A method for producing hollow particles which have a void ratio of 50% or more, the method comprising: preparing a mixture liquid containing a polymerizable monomer, a hydrophobic solvent, an aqueous medium, etc., suspending the mixture liquid to prepare a suspension in which droplets of a monomer composition containing the polymerizable monomer, the hydrophobic solvent, etc., are dispersed in the aqueous medium, and subjecting the suspension to a polymerization reaction to prepare a precursor composition containing precursor particles having a hollow portion surrounded by a shell and filled with the hydrophobic solvent, wherein the polymerizable monomer a hydrocarbon monomer, and in 100% by mass of the polymerizable monomer, a content of a crosslinkable monomer containing two or more ethylenically unsaturated double bonds is 70% by mass or more, and wherein the hydrophobic solvent is a hydrocarbon solvent containing 5 to 8 carbon atoms.

Provided is a hollow resin particle that has a shell portion and a hollow portion surrounded by the shell portion and that can achieve reductions in dielectricity and dielectric loss tangent and can exhibit excellent heat resistance. In addition, a method for producing such a hollow resin particle in a simple manner is provided. Furthermore, use of such a hollow resin particle is provided. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion has an ether structure represented by formula (1).

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Provided is a hollow resin particle that has a shell portion and a hollow portion surrounded by the shell portion and that can achieve reductions in dielectricity and dielectric loss tangent and can exhibit excellent heat resistance. In addition, a method for producing such a hollow resin particle in a simple manner is provided. Furthermore, use of such a hollow resin particle is provided. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion has an ether structure represented by formula (1).

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Described are compositions and methods for inhibiting polymerization of a monomer (e.g., styrene) composition, which use an N—O polymerization inhibitor, a quinone methide polymerization retarder, and an amine stabilizer having a primary and/or secondary amine group. In a mixture, the amine-based stabilizer can prevent antagonistic effects and can provide greater antipolymerant activity. In turn, the mixture inhibits apparatus fouling and improves the purity of monomer streams.

Described are compositions and methods for inhibiting polymerization of a monomer (e.g., styrene) composition, which use an N—O polymerization inhibitor, a quinone methide polymerization retarder, and an amine stabilizer having a primary and/or secondary amine group. In a mixture, the amine-based stabilizer can prevent antagonistic effects and can provide greater antipolymerant activity. In turn, the mixture inhibits apparatus fouling and improves the purity of monomer streams.

Provided are resin particles, including: a vinyl polymer containing divinyl benzene as a constituent, wherein a number average particle diameter of the resin particles is 2.5 micrometers or greater but 10.0 micrometers or less, wherein a coefficient of variation (CV value) of a number-based particle diameter of the resin particles is 20% or lower, and wherein a circularity of the resin particles is 0.990 or greater.

Provided are resin particles, including: a vinyl polymer containing divinyl benzene as a constituent, wherein a number average particle diameter of the resin particles is 2.5 micrometers or greater but 10.0 micrometers or less, wherein a coefficient of variation (CV value) of a number-based particle diameter of the resin particles is 20% or lower, and wherein a circularity of the resin particles is 0.990 or greater.

Provided are resin particles, including: a vinyl polymer containing divinyl benzene as a constituent, wherein a number average particle diameter of the resin particles is 2.5 micrometers or greater but 10.0 micrometers or less, wherein a coefficient of variation (CV value) of a number-based particle diameter of the resin particles is 20% or lower, and wherein a circularity of the resin particles is 0.990 or greater.

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 μm or more and 15 μm or less, the particles have a 10% K value of 30 N/mm.sup.2 or more and 3000 N/mm.sup.2 or less, and the particles have a particle diameter CV value of 50% or less.

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 μm or more and 15 μm or less, the particles have a 10% K value of 30 N/mm.sup.2 or more and 3000 N/mm.sup.2 or less, and the particles have a particle diameter CV value of 50% or less.