C08F283/105

PHOTOCURABLE COMPOSITION AND ITS APPLICATION IN PHOTOCURING FIELDS

The present invention generally relates to a photosensitive material. More particularly it relates to a photosensitive composition comprising a photoinitiator compound having a structure (I) and at least one monomer/oligomer wherein the monomer/oligomer is having photopolymerizable ethylenic unsaturated double bonds and its application in the field of photosensitive curing.

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