Patent classifications
C07D249/04
Chemically amplified photoresist composition and photoresist film using the same
A chemically amplified photoresist composition comprising a triazole-based plasticizer and an alkali developable resin, which is capable of minimizing cracking of a photoresist obtained from the composition and improving adhesion to a substrate and sensitivity, and a photoresist film comprising a cured product of the chemically amplified photoresists composition.
Chemically amplified photoresist composition and photoresist film using the same
A chemically amplified photoresist composition comprising a triazole-based plasticizer and an alkali developable resin, which is capable of minimizing cracking of a photoresist obtained from the composition and improving adhesion to a substrate and sensitivity, and a photoresist film comprising a cured product of the chemically amplified photoresists composition.
BCL-2 inhibitors and their use as pharmaceuticals
The disclosure is directed to, in part, to BCL-2 inhibitors, pharmaceutical compositions comprising the same, as well as methods of their use and preparation.
BCL-2 inhibitors and their use as pharmaceuticals
The disclosure is directed to, in part, to BCL-2 inhibitors, pharmaceutical compositions comprising the same, as well as methods of their use and preparation.
TRIAZOLE GLYCOLATE OXIDASE INHIBITORS
The present invention provides triazole carboxylic acids and related compounds, as well as pharmaceutically acceptable salts thereof, which are useful as glycolate oxidase inhibitors. Pharmaceutical compositions and methods for treating primary hyperoxaluria, type I (PH) and kidney stones are also described.
TRIAZOLE GLYCOLATE OXIDASE INHIBITORS
The present invention provides triazole carboxylic acids and related compounds, as well as pharmaceutically acceptable salts thereof, which are useful as glycolate oxidase inhibitors. Pharmaceutical compositions and methods for treating primary hyperoxaluria, type I (PH) and kidney stones are also described.
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT
The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising (i) copper (II) ions, (ii) one or more than one suppressor consisting of or comprising one single N-heteroaromatic mono-ring, said mono-ring comprising at least two ring nitrogen atoms and more than one substituent covalently connected to one of said ring nitrogen atoms and/or a ring carbon atom, wherein said substituent independently is or comprises one or more than one linear or branched polyalkylene glycol moiety, and/or one or more than one linear or branched polyalkylene glycol block polyalkylene glycol, or random polyalkylene glycol moiety, with the proviso that if said suppressor comprises a OH group, then it is a terminal OH group of said polyalkylene glycol moiety, polyalkylene glycol block polyalkylene glycol, and random polyalkylene glycol moiety, respectively, and said suppressor does not comprise NH2 groups, halogen atoms, and sulfur atoms;
a method of electrolytic copper plating using the acidic aqueous composition; and specific suppressors as defined above.
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT
The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising (i) copper (II) ions, (ii) one or more than one suppressor consisting of or comprising one single N-heteroaromatic mono-ring, said mono-ring comprising at least two ring nitrogen atoms and more than one substituent covalently connected to one of said ring nitrogen atoms and/or a ring carbon atom, wherein said substituent independently is or comprises one or more than one linear or branched polyalkylene glycol moiety, and/or one or more than one linear or branched polyalkylene glycol block polyalkylene glycol, or random polyalkylene glycol moiety, with the proviso that if said suppressor comprises a OH group, then it is a terminal OH group of said polyalkylene glycol moiety, polyalkylene glycol block polyalkylene glycol, and random polyalkylene glycol moiety, respectively, and said suppressor does not comprise NH2 groups, halogen atoms, and sulfur atoms;
a method of electrolytic copper plating using the acidic aqueous composition; and specific suppressors as defined above.
Indanes as NRF2 activators
The present invention relates to indane compounds, methods of making them, pharmaceutical compositions containing them and their use as NRF2 activators. In particular, the invention relates to compounds of Formula (I) or Formula (II), and pharmaceutically acceptable salts thereof: ##STR00001##
Indanes as NRF2 activators
The present invention relates to indane compounds, methods of making them, pharmaceutical compositions containing them and their use as NRF2 activators. In particular, the invention relates to compounds of Formula (I) or Formula (II), and pharmaceutically acceptable salts thereof: ##STR00001##