Patent classifications
C08F2/54
Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production method
Provided are an electron beam curable resin composition including an olefin resin, a crosslinking agent, and a white pigment, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and the white pigment is blended in an amount of more than 200 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, a reflector resin frame using the resin composition, a reflector, a semiconductor light-emitting device, and a molding method using the resin composition.
Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production method
Provided are an electron beam curable resin composition including an olefin resin, a crosslinking agent, and a white pigment, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and the white pigment is blended in an amount of more than 200 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, a reflector resin frame using the resin composition, a reflector, a semiconductor light-emitting device, and a molding method using the resin composition.
Compositions for additive manufacturing and methods of additive manufacturing, particularly of nuclear reactor components
Additive manufacturing methods use a surrogate slurry to iteratively develop an additive manufacturing protocol and then substitutes a final slurry composition to then additively manufacture a final component using the developed additive manufacturing protocol. In the nuclear reactor component context, the final slurry composition is a nuclear fuel slurry having a composition: 30-45 vol. % monomer resin, 30-70 vol. % plurality of particles of uranium-containing material, >0-7 vol. % dispersant, photoactivated dye, photoabsorber, photoinitiator, and 0-18 vol. % (as a balance) diluent. The surrogate slurry has a similar composition, but a plurality of surrogate particles selected to represent a uranium-containing material are substituted for the particles of uranium-containing material. The method provides a means for in-situ monitoring of characteristics of the final component during manufacture as well as in-situ volumetric inspection. Compositions of surrogate slurries and nuclear fuel slurries are also disclosed.
Compositions for additive manufacturing and methods of additive manufacturing, particularly of nuclear reactor components
Additive manufacturing methods use a surrogate slurry to iteratively develop an additive manufacturing protocol and then substitutes a final slurry composition to then additively manufacture a final component using the developed additive manufacturing protocol. In the nuclear reactor component context, the final slurry composition is a nuclear fuel slurry having a composition: 30-45 vol. % monomer resin, 30-70 vol. % plurality of particles of uranium-containing material, >0-7 vol. % dispersant, photoactivated dye, photoabsorber, photoinitiator, and 0-18 vol. % (as a balance) diluent. The surrogate slurry has a similar composition, but a plurality of surrogate particles selected to represent a uranium-containing material are substituted for the particles of uranium-containing material. The method provides a means for in-situ monitoring of characteristics of the final component during manufacture as well as in-situ volumetric inspection. Compositions of surrogate slurries and nuclear fuel slurries are also disclosed.
POLYCYCLIC GLYOXYLATES AS PHOTOINITIATORS
The present invention relates to photoinitiator compounds of the formula (1) wherein X is O, S or a direct bond; Y is O, S or CR.sub.9R.sub.10; R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7 and R.sub.8 independently of each other are hydrogen, halogen, C.sub.1-C.sub.18alkyl, C.sub.5-C.sub.10cycloalkyl, C.sub.2-C.sub.18alkenyl, phenyl, C.sub.1-C.sub.4alkoxy, C.sub.5-C.sub.7cycloalkoxy, phenoxy, C.sub.1-C.sub.4-alkylthio, C.sub.5-C.sub.7cycloalkylthio, phenylthio, di(C.sub.1-C.sub.4alkyl)amino, di(C.sub.5-C.sub.7cycloalkyl)amino, N-morpholinyl, N-piperidinyl or a group of formula (2) provided that one or more than one of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7 or R.sub.8 is a group of formula (2); R.sub.9, R.sub.10 independently of each other are hydrogen, C.sub.1-C.sub.18alkyl, C.sub.2-C.sub.12alkenyl, C.sub.5-C.sub.10ocycloalkyl, phenyl-C.sub.1-C.sub.4alkyl, phenyl or together with the C atom to which they are attached form a 5-membered, 6-membered or 7-membered ring; and R.sub.11 is hydrogen, C.sub.1-C.sub.18alkyl, C.sub.5-C.sub.10cycloalkyl, C.sub.2-C.sub.12alkenyl, phenyl-C.sub.1-C.sub.4alkyl or phenyl.
##STR00001##
POLYCYCLIC GLYOXYLATES AS PHOTOINITIATORS
The present invention relates to photoinitiator compounds of the formula (1) wherein X is O, S or a direct bond; Y is O, S or CR.sub.9R.sub.10; R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7 and R.sub.8 independently of each other are hydrogen, halogen, C.sub.1-C.sub.18alkyl, C.sub.5-C.sub.10cycloalkyl, C.sub.2-C.sub.18alkenyl, phenyl, C.sub.1-C.sub.4alkoxy, C.sub.5-C.sub.7cycloalkoxy, phenoxy, C.sub.1-C.sub.4-alkylthio, C.sub.5-C.sub.7cycloalkylthio, phenylthio, di(C.sub.1-C.sub.4alkyl)amino, di(C.sub.5-C.sub.7cycloalkyl)amino, N-morpholinyl, N-piperidinyl or a group of formula (2) provided that one or more than one of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7 or R.sub.8 is a group of formula (2); R.sub.9, R.sub.10 independently of each other are hydrogen, C.sub.1-C.sub.18alkyl, C.sub.2-C.sub.12alkenyl, C.sub.5-C.sub.10ocycloalkyl, phenyl-C.sub.1-C.sub.4alkyl, phenyl or together with the C atom to which they are attached form a 5-membered, 6-membered or 7-membered ring; and R.sub.11 is hydrogen, C.sub.1-C.sub.18alkyl, C.sub.5-C.sub.10cycloalkyl, C.sub.2-C.sub.12alkenyl, phenyl-C.sub.1-C.sub.4alkyl or phenyl.
##STR00001##
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.
ELECTRON BEAM CURABLE INKJET INK COMPOSITION
Disclosed is an electron beam curable inkjet ink composition, including in 100 parts by mass thereof the following components a to c: a. 10 to 70 parts by mass of a monofunctional polymerizable compound having a weight average molecular weight of 100 to 400 and having a hydroxyl group; b. 10 to 75 parts by mass of a A functional polymerizable compound; and c. 0.1 to 10 parts by mass of an unreactive resin, wherein the electron beam curable inkjet ink composition does not include any of an organophosphorus compound, a polymerization initiator and a sensitizer, and has a viscosity of 30 mPa-s or less.
CURING METHOD AND CURING SYSTEM
To cure, with light irradiation, photocurable resin or electron beam-curable resin not containing a photopolymerization initiator.
Under an atmosphere equal to or lower than predetermined oxygen concentration for not causing oxygen inhibition to polymerization of photocurable resin or electron beam-curable resin, an ultraviolet ray in wavelength region corresponding to a light absorption characteristic of the photocurable resin or the electron beam-curable resin is irradiated on the photocurable resin or the electron beam-curable resin to polymerize the photocurable resin or the electron beam-curable resin. After an ultraviolet ray is irradiated on the photocurable resin or the electron beam-curable resin to polymerize at least a surface layer, an electron beam is irradiated on the photocurable resin or the electron beam-curable resin to polymerize a deep part, and the entire photocurable resin or the entire electron beam-curable resin is cured.
CURING METHOD AND CURING SYSTEM
To cure, with light irradiation, photocurable resin or electron beam-curable resin not containing a photopolymerization initiator.
Under an atmosphere equal to or lower than predetermined oxygen concentration for not causing oxygen inhibition to polymerization of photocurable resin or electron beam-curable resin, an ultraviolet ray in wavelength region corresponding to a light absorption characteristic of the photocurable resin or the electron beam-curable resin is irradiated on the photocurable resin or the electron beam-curable resin to polymerize the photocurable resin or the electron beam-curable resin. After an ultraviolet ray is irradiated on the photocurable resin or the electron beam-curable resin to polymerize at least a surface layer, an electron beam is irradiated on the photocurable resin or the electron beam-curable resin to polymerize a deep part, and the entire photocurable resin or the entire electron beam-curable resin is cured.