A prepolymer, which is prepared by subjecting an unsaturated bond-containing compound and a bis(vinylphenyl) compound monomer or a polymer thereof to a prepolymerization reaction, is provided. The bis(vinylphenyl) compound contains between 80% and 99% of para-para vinyl groups and has a monomer content of between 80% and 100%. Moreover, a resin composition comprising the prepolymer and an additive, a method of preparing the prepolymer, and an article made from the resin composition are also provided.

A prepolymer, which is prepared by subjecting an unsaturated bond-containing compound and a bis(vinylphenyl) compound monomer or a polymer thereof to a prepolymerization reaction, is provided. The bis(vinylphenyl) compound contains between 80% and 99% of para-para vinyl groups and has a monomer content of between 80% and 100%. Moreover, a resin composition comprising the prepolymer and an additive, a method of preparing the prepolymer, and an article made from the resin composition are also provided.

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method, can provide a thin display and has excellent adhesion reliability.

The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.

Embodiments of the disclosure generally provide methods related to articles that display reversible photoresponsive behavior.

The present invention provides an antifouling film that is excellent in antifouling properties, rubbing resistance, and adhesion. The antifouling film includes: a substrate; and a polymer layer disposed on a surface of the substrate and including on a surface thereof an uneven structure provided with projections at a pitch not longer than a wavelength of visible light, the polymer layer being a cured product of a polymerizable composition, the polymerizable composition containing, in terms of active components, 30 to 80 wt % of a polyfunctional acrylate, 10 to 30 wt % of a monofunctional amide monomer, 0.5 to 10 wt % of a fluorine-based release agent, and 5 to 30 wt % of a vinyl-based polymer containing a repeat unit represented by a predetermined formula.

A method of forming an etched part includes forming a substrate including a thermoset resin and etching a surface of the substrate. The thermoset resin includes a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin. The etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites are formed on an etched surface of the substrate.

Embodiments of the disclosure generally provide compositions and methods related to articles that display reversible photoresponsive behavior.

Embodiments of the present disclosure generally provide compositions and methods related to articles that display reversible photoresponsive behavior.

A transparent body production method that includes subjecting the compound represented by formula (1) to heating at a temperature equal to or greater than the melting point of said compound. In formula (1), each of W.sup.1 and W.sup.2 is the group represented by formula (2) in which the ring Z is an aromatic hydrocarbon ring, X is a single bond or S, R.sup.1 is a single bond or an alkylene group having 1-4 carbon atoms, R.sup.2 is a specific substituent, and m is an integer of 0 or higher, the group represented by formula (4) is OH or a (meth)acryloyloxy group, each of the rings Y.sup.1 and Y.sup.2 is an aromatic hydrocarbon ring, R is a single bond or a specific divalent group, each of R.sup.3a and R.sup.3b is CN, a halogen group, or a monovalent hydrocarbon group, and each of n1 and n2 is an integer of 0-4.