An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer. ##STR00001##

All organic, dielectric polymers with high discharge efficiency at elevated operation temperatures are reported.

A liquid polymerizable composition including an anhydride derivative monomer with mineral nanoparticles homogeneously dispersed therein, as well as its use for the preparation of a transparent polymeric material having a high refractive index and its use in the optical field.

A liquid polymerizable composition including an anhydride derivative monomer with mineral nanoparticles homogeneously dispersed therein, as well as its use for the preparation of a transparent polymeric material having a high refractive index and its use in the optical field.

Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25? C.: 1 g/100 g or greater. (d) Glass transition temperature: 280? C. or lower. (e) 5% Weight loss temperature (T.sub.d5) measured at a rate of temperature increase of 10? C./min (in nitrogen), for a cured product of the curable compound: 300? C. or higher.

Provided is a liquid crystal alignment layer of which a constituent member is a compound represented by the general formula (I). ##STR00001##

Provided is a liquid crystal alignment layer of which a constituent member is a compound represented by the general formula (I). ##STR00001##

Provided are (i) a solution for forming an organic semiconductor layer which solution has excellent coating property, (ii) an organic semiconductor which is produced with use of the solution and which has high heat resistance, (iii) a layer which contains the organic semiconductor, and (iv) an organic thin film transistor which exhibits high electrical properties. A composition containing: an organic semiconductor; and a polymer (1) having at least one unit selected from the group consisting of units represented by formulae (1-a), (1-b) and (1-c) given below. A composition containing the organic semiconductor, the polymer (1) and an organic solvent can be suitably used as a solution for forming an organic semiconductor layer.

The present invention provides amic acids and imides derived from a polymer comprising: (a) maleic anhydride, (b) a first C.sub.1-C.sub.7 alkyl vinyl ether monomer, and (c) a second C.sub.8-C.sub.30 alkyl vinyl ether monomer, wherein the polymer contains an amic acid or an imide group. The polymers containing an amic acid or an imide group of the invention may be employed in a wide variety of compositions, particularly in oral care compositions. Non-limiting generic structures of the amidic polymers are set out below: (I) wherein R.sub.1-R.sub.3, M, a, b, c, d, e, and f are defined herein. ##STR00001##

The present invention provides amic acids and imides derived from a polymer comprising: (a) maleic anhydride, (b) a first C.sub.1-C.sub.7 alkyl vinyl ether monomer, and (c) a second C.sub.8-C.sub.30 alkyl vinyl ether monomer, wherein the polymer contains an amic acid or an imide group. The polymers containing an amic acid or an imide group of the invention may be employed in a wide variety of compositions, particularly in oral care compositions. Non-limiting generic structures of the amidic polymers are set out below: (I) wherein R.sub.1-R.sub.3, M, a, b, c, d, e, and f are defined herein. ##STR00001##