE MATERIAL FOR CO-FIRING

Disclosed herein are embodiments of low temperature co-fireable scheelite materials which can be used in combination with high dielectric materials, such as nickel zinc ferrite, to form composite structures, in particular for isolators and circulators for radiofrequency components. In some embodiments, the scheelite material can include aluminum oxide for temperature expansion regulation.

Low temperature co-fireable dielectric materials

Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example barium tungstate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.

MODIFIED BARIUM TUNGSTATE FOR CO-FIRING

Disclosed herein are embodiments of low temperature co-fireable barium tungstate materials which can be used in combination with high dielectric materials, such as nickel zinc ferrite, to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the material can include flux, such as bismuth vanadate, to reduce co-firing temperatures.

LOW TEMPERATURE CO-FIREABLE DIELECTRIC MATERIALS

Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example barium tungstate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.

Semiconductor substrate support with multiple electrodes and method for making same

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

Repair and/or reinforcement of oxide-oxide CMC

In some examples, techniques of repairing and/or reinforcing oxide-oxide ceramic matrix composite (CMC) materials using a metallic material. In one example, a method including applying a metallic material at an edge of an oxide-oxide CMC substrate; and heating the metallic material to diffuse the metal material into the oxide-oxide CMC substrate at the edge. In another example, a method including applying a metallic material onto a damaged area of the oxide-oxide CMC; applying a reinforcing phase material onto the damaged area of the oxide-oxide CMC; and heating the metallic material to diffuse the metallic material into the oxide-oxide CMC and attach the reinforcing phase material to the damaged area of the oxide-oxide CMC.

GAS INJECTION NOZZLE REFRACTORY AND GAS INJECTION NOZZLE

A gas injection nozzle refractory with one or more gas injection small metal tubes buried therein has improved durability. The gas injection nozzle refractory includes a MgO-C central refractory with a small metal tube buried therein, and a MgO-C peripheral refractory surrounding the central refractory. The central refractory on a plane of the gas injection nozzle refractory has an external shape of a circle with a radius in the range of R+10 to R+150 mm concentric with a virtual circle with a minimum radius surrounding all buried small metal tubes, R mm being a radius of the virtual circle.