The present invention relates to the field of chemical industry, and discloses organosilicone micro-mesoporous ultra-low dielectric thin films and preparation methods therefor. A structural formula of a POSS-based organosilane precursor in the thin film is as follows: ##STR00001## where n is 12, 16, 18, 20, or 22, and X is CH.sub.3 or CH.sub.2CH.sub.3. The preparation method includes the following steps: dissolving a certain amount of the POSS-based precursor in an organic solvent at a room temperature; adding an appropriate amount of a photoacid generator, after uniformly stirring, spraying a mixed liquid to form a film on a substrate; placing the substrate under a light-emitting diode lamp for irradiating for a preset time after the organic solvent is completely evaporated; then placing the substrate in N,N-dimethylformamide for undergoing a transesterification reaction with fluoroalkyl alcohol for 24-72 h; and washing and drying to obtain the organosilicone micro-mesoporous ultra-low dielectric thin film. Compared with existing ultra-low dielectric thin films, the obtained thin film has a lower dielectric constant (1.89), and is better in dielectric stability in a humid environment, simple to operate, and high in polymerization speed.

The present invention relates to the field of chemical industry, and discloses organosilicone micro-mesoporous ultra-low dielectric thin films and preparation methods therefor. A structural formula of a POSS-based organosilane precursor in the thin film is as follows: ##STR00001## where n is 12, 16, 18, 20, or 22, and X is CH.sub.3 or CH.sub.2CH.sub.3. The preparation method includes the following steps: dissolving a certain amount of the POSS-based precursor in an organic solvent at a room temperature; adding an appropriate amount of a photoacid generator, after uniformly stirring, spraying a mixed liquid to form a film on a substrate; placing the substrate under a light-emitting diode lamp for irradiating for a preset time after the organic solvent is completely evaporated; then placing the substrate in N,N-dimethylformamide for undergoing a transesterification reaction with fluoroalkyl alcohol for 24-72 h; and washing and drying to obtain the organosilicone micro-mesoporous ultra-low dielectric thin film. Compared with existing ultra-low dielectric thin films, the obtained thin film has a lower dielectric constant (1.89), and is better in dielectric stability in a humid environment, simple to operate, and high in polymerization speed.

An aqueous, storage-stable and preferably colorless composition containing N-vinylbenzylaminoalkyl-functional siloxanols is derived from a reaction of hydrolysis products and optionally, condensation products of hydrolysis products, of at least one aminoalkyl-functional alkoxysilane or a mixture of aminoalkyl-functional alkoxysilanes with vinylbenzyl halide. The composition contains not less than 1% by weight of N-vinylbenzylaminoalkyl-functional siloxanols and/or salts of the protonated N-vinylbenzylaminoalkyl-functional siloxanols and water, based on the weight of the composition. The composition has a pH of 2 to 3.5. A process can be used for producing this composition.

A compound has a perovskite type crystal structure containing A which is a monovalent cation, B which is a metal ion, and X which is a halide ion as components. The perovskite type crystal structure has a unit cell volume of 0.2000 nm.sup.3 or more and 0.2150 nm.sup.3 or less, an ionic radius of B of 0.7 Å or more and 1.4 Å or less, and an ionic radius of X of 0.5 Å or more and 2.5 Å or less.

A silirane-functionalized compound, a process for preparing the same, and a process for preparing siloxanes using a silirane-functionalized compound are described herein.

A silirane-functionalized compound, a process for preparing the same, and a process for preparing siloxanes using a silirane-functionalized compound are described herein.

A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component includes (I) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure.

A catalyzed hydroformylation process of an alkenyl-functional organosilicon compound with carbon monoxide and hydrogen produces an aldehyde-functional organosilicon compound.

The present disclosure is directed to methods for dehydrogenatively coupled hydrosilanes and alcohols, the methods comprising contacting an organic substrate having at least one organic alcohol moiety with a mixture of at least one hydrosilane and sodium and/or potassium hydroxide, the contacting resulting in the formation of a dehydrogenatively coupled silyl ether. The disclosure further described associated compositions and methods of using the formed products.

The present disclosure is directed to methods for dehydrogenatively coupled hydrosilanes and alcohols, the methods comprising contacting an organic substrate having at least one organic alcohol moiety with a mixture of at least one hydrosilane and sodium and/or potassium hydroxide, the contacting resulting in the formation of a dehydrogenatively coupled silyl ether. The disclosure further described associated compositions and methods of using the formed products.