Disclosed herein are methods for preparing [(2S,3R)N-[(2S)-3-(cyclopent-1-en-1-yl)-1-[(2R)-2-methyloxiran-2-yl]-1-oxopropan-2-yl]-3-hydroxy-3-(4-methoxyphenyl)-2-[(2S)-2-[2-(morpholin-4-yl)acetamido]propanamido]propanamide (compound G): and precursors thereof. ##STR00001##

Disclosed herein are methods for preparing [(2S,3R)N-[(2S)-3-(cyclopent-1-en-1-yl)-1-[(2R)-2-methyloxiran-2-yl]-1-oxopropan-2-yl]-3-hydroxy-3-(4-methoxyphenyl)-2-[(2S)-2-[2-(morpholin-4-yl)acetamido]propanamido]propanamide (compound G): and precursors thereof. ##STR00001##

The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.

The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.

Being used for drug modification, the multi-arm single molecular weight polyethylene glycol and an active derivative thereof provided herein can effectively improve the solubility, stability, and immunogenicity of the drugs, improve the absorption of the drugs in vivo, prolong the half-life of the drugs, and increase bioavailability, enhance efficacy, and reduce toxic and side effects of the drugs. A gel formed from the active derivative of the multi-arm single molecular weight polyethylene glycol provided herein can be used for the preparation of controlled release drugs so as to prolong the action time of the drugs, thereby reducing the number of administrations and improving patient compliance.

Being used for drug modification, the multi-arm single molecular weight polyethylene glycol and an active derivative thereof provided herein can effectively improve the solubility, stability, and immunogenicity of the drugs, improve the absorption of the drugs in vivo, prolong the half-life of the drugs, and increase bioavailability, enhance efficacy, and reduce toxic and side effects of the drugs. A gel formed from the active derivative of the multi-arm single molecular weight polyethylene glycol provided herein can be used for the preparation of controlled release drugs so as to prolong the action time of the drugs, thereby reducing the number of administrations and improving patient compliance.

The present invention relates to a novel epoxy compound, a method for preparing same, a composition and cured product comprising same, and use thereof, wherein the compound shows excellent heat-resistant propertiesspecifically, a low thermal expansion property and a high glass transition temperature (including Tg-less which does not show a glass transition temperature), a flame retardant property and processabilityspecifically, a viscosity-control property, does not require a separate silane coupling agent, and has improved brittleness in a composite. According to one aspect of the present invention, provided are: an epoxy compound having at least one non-reactive silyl group, alkenyl group or combination thereof together with at least two epoxy groups and at least one alkoxysilyl group; a method for preparing the epoxy compound through alkoxysilylation and alkylsilylation; an epoxy composition comprising same; and a cured product.

The present invention relates to a novel epoxy compound, a method for preparing same, a composition and cured product comprising same, and use thereof, wherein the compound shows excellent heat-resistant propertiesspecifically, a low thermal expansion property and a high glass transition temperature (including Tg-less which does not show a glass transition temperature), a flame retardant property and processabilityspecifically, a viscosity-control property, does not require a separate silane coupling agent, and has improved brittleness in a composite. According to one aspect of the present invention, provided are: an epoxy compound having at least one non-reactive silyl group, alkenyl group or combination thereof together with at least two epoxy groups and at least one alkoxysilyl group; a method for preparing the epoxy compound through alkoxysilylation and alkylsilylation; an epoxy composition comprising same; and a cured product.

The present disclosure, in at least certain embodiments, is directed to shikimate (shikimic acid) analogues and compositions thereof, devices and kits which contain the shikimate analogues or compositions thereof, and methods of use of the compounds and compositions for treating and neutralizing irritant or odoriferous compounds on animate or inanimate surfaces or in atmospheres. Examples of such irritant and odoriferous compounds include urushiols from poison ivy, oak, and sumac and mercaptans of skunk spray.

The present disclosure, in at least certain embodiments, is directed to shikimate (shikimic acid) analogues and compositions thereof, devices and kits which contain the shikimate analogues or compositions thereof, and methods of use of the compounds and compositions for treating and neutralizing irritant or odoriferous compounds on animate or inanimate surfaces or in atmospheres. Examples of such irritant and odoriferous compounds include urushiols from poison ivy, oak, and sumac and mercaptans of skunk spray.