Non-ionic photo-acid generating (PAG) polymerizable monomers were prepared that contain a side chain sulfonate ester of an alpha-hydroxy aryl ketone. The aryl ketone group has a perfluorinated substituent alpha to the ketone carbonyl. The sulfur of the sulfonate ester is also directly linked to a fluorinated group. PAG polymers prepared from the PAG monomers release a strong sulfonic acid when exposed to high energy radiation such as deep UV or extreme UV light. The photo-generated sulfonic acid has a low diffusion rate in an exposed resist layer subjected to a post-exposure bake (PEB) at 100 C. to 150 C., resulting in formation of good line patterns after development.

A resist composition which generates an acid upon exposure and whose solubility in a developing solution changes under the action of an acid, including a base material including a copolymer having a structural unit represented by general formula (a9-1) or a structural unit represented by general formula (a9-2), 30 mol % or more of a structural unit represented by general formula (a10-1) and 45 mol % or more of a structural unit having an acid-decomposable group which increases a polarity under the action of an acid. In each formula, Rs is a hydrogen atom or the like; Ya.sup.91 and Ya.sup.X1 are a single bond or a divalent linking group; R.sup.91 is a hydrocarbon group having 1 to 20 carbon atoms or the like; R.sup.92 is an oxygen atom or the like; j and n.sub.ax1 are integers of 1 to 3; Wa.sup.x1 is a (n.sub.ax1+1)-valent aromatic hydrocarbon group.

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Provided is a photo-curable resin composition that is useful for the formation of a wafer edge part protection film for use in the production of a semiconductor. The photo-curable resin composition comprises: a compound containing a polycyclic aromatic hydrocarbon group derived from naphthalene, anthracene, phenanthrene, pyrene or the like and/or a polymer such as polyvinyl alcohol, polyacrylamide, a (meth)acrylic resin, polyamic acid, polyhydroxystyrene, a polyhydroxystyrene derivative, a copolymer of a polymethacrylate and maleic anhydride, an epoxy resin, a phenolic resin, a novolac resin, polyimide, cellulose, a cellulose derivative, starch, chitin, chitosan, gelatin, zein, a sugar-backbone polymeric compound, polyamide, polyethylene terephthalate, a polycarbonate, polyurethane, polysiloxane or the like; and a solvent. The composition has a viscosity of 100 cps or less at 25 C. and is cured with light having a wavelength of 170 to 800 nm.

Provided is a photo-curable resin composition that is useful for the formation of a wafer edge part protection film for use in the production of a semiconductor. The photo-curable resin composition comprises: a compound containing a polycyclic aromatic hydrocarbon group derived from naphthalene, anthracene, phenanthrene, pyrene or the like and/or a polymer such as polyvinyl alcohol, polyacrylamide, a (meth)acrylic resin, polyamic acid, polyhydroxystyrene, a polyhydroxystyrene derivative, a copolymer of a polymethacrylate and maleic anhydride, an epoxy resin, a phenolic resin, a novolac resin, polyimide, cellulose, a cellulose derivative, starch, chitin, chitosan, gelatin, zein, a sugar-backbone polymeric compound, polyamide, polyethylene terephthalate, a polycarbonate, polyurethane, polysiloxane or the like; and a solvent. The composition has a viscosity of 100 cps or less at 25 C. and is cured with light having a wavelength of 170 to 800 nm.

Acid-functionalized copolymers of methyl methacrylate having relatively high glass transition temperatures and molecular weights may be employed to manufacture articles having high light transmission values, low haze, high heat resistance, and high environmental stability, which are useful as optical protection films, zero-zero optical retardation films, and compensation films as well as lighting pipes and optical imaging lenses.

Acid-functionalized copolymers of methyl methacrylate having relatively high glass transition temperatures and molecular weights may be employed to manufacture articles having high light transmission values, low haze, high heat resistance, and high environmental stability, which are useful as optical protection films, zero-zero optical retardation films, and compensation films as well as lighting pipes and optical imaging lenses.