A resin composition comprising a thermosetting resin, a functional group-modified copolymer, and an inorganic filler, wherein the functional group-modified copolymer has two or more alkyl (meth)acrylate units, or one or two or more alkyl (meth)acrylate units and an acrylonitrile unit, and at least a part of alkyl ester groups of the alkyl (meth)acrylate units and/or a cyano group of the acrylonitrile unit are/is modified with at least one selected from the group consisting of an epoxy group, a carboxyl group, and an amide group.

A resin composition comprising a thermosetting resin, a functional group-modified copolymer, and an inorganic filler, wherein the functional group-modified copolymer has two or more alkyl (meth)acrylate units, or one or two or more alkyl (meth)acrylate units and an acrylonitrile unit, and at least a part of alkyl ester groups of the alkyl (meth)acrylate units and/or a cyano group of the acrylonitrile unit are/is modified with at least one selected from the group consisting of an epoxy group, a carboxyl group, and an amide group.

The present invention relates to bismaleimide resins and curable compositions for One Drop Fill sealant applications using such resins, particularly in liquid crystal display assembly applications. The inventive compositions can be cured by a UV, thermal or a combination of UV and thermal.

Provided is a liquid crystal alignment layer of which a constituent member is a compound represented by the general formula (I). ##STR00001##

Provided is a liquid crystal alignment layer of which a constituent member is a compound represented by the general formula (I). ##STR00001##

Provided are a resin composition having low dielectric constants and low dielectric loss tangents before moisture absorption (initial state) and after moisture absorption with high metal foil peel strength; and a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board in which the resin composition is used. The resin composition contains a compound (A) represented by Formula (M1) and a polymer (B) having a structural unit represented by Formula (V).

##STR00001##

Provided are a polymerizable composition in which precipitation or the like of crystals does not occur and which has high storage stability; and a polymerizable composition in which unevenness is unlikely to occur when a film-like polymerized material obtained by polymerizing the composition is prepared. Further, provided are an optically anisotropic body, a retardation film, an optical compensation film, an anti-reflective film, a lens, and a lens sheet which are formed of the polymerizable composition, a liquid crystal display element, an organic light-emitting display element, a lighting element, an optical component, a colorant, a security marking, a member for emitting a laser, a polarizing film, a coloring material, and a printed matter for which the polymerizable composition is used.

An object of the present invention is to provide a photoalignment layer with a more reliable absorption anisotropy parameter as a photoalignment layer that allows for reduced AC image-sticking. Specifically, provided is a photoalignment layer, obtained by exposure to polarized UV radiation, that has a maximum A (=A1A2, where A1 is the absorbance in a direction parallel to a vibration direction of the polarized UV radiation, and A2 is the absorbance in a direction parallel to the vibration direction of the polarized UV radiation) of 0.35 or more per micrometer of layer thickness in a range of 230 to 380 nm.

An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board, while the resulting insulation layer has excellent adhesiveness to an adhesive metal such as titanium; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain; and an imidazole compound (B) represented by the following formula (2): ##STR00001##

An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board, while the resulting insulation layer has excellent adhesiveness to an adhesive metal such as titanium; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain; and an imidazole compound (B) represented by the following formula (2): ##STR00001##