Provided is a hollow resin particle that can reduce the dielectricity and dielectric loss tangent of a resin layer by introducing an empty area thereinto, and can be obtained by forming a hollow portion in a simple manner. Also provided is a method of producing such hollow resin particle in a simple manner. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion contains an aromatic polymer (P1) obtained by polymerizing a monomer composition containing an aromatic crosslinkable monomer (a), an aromatic monofunctional monomer (b), and a (meth)acrylic acid ester-based monomer (c) having a specific structure.

A composition including a three-dimensional metal printing powder; an organic polymeric additive on at least a portion of an external surface of the three-dimensional metal printing powder; and optionally, an inorganic additive on at least a portion of an external surface of the three-dimensional metal printing powder. A process for preparing a three-dimensional metal printing powder having an organic polymeric additive disposed thereon. A process for employing the three-dimensional metal printing powder including selective laser sintering.

An organic polymeric particle including an optional first monomer comprising a hydrophobic monomer; a second monomer comprising two or more vinyl groups; an optional third monomer comprising an amine; and a vinyl siloxane polymerizable monomer.

An organic polymeric particle including an optional first monomer comprising a hydrophobic monomer; a second monomer comprising two or more vinyl groups; an optional third monomer comprising an amine; and a vinyl siloxane polymerizable monomer.

A method for producing a click-active Janus particle includes combining seed particles with a monomer emulsion to obtain monomer-swollen seed particles; and polymerizing the monomer-swollen seed particles to obtain click-active Janus particles. A method for functionalizing a click-active Janus particle includes combining seed particles with a monomer emulsion to obtain monomer-swollen seed particles; polymerizing the monomer-swollen seed particles to obtain click-active Janus particles; and functionalizing the click-active Janus particles using one or more click chemistry reactions.

A method for producing a click-active Janus particle includes combining seed particles with a monomer emulsion to obtain monomer-swollen seed particles; and polymerizing the monomer-swollen seed particles to obtain click-active Janus particles. A method for functionalizing a click-active Janus particle includes combining seed particles with a monomer emulsion to obtain monomer-swollen seed particles; polymerizing the monomer-swollen seed particles to obtain click-active Janus particles; and functionalizing the click-active Janus particles using one or more click chemistry reactions.

Ion exchange membranes obtainable by curing a composition comprising: (a) a monomer comprising an aromatic group and at least one polymerisable ethylenically unsaturated group; (b) a photoinitiator which has an absorption maximum at a wavelength longer than 380 nm when measured in one or more of the following solvents at a temperature of 23° C.: water, ethanol and toluene; and (c) at least one co-initiator.

Ion exchange membranes obtainable by curing a composition comprising: (a) a monomer comprising an aromatic group and at least one polymerisable ethylenically unsaturated group; (b) a photoinitiator which has an absorption maximum at a wavelength longer than 380 nm when measured in one or more of the following solvents at a temperature of 23° C.: water, ethanol and toluene; and (c) at least one co-initiator.

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25° C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25° C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.