An electrical or electronic device comprising a polymeric coating, formed by exposing the device to pulsed plasma comprising a compound of formula (I),

##STR00001##

where R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are as defined in the specification, for a sufficient period of time to allow a polymeric layer to form on the surface of the electrical or electronic device. Devices of this type are protected from contamination by liquids, in particular environmental liquids.

The invention relates to a method for producing an adhesive bond by means of an adhesive, wherein a composition containing at least a substance reactive in a radical polyreaction and a catalytically active substance is used as the adhesive, wherein at least one metal complex from the group of the metal phthalocyanines and/or from the group of the metal porphyrins is selected as the catalytically active substance, wherein a polyreaction of the reactive substance occurs, which polyreaction is initiated by the application of a plasma.

A method for protecting an electrical or electronic device against liquid damage, the method comprising a preliminary step of applying a continuous power plasma to the electrical or electronic device, followed by exposing the device to pulsed plasma comprising a compound of formula (I) ##STR00001##
where R.sup.1, R.sup.2 and R.sup.3 are independently selected from hydrogen, alkyl, haloalkyl or aryl optionally substituted by halo; and R.sup.4 is a group XR.sup.5 where R.sup.5 is an alkyl or haloalkyl group and X is a bond; a group of formula C(O)O(CH.sub.2).sub.nY where n is an integer of from 1 to 10 and Y is a bond or a sulphonamide group; or a group (O).sub.pR.sup.6(O).sub.q(CH.sub.2).sub.t where R.sup.6 is aryl optionally substituted by halo, p is 0 or 1, q is 0 or 1 and t is 0 or an integer of from 1 to 10, provided that where q is 1, t is other than 0, for a sufficient period of time to allow a polymeric layer to form on the surface of the electrical or electronic device. Devices protected by this method are protected from contamination by liquids, in particular environmental liquids.

A method for protecting an electrical or electronic device against liquid damage, the method comprising a preliminary step of applying a continuous power plasma to the electrical or electronic device, followed by exposing the device to pulsed plasma comprising a compound of formula (I) ##STR00001##
where R.sup.1, R.sup.2 and R.sup.3 are independently selected from hydrogen, alkyl, haloalkyl or aryl optionally substituted by halo; and R.sup.4 is a group XR.sup.5 where R.sup.5 is an alkyl or haloalkyl group and X is a bond; a group of formula C(O)O(CH.sub.2).sub.nY where n is an integer of from 1 to 10 and Y is a bond or a sulphonamide group; or a group (O).sub.pR.sup.6(O).sub.q(CH.sub.2).sub.t where R.sup.6 is aryl optionally substituted by halo, p is 0 or 1, q is 0 or 1 and t is 0 or an integer of from 1 to 10, provided that where q is 1, t is other than 0, for a sufficient period of time to allow a polymeric layer to form on the surface of the electrical or electronic device. Devices protected by this method are protected from contamination by liquids, in particular environmental liquids.

A method for producing a fiber-reinforced resin composite material includes a step of curing a composition for producing a fiber-reinforced resin composite material, which includes a reinforcing fiber material and a resin composition including a radical reactive resin having at least one polymerizable unsaturated double bond, by irradiating the composition with ionizing radiation.