C07D303/36

NEBIVOLOL SYNTHESIS METHOD AND INTERMEDIATE COMPOUND THEREOF
20180141926 · 2018-05-24 ·

The present invention relates to nebivolol synthesis method and intermediate compound thereof. Specifically, the present invention relates to a method for synthesizing nebivolol, intermediate compound thereof, and a method for preparing the intermediate compound.

NEBIVOLOL SYNTHESIS METHOD AND INTERMEDIATE COMPOUND THEREOF
20180141926 · 2018-05-24 ·

The present invention relates to nebivolol synthesis method and intermediate compound thereof. Specifically, the present invention relates to a method for synthesizing nebivolol, intermediate compound thereof, and a method for preparing the intermediate compound.

MULTI-FUNCTIONAL PHENOLIC RESINS

Disclosed herein are compositions and methods of making phenolic compounds and phenolic resins. The resins include multifunctional epoxies, amino glycidyl derivatives, alkanoate derivatives, alkyl ether derivatives, and multi-functional amines prepared from hydroxymethyl derivatives of novolac resin.

MULTI-FUNCTIONAL PHENOLIC RESINS

Disclosed herein are compositions and methods of making phenolic compounds and phenolic resins. The resins include multifunctional epoxies, amino glycidyl derivatives, alkanoate derivatives, alkyl ether derivatives, and multi-functional amines prepared from hydroxymethyl derivatives of novolac resin.

Diazabicyclo[4.3.1]decane derivatives for treatment of psychiatric disorders

The present invention relates to diazabicyclo[4.3.1]decane derivatives, pharmaceutically acceptable salts of these compounds and pharmaceutical compositions containing at least one of these compounds together with pharmaceutically acceptable carrier, excipient and/or diluents. Said diazabicyclo[4.3.1]decane derivatives can be used for prophylaxis and/or treatment of psychiatric disorders and neurodegenerative diseases, disorders and conditions.

Diazabicyclo[4.3.1]decane derivatives for treatment of psychiatric disorders

The present invention relates to diazabicyclo[4.3.1]decane derivatives, pharmaceutically acceptable salts of these compounds and pharmaceutical compositions containing at least one of these compounds together with pharmaceutically acceptable carrier, excipient and/or diluents. Said diazabicyclo[4.3.1]decane derivatives can be used for prophylaxis and/or treatment of psychiatric disorders and neurodegenerative diseases, disorders and conditions.

Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group

The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.

Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group

The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.

Phenolic epoxy compounds

Disclosed herein are compositions and methods of making phenolic compounds, and resins comprising these phenolic compounds. The compounds include multifunctional epoxies, amino glycidyl derivatives, and multi-functional amines prepared from hydroxymethyl derivatives of phenols and bisphenols. In one embodiment, a compound is of formula I ##STR00001##
wherein R.sub.1 is H or Z; each R.sub.2, R.sub.3, and R.sub.4, independently, are N(Z).sub.2, N(CH.sub.2OZ).sub.2, N(CH.sub.2CH.sub.2OZ).sub.2, N(CH.sub.2OH).sub.2, N(CH.sub.2NH.sub.2).sub.2, OZ, CH.sub.2OZ, CH.sub.2CH.sub.2OZ, CH.sub.2OH, CH.sub.2NH.sub.2, OC(CH.sub.3).sub.3, or O-(alkylene)-CH.sub.3; and Z is ##STR00002##

Phenolic epoxy compounds

Disclosed herein are compositions and methods of making phenolic compounds, and resins comprising these phenolic compounds. The compounds include multifunctional epoxies, amino glycidyl derivatives, and multi-functional amines prepared from hydroxymethyl derivatives of phenols and bisphenols. In one embodiment, a compound is of formula I ##STR00001##
wherein R.sub.1 is H or Z; each R.sub.2, R.sub.3, and R.sub.4, independently, are N(Z).sub.2, N(CH.sub.2OZ).sub.2, N(CH.sub.2CH.sub.2OZ).sub.2, N(CH.sub.2OH).sub.2, N(CH.sub.2NH.sub.2).sub.2, OZ, CH.sub.2OZ, CH.sub.2CH.sub.2OZ, CH.sub.2OH, CH.sub.2NH.sub.2, OC(CH.sub.3).sub.3, or O-(alkylene)-CH.sub.3; and Z is ##STR00002##