It is an object of the present disclosure to provide a thin-film carbon foam and a method of manufacture the same. It is another object of the present disclosure to provide a stack carbon foam having fewer through holes and a method of manufacturing the same. The carbon foam of the present disclosure is, for example, a stack carbon foam being a stack of at least two monolayer carbon foams stacked one another, each monolayer carbon foam comprising linear portions and node portions joining the linear portions, or a carbon foam comprising linear portions and node portions joining the linear portions, wherein the ratio of the number of large through holes having a diameter of 1 mm or more to the surface area of the carbon foam is 0.0003/mm.sup.2 or less.

Fused, monolithic 3-D products of high-SiO2-containing body materials, called FHD/S, cut to pattern, mating surfaces honed or polished, assembled with mating surfaces in contact, and fusion fired until the contacting parts fuse without added flux. Fused FHD/S products may be used unglazed, or glaze may be applied to selected fused surfaces and then glaze fired. FHD/S body materials may include colorants so that the fused parts exhibit color contrast and variation when used without glazing. Examples include countertops having integral fused vertical back-splashes and front edges, and bowls fused to openings. The inventive 3-D monolithic fused FHD/S products are produced in standard sizes or as custom-fit interior and exterior products that are stain resistant, moisture impervious, UV resistant, acid resistant, dimensionally stable, abrasion and impact resistant, and may be glazed to produce unique decorative and utilitarian surfaces in a wide range of colors and textures, including artistic, one-of-a-kind 3-D works.

A method of preparing a ceramic matrix composite (CMC) component that includes a protective ceramic layer comprises adhering at least one flexible ceramic tape to a ceramic fiber preform, where the at least one flexible ceramic tape comprises ceramic particles dispersed in an organic binder phase. After the adhering, the at least one flexible ceramic tape is heated to a temperature sufficient to volatilize the organic binder phase, thereby forming a porous ceramic layer on at least a portion of the ceramic fiber preform. After the heating and volatilizing, the ceramic fiber preform and the porous ceramic layer are infiltrated with a molten material, thereby forming a CMC component including, on at least a portion thereof, a protective ceramic layer.

A member for a semiconductor manufacturing apparatus includes a ceramic plate having an upper surface serving as a wafer mounting surface and incorporating an electrode, a ceramic dense plug disposed adjacent to a lower surface side of the ceramic plate and ceramic-bonded to the ceramic plate by a ring-shaped joint portion, a metal cooling plate joined to the lower surface of the ceramic plate in a portion other than the ring-shaped joint portion, and a gas flow channel. The gas flow channel includes a gas discharge hole that passes completely through the ceramic plate in the thickness direction of the ceramic plate and an internal gas flow channel that passes from the upper surface to the lower surface of the dense plug while winding through the dense plug. The gas flow channel passes inside of an inner periphery of the joint portion.

A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.

According to one embodiment, a method for manufacturing a ceramic circuit board is disclosed. The ceramic circuit board includes a copper plate bonded to at least one surface of a ceramic substrate via a brazing material layer including Ag, Cu, and a reactive metal. The method includes: preparing a ceramic circuit board in which a copper plate is bonded on a ceramic substrate via a brazing material layer, and a portion of the brazing material layer is exposed between a pattern shape of the copper plate; a first chemical polishing process of chemically polishing the portion of the brazing material layer; and a first brazing material etching process of etching the chemically polished portion of the brazing material layer by using an etchant having a pH of 6 or less and including one type or two types selected from hydrogen peroxide and ammonium peroxodisulfate.

A turbine blade with a ceramic thermal barrier coating system has a substrate designed as a blade platform and as a blade airfoil. On the substrate is a first ceramic layer as a thermal barrier coating, which protects the substrate in the exposed high temperature region and there is locally an increase of the thermal barrier coating for locally reinforcing the thermal barrier. The increase includes a material that is different from the material of the first ceramic layer. The local reinforcement is arranged over the first ceramic layer, without the first ceramic layer having a reduced layer thickness. The local reinforcement is provided at most on 30% of the area of the blade airfoil and is arranged close to a platform extending over the entire pressure side in the direction of flow and with an extent thereto in the radial direction of the blade airfoil is at most 30%.

A ceramic-metal structure in which a metallic body (2) is inserted into or disposed above a through hole (4h) of a ceramic substrate (4) and which includes an annular pad layer (6) disposed around the through hole; an annular ring member (8) joined to the pad layer via a first brazing filler portion (10) and having a coefficient of thermal expansion smaller than that of the metallic body; a second brazing filler portion (12) intervening between the ring member and metallic body; and brazing filler flow prevention layers (7a, 7b) covering an outer surface of the pad layer so as to expose a central region (6c) of the outer surface of the pad layer facing the first brazing filler portion. The first brazing filler portion joins the central region and the ring member without projecting to a radially inner or outer side of the flow prevention layers.

A power module substrate includes an insulating substrate and a metal plate. The metal plate is joined to the insulating substrate with a brazing material in between. As to surface roughness of a lateral surface of the metal plate in a thickness direction, the surface roughness of at least a corner part farthest from a center of the metal plate in plan view is larger than the surface roughness of plane parts sandwiching the corner part.

A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction.