An object of the present invention is to provide a photosensitive resin composition having good liquid repellency. The photosensitive resin composition of the present invention at least contains a fluororesin having a crosslinking site, a solvent, and a photopolymerization initiator, and the fluororesin contains a repeating unit derived from a hydrocarbon having a fluorine atom.

An object of the present invention is to provide a photosensitive resin composition having good liquid repellency. The photosensitive resin composition of the present invention at least contains a fluororesin having a crosslinking site, a solvent, and a photopolymerization initiator, and the fluororesin contains a repeating unit derived from a hydrocarbon having a fluorine atom.

Methods for forming melt processable, actinic radiation polymerizable and crosslinkable adhesives are described. In certain versions, the adhesives or pre-adhesive compositions include two initiators and are polymerized and/or crosslinked by exposure to actinic radiation such as UV light or electron beam radiation. Also described are pre-adhesive compositions including polymerizable monomers, articles including the adhesives, and various methods and systems related to the adhesives and their application. In addition, various apparatuses are described for polymerizing or crosslinking the compositions.

Methods for forming melt processable, actinic radiation polymerizable and crosslinkable adhesives are described. In certain versions, the adhesives or pre-adhesive compositions include two initiators and are polymerized and/or crosslinked by exposure to actinic radiation such as UV light or electron beam radiation. Also described are pre-adhesive compositions including polymerizable monomers, articles including the adhesives, and various methods and systems related to the adhesives and their application. In addition, various apparatuses are described for polymerizing or crosslinking the compositions.

A radiation dosimetry gel, usable in a polymer gel dosimeter having an improved sensitivity and high safety, includes a gelator, and a compound of the following Formula (1): ##STR00001##
wherein R.sup.1 is a hydrogen atom or a methyl group, m and n are each an integer of 2 to 4, k is 0 or 1, and a plurality of R.sup.1s and ms are each the same as or different from one another. Also provided for is a radiation dosimeter including the radiation dosimetry gel as a material for radiation dosimetry.

A radiation dosimetry gel, usable in a polymer gel dosimeter having an improved sensitivity and high safety, includes a gelator, and a compound of the following Formula (1): ##STR00001##
wherein R.sup.1 is a hydrogen atom or a methyl group, m and n are each an integer of 2 to 4, k is 0 or 1, and a plurality of R.sup.1s and ms are each the same as or different from one another. Also provided for is a radiation dosimeter including the radiation dosimetry gel as a material for radiation dosimetry.

An electron-beam-curing resin or a photocurable resin not containing a photopolymerization initiator is cured by photoirradiation under an atmosphere equal to or lower than predetermined oxygen concentration for not causing oxygen inhibition to polymerization of photocurable resin or electron beam-curable resin, an ultraviolet ray in wavelength region corresponding to a light absorption characteristic of the photocurable resin or the electron beam-curable resin is irradiated on the photocurable resin or the electron beam-curable resin to polymerize the photocurable resin or the electron beam-curable resin. After an ultraviolet ray is irradiated on the photocurable resin or the electron beam-curable resin to polymerize at least a surface layer, an electron beam is irradiated on the photocurable resin or the electron beam-curable resin to polymerize a deep part, and the entire photocurable resin or the entire electron beam-curable resin is cured.

An electron-beam-curing resin or a photocurable resin not containing a photopolymerization initiator is cured by photoirradiation under an atmosphere equal to or lower than predetermined oxygen concentration for not causing oxygen inhibition to polymerization of photocurable resin or electron beam-curable resin, an ultraviolet ray in wavelength region corresponding to a light absorption characteristic of the photocurable resin or the electron beam-curable resin is irradiated on the photocurable resin or the electron beam-curable resin to polymerize the photocurable resin or the electron beam-curable resin. After an ultraviolet ray is irradiated on the photocurable resin or the electron beam-curable resin to polymerize at least a surface layer, an electron beam is irradiated on the photocurable resin or the electron beam-curable resin to polymerize a deep part, and the entire photocurable resin or the entire electron beam-curable resin is cured.

Methods for forming melt processable, actinic radiation polymerizable and crosslinkable adhesives are described. In certain versions, the adhesives or pre-adhesive compositions include two initiators and are polymerized and/or crosslinked by exposure to actinic radiation such as UV light or electron beam radiation. Also described are pre-adhesive compositions including polymerizable monomers, articles including the adhesives, and various methods and systems related to the adhesives and their application. In addition, various apparatuses are described for polymerizing or crosslinking the compositions.

Methods for forming melt processable, actinic radiation polymerizable and crosslinkable adhesives are described. In certain versions, the adhesives or pre-adhesive compositions include two initiators and are polymerized and/or crosslinked by exposure to actinic radiation such as UV light or electron beam radiation. Also described are pre-adhesive compositions including polymerizable monomers, articles including the adhesives, and various methods and systems related to the adhesives and their application. In addition, various apparatuses are described for polymerizing or crosslinking the compositions.