Patent classifications
C08F265/06
AQUEOUS DISPERSION OF OCCLUDED POLYMER PARTICLES
The present invention relates to a composition comprising an aqueous dispersion of multiphase polymer particles comprising first polymer particles having a T.sub.g of less than 30° C. and second polymer particles having a T.sub.g in the range of from 100° C. to 110° C., wherein the second polymer particles are phase separated from and occluded within the first polymer particles; wherein the number average molecular weight (M.sub.n) of the multiphase polymer particles is in the range of from 9,000 to 25,000 g/mole; and wherein the second polymer particles comprise at least 95 weight percent methyl methacrylate. The composition of the present invention is useful in a formulation that can be used to prepare a water-resistant blister free LASD coating with little or no surface defects.
AQUEOUS DISPERSION OF OCCLUDED POLYMER PARTICLES
The present invention relates to a composition comprising an aqueous dispersion of multiphase polymer particles comprising first polymer particles having a T.sub.g of less than 30° C. and second polymer particles having a T.sub.g in the range of from 100° C. to 110° C., wherein the second polymer particles are phase separated from and occluded within the first polymer particles; wherein the number average molecular weight (M.sub.n) of the multiphase polymer particles is in the range of from 9,000 to 25,000 g/mole; and wherein the second polymer particles comprise at least 95 weight percent methyl methacrylate. The composition of the present invention is useful in a formulation that can be used to prepare a water-resistant blister free LASD coating with little or no surface defects.
SEEDED RESIN-STABILIZED HIGH-SOLIDS EMULSION POLYMERS
The presently claimed invention relates to a polymer emulsion and a process for preparing a polymer emulsion. Particularly, the presently claimed invention relates to a process for preparing a polymer emulsion with high solids content.
SEEDED RESIN-STABILIZED HIGH-SOLIDS EMULSION POLYMERS
The presently claimed invention relates to a polymer emulsion and a process for preparing a polymer emulsion. Particularly, the presently claimed invention relates to a process for preparing a polymer emulsion with high solids content.
SEEDED RESIN-STABILIZED HIGH-SOLIDS EMULSION POLYMERS
The presently claimed invention relates to a polymer emulsion and a process for preparing a polymer emulsion. Particularly, the presently claimed invention relates to a process for preparing a polymer emulsion with high solids content.
RESIN COMPOSITION, FILM, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE
Provided are a resin composition including a coloring material, a resin, and a solvent, in which the resin includes a resin having a structure represented by Formula (1); a film formed of the resin composition; an optical filter; a solid-state imaging element; and an image display device. In Formula (1), Z.sup.1 represents an (m+n)-valent linking group, Y.sup.1 and Y.sup.2 each independently represent a single bond or a divalent linking group, A.sup.1 represents a group including a coloring material adsorption portion, P.sup.1 represents a polymer chain, n represents 1 to 20, m represents 1 to 20, and m+n represents 2 to 21, and in a case where m is 1, the polymer chain represented by P.sup.1 includes a repeating unit having an oxetane group, and in a case where m is 2 or more, at least one polymer chain of m pieces of polymer chains represented by P.sup.1 includes a repeating unit having an oxetane group.
[A.sup.1-Y.sup.1.sub.nZ.sup.1
Y.sup.2-P.sup.1].sub.m (1)
CURABLE CASTING COMPOUND FOR THE MANUFACTURE OF MOLDED PLASTICS
This invention relates to a curable casting compound for the manufacture of molded plastics, comprising a casting compound having a binder composition and a filler composition, wherein the filler composition has at least a first portion of an inorganic filler and a second portion of an organic filler, wherein the second portion of organic filler comprises comminuted nutshells—as a nutshell portion, in particular granular nutshells, having a percentage by weight of 1% by wt. to 100% by wt. of the filler composition.
CURABLE CASTING COMPOUND FOR THE MANUFACTURE OF MOLDED PLASTICS
This invention relates to a curable casting compound for the manufacture of molded plastics, comprising a casting compound having a binder composition and a filler composition, wherein the filler composition has at least a first portion of an inorganic filler and a second portion of an organic filler, wherein the second portion of organic filler comprises comminuted nutshells—as a nutshell portion, in particular granular nutshells, having a percentage by weight of 1% by wt. to 100% by wt. of the filler composition.
Acrylic Resin Powder, Resin Composition, Hot-Melt Adhesive Composition Including Acrylic Resin Powder, and Production Method Therefor
The present invention relates to an acrylic resin powder containing a multistage polymer (G) having an alkyl (meth)acrylate ester (ma) monomer unit and an alkyl (meth)acrylate ester (mb) monomer unit, in which an alkyl group in the alkyl (meth)acrylate esters (ma) and (mb) has 4 to 8 carbon atoms, a glass transition temperature of the multistage polymer (G) is 50° C. or higher, a mass average molecular weight is 10,000 or more and 300,000 or less, a softening temperature that is measured by a flow tester temperature-rising method is 150° C. to 200° C., and the acrylic resin powder is soluble in acetone.
Pattern-forming composition, film, infrared cut filter, infrared transmitting filter, solid image pickup element, infrared sensor, and camera module
Provided is a pattern-forming composition, including: an infrared absorbing colorant; and at least one compound selected from the group consisting of a resin having a glass transition temperature of 150° C. to 300° C. and a precursor of a resin having a glass transition temperature of 150° C. to 300° C.