The disclosure relates to a reversible adhesive composition including a copolymer between a vinyl spacer monomer unit and a vinyl reversible binder monomer unit. Each monomer unit can be based on acrylate monomer, a vinyl ester monomer, or a vinyl ether monomer, with the spacer monomer unit generally having a shorter pendant chain (such as 1-3 carbon atoms) and the reversible binder monomer unit having a longer pendant chain (such as 3-20 carbon atoms). A corresponding article includes first and second surfaces (or substrates) that are in contact with and bonded to the reversible adhesive composition at an interface therebetween. The reversible adhesive composition generally involves non-covalent and/or non-ionic bonding forces, for example H-bonding, permanent dipole, electron donor-acceptor moieties, and/or van der Waals forces, between the copolymer chains. The first and second surfaces can be repeatedly bonded, separated, and re-bonded while retaining the adhesive strength of the reversible adhesive composition.

The disclosure relates to a reversible adhesive composition including a copolymer between a vinyl spacer monomer unit and a vinyl reversible binder monomer unit. Each monomer unit can be based on acrylate monomer, a vinyl ester monomer, or a vinyl ether monomer, with the spacer monomer unit generally having a shorter pendant chain (such as 1-3 carbon atoms) and the reversible binder monomer unit having a longer pendant chain (such as 3-20 carbon atoms). A corresponding article includes first and second surfaces (or substrates) that are in contact with and bonded to the reversible adhesive composition at an interface therebetween. The reversible adhesive composition generally involves non-covalent and/or non-ionic bonding forces, for example H-bonding, permanent dipole, electron donor-acceptor moieties, and/or van der Waals forces, between the copolymer chains. The first and second surfaces can be repeatedly bonded, separated, and re-bonded while retaining the adhesive strength of the reversible adhesive composition.

The invention relates to a process for the chromatographic purification of a starting stream containing ammonium sulfate and 2-hydroxy-2-methylpropionic acid, comprising: passage of the starting stream through a bed of stationary phase; elution of a raffinate enriched in ammonium sulfate and depleted in 2-hydroxy-2-methylpropionic acid; and elution of an extract enriched in 2-hydroxy-2-methylpropionic acid and depleted in ammonium sulfate.

The disclosure relates to a reversible adhesive composition including a copolymer between a vinyl spacer monomer unit and a vinyl reversible binder monomer unit. Each monomer unit can be based on acrylate monomer, a vinyl ester monomer, or a vinyl ether monomer, with the spacer monomer unit generally having a shorter pendant chain (such as 1-3 carbon atoms) and the reversible binder monomer unit having a longer pendant chain (such as 3-20 carbon atoms). A corresponding article includes first and second surfaces (or substrates) that are in contact with and bonded to the reversible adhesive composition at an interface therebetween. The reversible adhesive composition generally involves non-covalent and/or non-ionic bonding forces, for example H-bonding, permanent dipole, electron donor-acceptor moieties, and/or van der Waals forces, between the copolymer chains. The first and second surfaces can be repeatedly bonded, separated, and re-bonded while retaining the adhesive strength of the reversible adhesive composition.

The disclosure relates to a reversible adhesive composition including a copolymer between a vinyl spacer monomer unit and a vinyl reversible binder monomer unit. Each monomer unit can be based on acrylate monomer, a vinyl ester monomer, or a vinyl ether monomer, with the spacer monomer unit generally having a shorter pendant chain (such as 1-3 carbon atoms) and the reversible binder monomer unit having a longer pendant chain (such as 3-20 carbon atoms). A corresponding article includes first and second surfaces (or substrates) that are in contact with and bonded to the reversible adhesive composition at an interface therebetween. The reversible adhesive composition generally involves non-covalent and/or non-ionic bonding forces, for example H-bonding, permanent dipole, electron donor-acceptor moieties, and/or van der Waals forces, between the copolymer chains. The first and second surfaces can be repeatedly bonded, separated, and re-bonded while retaining the adhesive strength of the reversible adhesive composition.

In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II:

##STR00001##

wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.

In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II:

##STR00001##

wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.

In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II:

##STR00001##

wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.

In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II:

##STR00001##

wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.

In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: ##STR00001##
wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.