C07F7/2284

HIGH-PURITY LARGE-SCALE PREPARATION OF STANNSOPORFIN

Large scale (bulk) compositions comprising high-purity stannsoporfin are disclosed, as well as methods of synthesizing such compositions.

PROCESS FOR THE PREPARATION OF HALIDE PEROVSKITE AND PEROVSKITE-RELATED MATERIALS

This invention is related to a method for the preparation of halide perovskite or perovskite-related materials on a substrate and to optoelectronic devices and photovoltaic cells comprising the perovskites prepared by the methods of this invention The method for the preparation of the perovskite includes a direct conversion of elemental metal or metal alloy to halide perovskite or perovskite-related materials.

CYCLOALKYLNORBORNENE COMPOUNDS WITH HETEROCYCLIC FUNCTIONALITY FOR VOC-FREE CROSSLINKING AND SURFACE FUNCTIONALIZATION

A series of norbornene compounds having heterocyclic functionality are described, as well as methods for their preparation. Also described are rapid, low-temperature, low-(VOC)-methods for attaching these norbornene compounds to surfaces for use as chemical attachment points for a variety of functional molecules.

MONOALKYL TIN COMPOUNDS WITH LOW POLYALKYL CONTAMINATION, THEIR COMPOSITIONS AND METHODS

A pure composition comprises a monoalkyltin trialkoxide compound represented by the chemical formula RSn(OR).sub.3 or a monoalkyl tin triamide compound represented by the chemical formula RSn(NR.sub.2).sub.3 and no more than 4 mole % dialkyltin compounds relative to the total tin amount, where R is a hydrocarbyl group with 1-31 carbon atoms, and wherein R is a hydrocarbyl group with 1-10 carbon atoms. Methods are described for the formation of the pure compositions. A solid composition comprises a monoalkyl triamido tin compound represented by the chemical formula RSn-(NRCOR).sub.3, where R is a hydrocarbyl group with 1-31 carbon atoms, and where R and R are independently a hydrocarbyl group with 1-10 carbon atoms. The compositions are 10 suitable for the formation of resist compositions suitable for EUV patterning in which the compositions have a high EUV absorption.

METHOD OF FORMING TIN-CONTAINING MATERIAL FILM AND METHOD OF SYNTHESIZING A TIN COMPOUND

A tin compound, tin precursor compound for atomic layer deposition (ALD), a method of forming a tin-containing material film, and a method of synthesizing a tin compound, the tin compound being represented by Chemical Formula (I):

##STR00001## wherein R.sup.1, R.sup.2, Q.sup.1, Q.sup.2, Q.sup.3, and Q.sup.4 are each independently a C1 to C4 linear or branched alkyl group.

High-purity large-scale preparation of stannsoporfin

Large scale (bulk) compositions comprising high-purity stannsoporfin are disclosed, as well as methods of synthesizing such compositions.

Photoresist for semiconductor fabrication

An organometallic precursor for extreme ultraviolet (EUV) lithography is provided. An organometallic precursor includes an aromatic di-dentate ligand, a transition metal coordinated to the aromatic di-dentate ligand, and an extreme ultraviolet (EUV) cleavable ligand coordinated to the transition metal. The aromatic di-dentate ligand includes a plurality of pyrazine molecules.

SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION

A semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition are disclosed. The semiconductor photoresist composition may include an organotin compound represented by Chemical Formula 1 and a solvent.

##STR00001##

Reducing agents for atomic layer deposition

Methods of forming a metal film having a metal halide with a reducing agent are disclosed. The reducing agent, the reducing agent includes a group IV element containing heterocyclic compound, a radical initiator, an alkly alane, a diborene species and/or a Sn(II) compound.

PHOTORESIST COMPOSITION

A photoresist composition includes an organometallic compound represented by Formula 1.