A resin composition may include a (meth)acrylate (A) comprising a hydroxy group and having a molecular weight of about 500 or less, and a polymer (B) comprising polyisoprene or polybutadiene as a main skeleton, having at least one radical reactive group in one molecule, and having a molecular weight in a range of about 2,000 to about 35,000, wherein the resin composition has a glass transition temperature in a range of about −50° C. to about 0° C. after the resin composition is cured, and the resin composition has a viscosity in a range of about 5 mPa.Math.s to about 50 mPa.Math.s at a temperature in a range of about 30° C. to about 50° C.

A resin composition may include a (meth)acrylate (A) comprising a hydroxy group and having a molecular weight of about 500 or less, and a polymer (B) comprising polyisoprene or polybutadiene as a main skeleton, having at least one radical reactive group in one molecule, and having a molecular weight in a range of about 2,000 to about 35,000, wherein the resin composition has a glass transition temperature in a range of about −50° C. to about 0° C. after the resin composition is cured, and the resin composition has a viscosity in a range of about 5 mPa.Math.s to about 50 mPa.Math.s at a temperature in a range of about 30° C. to about 50° C.

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and an OED including the same.

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and an OED including the same.

A composition for temporary bonding, including the following (A) to (C). An adhesive for temporary bonding for manufacturing an electronic device, including the composition for temporary bonding. (A) A (meth)acrylate comprising the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer; and (C) a photo radical polymerization initiator.

A composition for temporary bonding, including the following (A) to (C). An adhesive for temporary bonding for manufacturing an electronic device, including the composition for temporary bonding. (A) A (meth)acrylate comprising the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer; and (C) a photo radical polymerization initiator.

A composition is described comprising a styrene-isobutylene block copolymer; and at least one ethylenically unsaturated monomer. After curing the composition comprises polymerized units of the ethylenically unsaturated monomer. In some embodiments the ethylenically unsaturated groups are selected from (meth)acryl or vinyl ether. The composition is suitable for use as a (e.g. pressure sensitive) adhesive. Articles, methods of making an article, and methods of bonding are also described.

A composition is described comprising a styrene-isobutylene block copolymer; and at least one ethylenically unsaturated monomer. After curing the composition comprises polymerized units of the ethylenically unsaturated monomer. In some embodiments the ethylenically unsaturated groups are selected from (meth)acryl or vinyl ether. The composition is suitable for use as a (e.g. pressure sensitive) adhesive. Articles, methods of making an article, and methods of bonding are also described.

A composition is described comprising a styrene-isobutylene block copolymer; and at least one ethylenically unsaturated monomer. After curing the composition comprises polymerized units of the ethylenically unsaturated monomer. In some embodiments the ethylenically unsaturated groups are selected from (meth)acryl or vinyl ether. The composition is suitable for use as a (e.g. pressure sensitive) adhesive. Articles, methods of making an article, and methods of bonding are also described.

The present invention has an object to provide a modified polyolefin resin capable of forming a coating film that is excellent in water-resistant adhesiveness under a high temperature condition. The present invention provides a modified polyolefin resin including a graft-modified product in which a component (A) that is a polyolefin resin is graft-modified with a component (B) that is an α, β-unsaturated carboxylic acid or a derivative thereof, and having a tensile modulus of 250 MPa or higher, and a weight-average molecular weight of 70,000 or more and less than 200,000.