Patent classifications
C08F220/52
THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME
A thermoplastic resin composition including an alkyl (meth)acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A) including a polymer seed including 70 to 85% by weight of an alkyl (meth)acrylate and 15 to 30% by weight of an aromatic vinyl compound, a rubber core surrounding the polymer seed and including 78 to 90% by weight of an alkyl acrylate and 10 to 22% by weight of an aromatic vinyl compound, and a graft shell surrounding the rubber core and including 65 to 80% by weight of an aromatic vinyl compound, 14 to 25% by weight of a vinyl cyanide compound, and 3 to 15% by weight of an alkyl acrylate; and a non-graft copolymer (B) including an alkyl (meth)acrylate, an aromatic vinyl compound, a vinyl cyanide compound, and an imide-based compound. The present disclosure also relates to a preparation method and a molded article.
THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME
A thermoplastic resin composition including an alkyl (meth)acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A) including a polymer seed including 70 to 85% by weight of an alkyl (meth)acrylate and 15 to 30% by weight of an aromatic vinyl compound, a rubber core surrounding the polymer seed and including 78 to 90% by weight of an alkyl acrylate and 10 to 22% by weight of an aromatic vinyl compound, and a graft shell surrounding the rubber core and including 65 to 80% by weight of an aromatic vinyl compound, 14 to 25% by weight of a vinyl cyanide compound, and 3 to 15% by weight of an alkyl acrylate; and a non-graft copolymer (B) including an alkyl (meth)acrylate, an aromatic vinyl compound, a vinyl cyanide compound, and an imide-based compound. The present disclosure also relates to a preparation method and a molded article.
Polymer compositions and use thereof as pour point depressants in paraffin-containing hydrocarbon oils
The invention relates to polymer compositions with improved manageability. The invention also relates to a polymer composition obtainable by radical polymerisation of A) 95-40 wt. % of a monomer mixture comprising Ai) 65-98 wt. % of at least alkyl (meth)acrylate having a linear C.sub.16-C.sub.40 alkyl radical and Aii) 2-35 wt. % of at least one comonomer selected from (meth)acrylates and (meth)acrylamides, which supports an optionally substituted aromatic radical bonded via an alkylene, alkenylene, oxyalkylene or polyoxyalkylene group to the ester group of the (meth)acrylate or to the amide group of the (meth)acrylamide, in the presence of B) 5-60% by weight % of at least one ethylene copolymer. The invention further relates to a method for the preparation and use thereof as flow improvers for paraffin-containing hydrocarbon oils.
Polymer compositions and use thereof as pour point depressants in paraffin-containing hydrocarbon oils
The invention relates to polymer compositions with improved manageability. The invention also relates to a polymer composition obtainable by radical polymerisation of A) 95-40 wt. % of a monomer mixture comprising Ai) 65-98 wt. % of at least alkyl (meth)acrylate having a linear C.sub.16-C.sub.40 alkyl radical and Aii) 2-35 wt. % of at least one comonomer selected from (meth)acrylates and (meth)acrylamides, which supports an optionally substituted aromatic radical bonded via an alkylene, alkenylene, oxyalkylene or polyoxyalkylene group to the ester group of the (meth)acrylate or to the amide group of the (meth)acrylamide, in the presence of B) 5-60% by weight % of at least one ethylene copolymer. The invention further relates to a method for the preparation and use thereof as flow improvers for paraffin-containing hydrocarbon oils.
STYRENE-ACRYLONITRILE RESIN WITH HIGH THERMAL RESISTANCE AND METHOD FOR PRODUCING THE SAME
The present invention provides a styrene-acrylonitrile (SAN) resin that exhibits significantly improved thermal resistance and, at the same time, can be produced at high productivity and is highly processable and highly moldable; and a method of producing the same by preparing and storing the solution containing a mixture of an N-substituted maleimide monomer and an unsaturated nitrile monomer at a particular temperature, introducing the solution and a styrene polymer into the polymerization reactor separately, and maintaining the first polymerization reactor and the second polymerization reactor at particular respective temperatures, thereby significantly reducing the amounts of oligomers contained in the SAN resin.
Coating liquid for resist pattern coating
There is provided a new coating liquid for resist pattern coating. A coating liquid for resist pattern coating comprising a component A that is a polymer including at least one hydroxy group or carboxy group; a component B that is a sulfonic acid of A-SO.sub.3H (where A is a linear or branched alkyl group or fluorinated alkyl group having a carbon atom number of 1 to 16, an aromatic group having at least one of the alkyl group or the fluorinated alkyl group as a substituent, or a C.sub.4-16 alicyclic group optionally having a substituent); and a component C that is an organic solvent capable of dissolving the polymer and including ether or ketone compound of R.sup.1OR.sup.2 and/or R.sup.1C(O)R.sup.2 (where R.sup.1 is a linear, branched, or cyclic alkyl group or fluorinated alkyl group having a carbon atom number of 3 to 16; and R.sup.2 is a linear, branched, or cyclic alkyl group or fluorinated alkyl group having a carbon atom number of 1 to 16), a method of forming a resist pattern using the coating liquid, and a method for forming a reverse pattern using the coating liquid.
Coating liquid for resist pattern coating
There is provided a new coating liquid for resist pattern coating. A coating liquid for resist pattern coating comprising a component A that is a polymer including at least one hydroxy group or carboxy group; a component B that is a sulfonic acid of A-SO.sub.3H (where A is a linear or branched alkyl group or fluorinated alkyl group having a carbon atom number of 1 to 16, an aromatic group having at least one of the alkyl group or the fluorinated alkyl group as a substituent, or a C.sub.4-16 alicyclic group optionally having a substituent); and a component C that is an organic solvent capable of dissolving the polymer and including ether or ketone compound of R.sup.1OR.sup.2 and/or R.sup.1C(O)R.sup.2 (where R.sup.1 is a linear, branched, or cyclic alkyl group or fluorinated alkyl group having a carbon atom number of 3 to 16; and R.sup.2 is a linear, branched, or cyclic alkyl group or fluorinated alkyl group having a carbon atom number of 1 to 16), a method of forming a resist pattern using the coating liquid, and a method for forming a reverse pattern using the coating liquid.
FORMULATIONS CONTAINING MIXED RESIN SYSTEMS AND THE USE THEREOF FOR WAFER-LEVEL UNDERFILL FOR 3D TSV PACKAGES
Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.
FORMULATIONS CONTAINING MIXED RESIN SYSTEMS AND THE USE THEREOF FOR WAFER-LEVEL UNDERFILL FOR 3D TSV PACKAGES
Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.
CROSSLINKERS AND COMPOSITIONS
The present disclosure provides cross-linker compounds that can produce desirable polymeric materials, polymer compositions, and/or photo-curable resins. Further provided herein are methods of producing cross-linker compounds, compositions, resins, devices, and polymeric materials. Also provided herein are methods of using cross-linker compounds, resins, and polymeric materials for the fabrication (e.g., via 3D printing) of medical devices, such as orthodontic appliances.