In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140° C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.

In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140° C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.

Thermoset compositions and methods for forming three-dimensional articles via an additive fabrication process, and articles made therefrom are disclosed herein. In an embodiment, a composition comprises a first network-forming component comprising a TPA-based polyester comprising a backbone and having at least 2 polymerizable groups, one or more first network monomers, and a first network initiator. The backbone of the TPA-based polyester comprises the reaction product of a terephthalic acid and a polyol. The composition may further comprise a second network-forming component.

The present disclosure provides an ethylene-based polymer composition formed by high pressure (greater or equal to 100 MPa) free radical polymerization. The ethylene-based polymer composition includes ethylene monomer and a mixture of hydrocarbon-based molecules, each hydrocarbon-based molecule comprising three or more terminal alkene groups. The ethylene-based polymer has a melt index (MI) from 0.1 to 1.0 g/10 min.

In a conductive film, a cured film formed of a photosensitive resin composition including at least one of monomers represented by Formulae (1) and (2), a clay mineral, and a photopolymerization initiator is provided as a protective layer of a lead-out wiring part of the conductive film that functions as a touch sensor.

A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent.

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In Formula (1), R.sub.1 represents a hydrogen atom or an alkyl group.

The method for producing a resin composition for a secondary coating of an optical fiber comprises a step of reacting a polyol, a diisocyanate and a hydroxyl group-containing (meth)acrylate in the presence of a (meth)acrylate not having a hydroxyl group to obtain a mixture of urethane (meth)acrylate and the (meth)acrylate not having a hydroxyl group, and a step of adding a photopolymerization initiator to the mixture to obtain a resin composition, and a hydroxyl value of the (meth)acrylate not having a hydroxyl group is 12.0 mgKOH/g or less.

An aspect of the present invention relates to a resin composition, which contains a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and a free radical compound, in which the free radical compound has at least one free radical group selected from the group consisting of structures represented by Formulas (1), (2), (3) and (4) in a molecule.

One aspect of the present application relates to a resin composition including a modified polyphenylene ether compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in one molecule, and a liquid styrene-butadiene copolymer having a weight average molecular weight of less than 10000 and having a 1,2-vinyl group.

A composition for model materials (4a) is used for shaping an optically shaped article by an inkjet optical shaping method, comprises a monofunctional monomer (A) and an oligomer (B) as a photocurable component, further, comprises no polyfunctional monomer (C) as a photocurable component, or comprises a polyfunctional monomer (C) as a photocurable component at 3.0 parts by weight based on 100 parts by weight of a whole composition for model materials, the oligomer (B) has a hydroxyl group or an amino group, and a total molar fraction of the hydroxyl group and the amino group in a total amount of the photocurable components is less than 5.0%. The composition for model materials (4a) can afford an optically shaped article that has flexibility, and does not crack even when it is bent.