Provided are a UV-curable non-isocyanate polyurea polymer and a UV-curable coating composition containing the same. The UV-curable non-isocyanate polyurea polymer has one or more ethylenically unsaturated functional groups and the ethylenically unsaturated functional groups are attached to nitrogen atoms present in a backbone urea segment via C(=0)- linkage. The nonisocyanate polyurea polymer is prepared by: (i) providing an ethylenically unsaturated compound having one or more carboxylic acid functional groups; and (ii) reacting said ethylenically unsaturated compound having one or more carboxylic acid functional groups with a multi-carbodiimide polymer to form the non-isocyanate polyurea polymer.

A stretchable ink composition comprising a polyester; a polyurethane elastomer; water; a co-solvent; an optional surfactant; and an optional colorant.

A stretchable ink composition comprising a polyester; a polyurethane elastomer; water; a co-solvent; an optional surfactant; and an optional colorant.

A stretchable ink composition comprising a polyester; a polyurethane elastomer; water; a co-solvent; an optional surfactant; and an optional colorant.

A build-up film with low dielectric loss, a preparation method therefor, and a circuit substrate structure are provided. The build-up film is prepared from raw materials including 5-10 parts by mass of monofunctional benzoxazine having indene oligomer, 40-65 parts by mass of polymerized aromatic-based maleimide, 30-50 parts by mass of allyl benzoxazine, 0.1-3 parts by mass of initiator, 250-400 parts by mass of inorganic filler, and 0.1-5 parts by mass of silane coupling agent. The build-up film has low dielectric loss and high tensile strength. Low dielectric loss enables it to be applied in the field of 5G. For example, the build-up film can be used to packaging integrated circuit substrates, which is conducive to minimizing the transmission loss.

To provide an in-plane switching mode liquid crystal display device having favorable alignment property and electrical properties.

A liquid crystal display device, which comprises a first substrate and a second substrate disposed to face each other with a liquid crystal sandwiched therebetween, wherein the first substrate and the second substrate respectively have the following characteristics:

first substrate: an electrode-provided substrate having a first electrode and a plurality of second electrodes overlaid on the first electrode via an insulating film, formed on a pixel region on a surface on the liquid crystal side, so constituted that one of the first electrode and the second electrodes is a pixel electrode and the other is a counter electrode, having a first liquid crystal alignment film formed on the surface on the liquid crystal side of the first substrate covered with the second electrodes, and the first liquid crystal alignment film being a film containing a polyimide having liquid crystal alignment performance imparted by irradiation with polarized ultraviolet rays;

second substrate: a substrate having a second liquid crystal alignment film formed on a surface on the liquid crystal side, and the second liquid crystal alignment film being a film containing a photosensitive side chain type polymer which develops liquid crystallinity dependent on the temperature.

A build-up film with low dielectric loss, a preparation method therefor, and a circuit substrate structure are provided. The build-up film is prepared from raw materials including 5-10 parts by mass of monofunctional benzoxazine having indene oligomer, 40-65 parts by mass of polymerized aromatic-based maleimide, 30-50 parts by mass of allyl benzoxazine, 0.1-3 parts by mass of initiator, 250-400 parts by mass of inorganic filler, and 0.1-5 parts by mass of silane coupling agent. The build-up film has low dielectric loss and high tensile strength. Low dielectric loss enables it to be applied in the field of 5G. For example, the build-up film can be used to packaging integrated circuit substrates, which is conducive to minimizing the transmission loss.

There is provided a resin composition containing a polyimide or a polyimide precursor, where a cured substance obtained from the resin composition satisfies all of the following conditions (i) to (iv), and are provided a cured substance, a laminate, a manufacturing method for a cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device, and a semiconductor device; condition (i): a Young's modulus of the cured substance is 3.5 GPa or more, condition (ii): a coefficient of thermal expansion of the cured substance in a temperature range of 25 C. to 125 C. is less than 50 ppm/ C., condition (iii): a Tg of the cured substance is 240 C. or higher, and condition (iv): a breaking elongation of the cured substance is 40% or more.

A resin composition includes a polymer, which has a first structural unit of Formula (1) and a second structural unit of Formula (2). The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength and warpage at high temperature.

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A substance which makes it possible to selectively mask according to the substrate surface material. A polymer film-forming composition for selectively forming a polymer film on a region (R-I) of a substrate which has the region (R-I), the surface of which includes a metal (I), and a region (R-II), the surface of which includes a material (II) which differs from the metal (I), the polymer film-forming composition including a radical generator (A) and a radical-equipped reactive compound (B); and a selective polymer film formation method for forming a film of the polymer film-forming composition on the surface of the substrate.