Patent classifications
C04B2237/86
Graphene and polymer-free method for transferring CVD grown graphene onto hydrophobic substrates
Described herein are methods for improved transfer of graphene from formation substrates to target substrates. In particular, the methods described herein are useful in the transfer of high-quality chemical vapor deposition-grown monolayers of graphene from metal, e.g., copper, formation substrates via non-polymeric methods. The improved processes provide graphene materials with less defects in the structure.
Patterned abradable coating and methods for the manufacture thereof
A ceramic article includes a flexible backing selected from paper, woven fabric, non-woven fabric, polymeric films, metal foils, and combinations thereof. A green ceramic layer is on a first side of the flexible backing, wherein the green ceramic layer includes a ceramic material and a polymeric binder. A major surface of the green ceramic layer includes a pattern of features.
Ceramic matrix composite gas turbine engine blade
The disclosure describes a gas turbine engine blade that includes a dovetail portion comprising a first ceramic matrix composite, an airfoil portion comprising the first ceramic matrix composite, a transition portion between the airfoil portion and the dovetail portion, and a platform portion that substantially surrounds the transition portion. The airfoil portion may define a capture feature that is configured to engage with and mechanically restrain the platform portion from moving beyond the capture feature toward a tip of the airfoil portion.
ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
There is provided an aluminum-ceramic bonded substrate in which an aluminum plate comprising aluminum alloy is directly bonded to one surface of a ceramic substrate and an aluminum base plate comprising aluminum alloy is directly bonded to the other surface of the ceramic substrate, wherein the aluminum alloy is the aluminum alloy containing 0.05% by mass or more and 3.0% by mass or less of at least one element selected from nickel and iron in total amount, containing 0.01% by mass or more and 0.1% by mass or less of at least one element selected from titanium and zirconium in total amount, and containing 0% by mass or more and 0.05% by mass or less of at least one element selected from boron or carbon in total amount, with a balance being aluminum.
Power module substrate and power module
A power module substrate 10 is provided with: an insulating substrate 1; and a metal sheet 2 that is joined to the insulating substrate 1 via a brazing material 3, wherein regarding the surface roughness, in the thickness direction, of the lateral surface of the metal sheet 2, the surface roughness of a corner 2a farthest from the center of the metal sheet 2 is larger than the surface roughness of plane parts 2b, which bound the corner, in at least a plan view. Also provided is a power module 100 which is formed by mounting an electronic component 40 on this power module substrate 10.
SILICA GLASS MEMBER, PROCESS FOR PRODUCING THE SAME, AND PROCESS FOR BONDING CERAMIC AND SILICA GLASS
The present invention relates to a silica glass member including: a main body including a silica glass and having a bonding part for bonding to another member; and a bonding film which is provided on the bonding part, has a thickness of 0.2 m to 10 m, and includes Au and a glass formed through melting of glass frit, in which the bonding film is produced from Au powder having an average particle diameter of 3 m or less and glass frit having a softening point of 850 C. or lower, a process for producing a silica glass member, and a process for bonding a ceramic and a silica glass.
COPPER-CERAMIC SUBSTRATE, COPPER PRECURSOR FOR PRODUCING A COPPER-CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING A COPPER-CERAMIC SUBSTRATE
The present invention relates to a copper ceramic substrate incorporating a ceramic carrier, and a copper layer joined to a surface of the ceramic carrier, wherein the copper layer incorporates at least one first layer, which faces the ceramic carrier and has an average first grain size, and a second layer, which is arranged on the face of the copper layer facing away from the ceramic carrier and has an average second grain size, the second grain size being smaller than the first grain size.
THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS
Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.
Ceramic circuit board and electronic device
A ceramic circuit board includes a ceramic substrate, a first metal plate bonded to a front surface of the ceramic substrate, and a member bonded to a front surface side of the metal plate. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the first metal plate, and which exhibits a higher Young's modulus than that of the first metal plate.
LOCAL TWO-LAYER THERMAL BARRIER COATING
A turbine blade with a ceramic thermal barrier coating system has a substrate designed as a blade platform and as a blade airfoil. On the substrate is a first ceramic layer as a thermal barrier coating, which protects the substrate in the exposed high temperature region and there is locally an increase of the thermal barrier coating for locally reinforcing the thermal barrier. The increase includes a material that is different from the material of the first ceramic layer. The local reinforcement is arranged over the first ceramic layer, without the first ceramic layer having a reduced layer thickness. The local reinforcement is provided at most on 30% of the area of the blade airfoil and is arranged close to a platform extending over the entire pressure side in the direction of flow and with an extent thereto in the radial direction of the blade airfoil is at most 30%.