The present invention provides a resin composition for an underfill material, comprising a maleimide compound (A) and a secondary monoamino compound (B), wherein the secondary monoamino compound (B) has a boiling point of 120 C. or more.

Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound represented by the following Formula (1) in which n and m each independently represent an integer from 1 to 5; Aly represents a group containing a substituted or unsubstituted allyl group and represented by the following Formula (2) (in Formula (2), Z represents a direct bond or a hydrocarbon group having 1 to 10 carbon atoms which may have a substituent; and R.sup.1, R.sup.2, and R.sup.3 each independently represent a hydrogen atom or a methyl group); MI represents a maleimide group represented by the following Formula (3) (in Formula (3), R.sup.4 and R.sup.5 each independently represent a hydrogen atom or a methyl group); and A represents a structure having two benzene rings and represented by the following Formula (4-1) or (4-2) (each benzene ring may have a substituent; and X represents a direct bond or a divalent linking group):

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Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound represented by the following Formula (1) in which n and m each independently represent an integer from 1 to 5; Aly represents a group containing a substituted or unsubstituted allyl group and represented by the following Formula (2) (in Formula (2), Z represents a direct bond or a hydrocarbon group having 1 to 10 carbon atoms which may have a substituent; and R.sup.1, R.sup.2, and R.sup.3 each independently represent a hydrogen atom or a methyl group); MI represents a maleimide group represented by the following Formula (3) (in Formula (3), R.sup.4 and R.sup.5 each independently represent a hydrogen atom or a methyl group); and A represents a structure having two benzene rings and represented by the following Formula (4-1) or (4-2) (each benzene ring may have a substituent; and X represents a direct bond or a divalent linking group):

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Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.

Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.

The present invention relates to a BCDA-based semi-alicyclic homo- or co-polyimide membrane material for gas separation and a preparation method thereof. The polyimide material prepared according to the present invention has high solubility in casting solvents, particularly in polar organic solvents, by interrupting asymmetry in the polyimide chain structure and formation of polyimide complexes compared with aromatic polyimides, and has higher heat resistance than the conventional aromatic polyimides and aliphatic polyimides, so that it is useful for the process of a high-selective permeable composite membrane or a asymmetric hollow fiber membrane used for commercial purposes, suggesting that it can be effectively used as a membrane for gas separation in various fields. In addition, the polyimide material membrane for gas separation of the present invention is useful because it has superior gas separation properties to the conventional commercialized aromatic polyimides or semi-alicyclic polyimides.

The present invention relates to a BCDA-based semi-alicyclic homo- or co-polyimide membrane material for gas separation and a preparation method thereof. The polyimide material prepared according to the present invention has high solubility in casting solvents, particularly in polar organic solvents, by interrupting asymmetry in the polyimide chain structure and formation of polyimide complexes compared with aromatic polyimides, and has higher heat resistance than the conventional aromatic polyimides and aliphatic polyimides, so that it is useful for the process of a high-selective permeable composite membrane or a asymmetric hollow fiber membrane used for commercial purposes, suggesting that it can be effectively used as a membrane for gas separation in various fields. In addition, the polyimide material membrane for gas separation of the present invention is useful because it has superior gas separation properties to the conventional commercialized aromatic polyimides or semi-alicyclic polyimides.

The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.

The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.

The present invention provides a film forming material for lithography comprising a compound having a group of the following formula (0):

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