Patent classifications
C07C69/75
ESTER-BASED COMPOUND AND USE THEREOF
Provided are a novel ester-based compound and a use thereof. A use of a novel ester-based compound for improving heat resistance and compatibility as a plasticizer is provided. When the ester-based compound according to the present invention is used as the plasticizer of a heat-resistant resin composition, a synergistic effect on improvement of physical properties such as migration resistance and heating loss is provided to contribute to improvement of the physical properties of a molded article, and due to a rapid absorption rate and a short melting time, processability of the heat-resistant resin composition may be improved.
COMPOUND AND METHOD FOR PRODUCING THE SAME, RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
A compound (A) of the present invention is represented by the formula (1): wherein each R.sub.1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R.sub.2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R.sub.1 is a group represented by the formula (2); and wherein -* represents a bonding hand.
COMPOUND AND METHOD FOR PRODUCING THE SAME, RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
A compound (A) of the present invention is represented by the formula (1): wherein each R.sub.1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R.sub.2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R.sub.1 is a group represented by the formula (2); and wherein -* represents a bonding hand.
PROCESS FOR MAKING NOVEL POLYCONDENSATION PRE-POLYESTERS, OTHER COPOLYESTER PRECURSORS, AND COPOLYESTERS
This invention relates to a process for making a polycondensation pre-polyester, a polyester or both, comprising the following steps: A. Acylation of at least one diacid chloride with at least one alcohol to form at least one diester; B. Partial hydrolysis of the diester product of Step A to form at least one monoacid; C. Esterifying the monoacid of Step B with at least one diol to form a diester; D. Reacting the diester of Step C under acidic conditions to form a diacid; and subsequently, performing either Step E or Step F as follows: E. Bisalkylation of the diacid of Step D with at least one haloalcohol to form a pentamer, or F. Esterifiying the diacid of Step D under esterification conditions with at least one diol to form a pentamer, provided that the diol is not the same as the diol used in Step C.
Insect repellent compounds and compositions, and methods thereof
The present invention relates to monoterpenoid and phenylpropanoid containing derivative compounds, methods of making the compounds, compositions comprising the compounds, and methods of repelling pests using the compounds and/or compositions.
Insect repellent compounds and compositions, and methods thereof
The present invention relates to monoterpenoid and phenylpropanoid containing derivative compounds, methods of making the compounds, compositions comprising the compounds, and methods of repelling pests using the compounds and/or compositions.
COMPOUND, LIQUID CRYSTAL COMPOSITION, CURED SUBSTANCE, AND FILM
A compound includes, in a molecule, a structure A represented by the following A and a structure B represented by the following B, in which the compound includes two or more of the structures B in the molecule. A: A structure in which at least one or more aromatic ring structures are included and a total number of π electrons of the aromatic ring structure in the molecule is 8 or more. However, an aryl amine structure represented by a predetermined structure is excluded. B: A fluorine-containing terminal structure represented by a predetermined structural formula.
COMPOUND, METHOD FOR PRODUCING SAME, RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
The compound (A) is represented by formula (1).
R.sub.1O—R.sub.2—OR.sub.1 (1)
(In formula (1), each R.sub.1 independently represents a group represented by formula (2), or a hydrogen atom, and R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms, provided that at least one R.sub.1 is a group represented by formula (2).)
##STR00001##
(In formula (2), -* represents a bonding hand.)
Plasticizer composition and resin composition including the same
Provided is a plasticizer composition including: a cyclohexane-1,2-diester-based substance of the following Chemical Formula 1; and a citrate-based substance of the following Chemical Formula 2: ##STR00001## wherein in Chemical Formula 1 and Chemical Formula 2: R.sub.1 and R.sub.2 each independently are a C8 to C10 alkyl group; and R.sub.3 to R.sub.5 each independently are a C5 to C10 alkyl group.
Plasticizer composition and resin composition including the same
Provided is a plasticizer composition including: a cyclohexane-1,2-diester-based substance of the following Chemical Formula 1; and a citrate-based substance of the following Chemical Formula 2: ##STR00001## wherein in Chemical Formula 1 and Chemical Formula 2: R.sub.1 and R.sub.2 each independently are a C8 to C10 alkyl group; and R.sub.3 to R.sub.5 each independently are a C5 to C10 alkyl group.