The present invention pertains to: an acrylic laminate film containing an acrylic copolymer and having a three-layer structure of an inner layer, an intermediate layer, and an outer layer; a method for producing same; and a deco sheet produced therefrom. An object of the present invention is to provide a three-layer-structured acrylic laminate film produced from an acrylic copolymer. Another object of the present invention is to provide: an acrylic laminate film having significantly improved optical properties and surface smoothness by using an acrylic copolymer alone without mixing the same with additional polymers; and a method for producing the acrylic laminate film. Still another object of the present invention is to provide: an acrylic laminate film that exhibits significantly reduced whitening even when a flexural stress is applied; and a method for producing the acrylic laminate film.

The present invention refers to a method for producing preferably water-based polymeric compositions, preferably dispersions (i.e. latices), which are particularly useful as or in adhesives, especially pressure-sensitive adhesives (PSAs), particularly pressure-sensitive adhesives removable under neutral or basic (i.e. alkaline) conditions, as well as to the polymeric compositions thus produced and to their various applications, including the copolymers comprised by these polymeric compositions.

The present invention refers to a method for producing preferably water-based polymeric compositions, preferably dispersions (i.e. latices), which are particularly useful as or in adhesives, especially pressure-sensitive adhesives (PSAs), particularly pressure-sensitive adhesives removable under neutral or basic (i.e. alkaline) conditions, as well as to the polymeric compositions thus produced and to their various applications, including the copolymers comprised by these polymeric compositions.

The present invention refers to a method for producing preferably water-based polymeric compositions, preferably dispersions (i.e. latices), which are particularly useful as or in adhesives, especially pressure-sensitive adhesives (PSAs), particularly pressure-sensitive adhesives removable under neutral or basic (i.e. alkaline) conditions, as well as to the polymeric compositions thus produced and to their various applications, including the copolymers comprised by these polymeric compositions.

A method for producing a pressure-sensitive adhesive sheet of the present invention includes: forming a pressure-sensitive adhesive layer 10 formed of a transparent, light-cured base pressure-sensitive adhesive material on a support S1; irradiating the pressure-sensitive adhesive layer 10 with an ultraviolet ray U to cure the pressure-sensitive adhesive layer; providing a solution 12 of an ultraviolet absorbing agent 11; applying the solution 12 to one of opposite surfaces of the cured pressure-sensitive adhesive layer 10a to cause the ultraviolet absorbing agent 11 contained in the solution 12 to infiltrate from the one surface in a thickness direction of the pressure-sensitive adhesive layer 10a; and drying the pressure-sensitive adhesive layer 10a.

A method for producing a pressure-sensitive adhesive sheet of the present invention includes: forming a pressure-sensitive adhesive layer 10 formed of a transparent, light-cured base pressure-sensitive adhesive material on a support S1; irradiating the pressure-sensitive adhesive layer 10 with an ultraviolet ray U to cure the pressure-sensitive adhesive layer; providing a solution 12 of an ultraviolet absorbing agent 11; applying the solution 12 to one of opposite surfaces of the cured pressure-sensitive adhesive layer 10a to cause the ultraviolet absorbing agent 11 contained in the solution 12 to infiltrate from the one surface in a thickness direction of the pressure-sensitive adhesive layer 10a; and drying the pressure-sensitive adhesive layer 10a.

A transfer film includes a temporary support; and a photosensitive layer, in which the photosensitive layer includes a polymer A containing a constitutional unit represented by Formula A1, a constitutional unit derived from a monomer having an alicyclic structure, and a constitutional unit having a radically polymerizable group, a radically polymerizable compound, and a photopolymerization initiator, a content of the constitutional unit represented by Formula A1 is 10% by mass or more with respect to a total mass of the polymer A, a content of the constitutional unit derived from the monomer having the alicyclic structure is 15% by mass or more with respect to a total mass of the polymer A, and a glass transition temperature of a homopolymer of the monomer having the alicyclic structure is 120° C. or higher. ##STR00001##

A transfer film includes a temporary support; and a photosensitive layer, in which the photosensitive layer includes a polymer A containing a constitutional unit represented by Formula A1, a constitutional unit derived from a monomer having an alicyclic structure, and a constitutional unit having a radically polymerizable group, a radically polymerizable compound, and a photopolymerization initiator, a content of the constitutional unit represented by Formula A1 is 10% by mass or more with respect to a total mass of the polymer A, a content of the constitutional unit derived from the monomer having the alicyclic structure is 15% by mass or more with respect to a total mass of the polymer A, and a glass transition temperature of a homopolymer of the monomer having the alicyclic structure is 120° C. or higher. ##STR00001##

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.