Patent classifications
C
C08
C08F
283/00
C08F283/10
C08F283/105
C08F283/105
PHOTOCURABLE COMPOSITION AND ITS APPLICATION IN PHOTOCURING FIELDS
20260055222
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2026-02-26
·
·
The present invention generally relates to a photosensitive material. More particularly it relates to a photosensitive composition comprising a photoinitiator compound having a structure (I) and at least one monomer/oligomer wherein the monomer/oligomer is having photopolymerizable ethylenic unsaturated double bonds and its application in the field of photosensitive curing.
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