C08F290/14

3D in vitro Models of Lung Tissue

The invention relates to the discovery of tissue mimicking constructs and compositions that can be used to study the growth and development of cells in vitro. In certain embodiments, the invention provides methods of culturing cells on the tissue mimicking polymer microspheres. In other embodiments, the invention provides methods of treating a disease or disorder using the compositions and constructs of the invention.

COMPOSITE FILM, PROTECTIVE COVER FOR AN ELECTRONIC DEVICE, AND METHODS OF MAKING THE SAME

A composite film comprises: a first unitary thermoplastic polymer film; a low surface energy abrasion resistant layer disposed on the first unitary thermoplastic polymer film; a first adhesive layer proximate and securely bonded to the first unitary thermoplastic polymer film; a second unitary thermoplastic polymer film bonded to the first adhesive layer; and a second adhesive layer bonded to the second unitary thermoplastic polymer film opposite the first adhesive layer. A protective cover for an electronic device comprises: a first unitary thermoplastic polymer film; a low surface energy abrasion resistant layer disposed on the first unitary thermoplastic polymer film; a first adhesive layer proximate and securely bonded to the first unitary thermoplastic polymer film. The low surface energy abrasion resistant layer comprises an at least partially cured curable composition comprising components, based on the total weight of components a) to d): a) 70 to 95 weight percent of urethane (meth)acrylate compound having an average (meth)acrylate functionality of 3 to 9; b) 2 to 20 weight percent (meth)acrylate monomer having a (meth)acrylate functionality of 1 to 2, wherein the (meth)acrylate monomer is not a urethane (meth)acrylate compound; c) 0.5 to 2 weight percent of silicone (meth)acrylate; and d) optional effective amount of photoinitiator. Methods of making are also disclosed.

STEPPED SUBSTRATE-COATING COMPOSITION CONTAINING POLYETHER RESIN HAVING PHOTOCROSSLINKABLE GROUP

A stepped substrate-coating composition having high properties of filling a pattern and capable of forming on a substrate a coating film that can be formed by photocuring, has flattening properties, and has high heat resistance after irradiation with light. A photocurable composition for coating a stepped substrate, the photocurable composition containing a polymer containing a unit structure of Formula (1):

##STR00001##

wherein A.sup.1, A.sup.2, and A.sup.3 are each independently an aromatic C.sub.6-100 ring optionally containing a heteroatom or a hydrocarbon group containing an aromatic C.sub.6-100 ring optionally containing a heteroatom, B.sup.1, B.sup.2, and B.sup.3 are each independently Formula (2):

##STR00002##

wherein R.sup.1 is a C.sub.1-10 alkylene group, a C.sub.1-10 alkenylene group, a C.sub.1-10 alkynylene group, a C.sub.6-40 arylene group, an oxygen atom, a carbonyl group, a sulfur atom, C(O)O, C(O)NR.sup.a, NR.sup.b, or a group including a combination thereof, R.sup.2 is a hydrogen atom or a C.sub.1-10 alkyl group.

Polymide precursor resin composition

A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R.sup.1 is a tetravalent organic group, R.sup.2 is a divalent organic group and R.sup.3 and R.sup.4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R.sup.5 is an alkyl group having 1 to 4 carbon atoms, R.sup.6 is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R.sup.7 is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R.sup.8 is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R.sup.9 is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R.sup.8 and R.sup.9 may independently have a substituent. ##STR00001##

Polymide precursor resin composition

A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R.sup.1 is a tetravalent organic group, R.sup.2 is a divalent organic group and R.sup.3 and R.sup.4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R.sup.5 is an alkyl group having 1 to 4 carbon atoms, R.sup.6 is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R.sup.7 is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R.sup.8 is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R.sup.9 is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R.sup.8 and R.sup.9 may independently have a substituent. ##STR00001##

LIQUID CRYSTAL DEVICE, METHOD FOR PRODUCING SAME, AND COMPOUND
20200231875 · 2020-07-23 · ·

This liquid crystal display device is provided with: a pair of substrates which have conductive films, respectively; a liquid crystal layer which is arranged between the pair of substrates and contains a liquid crystal; and a liquid crystal control layer which is formed on the substrate-side interface of the liquid crystal layer by means of polymerization of a polymerizable monomer, and which controls the alignment of the liquid crystal. With respect to this liquid crystal display device, at least one of the pair of substrates is not provided with a liquid crystal alignment film, and the liquid crystal control layer contains a compound that has at least one partial structure which is selected from the group consisting of a fluorene structure-containing group, an aromatic amino group and a nitrogen-containing aromatic heterocyclic group.

THERMOSETTING RESIN COMPOSITION, PREPREG MADE THEREFROM, LAMINATE CLAD WITH METAL FOIL, AND HIGH-FREQUENCY CIRCUIT BOARD
20200224026 · 2020-07-16 ·

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

THERMOSETTING RESIN COMPOSITION, PREPREG MADE THEREFROM, LAMINATE CLAD WITH METAL FOIL, AND HIGH-FREQUENCY CIRCUIT BOARD
20200224026 · 2020-07-16 ·

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

COMPOSITION, FILM, OPTICAL FILTER, SOLID IMAGE PICKUP ELEMENT, AND INFRARED SENSOR
20200225577 · 2020-07-16 · ·

Provided is a composition with which a film capable of detecting infrared light with high sensitivity for use in an infrared sensor or the like can be formed. In addition, provided are a film, an optical filter, a solid image pickup element, and an infrared sensor. This composition includes: a color material that transmits infrared light and blocks visible light; a near infrared absorbing colorant; and a curable compound. In the composition, a ratio A/B of a minimum value A of an absorbance of the composition in a wavelength range of 400 to 700 nm to a maximum value B of an absorbance of the composition in a wavelength range of 1,400 to 1,500 nm is 4.5 or higher, and in a case where a film having a thickness of 1 m is formed using the composition, the film has a maximum value of a refractive index in a wavelength range of 800 nm or longer.

COMPOSITION, FILM, OPTICAL FILTER, SOLID IMAGE PICKUP ELEMENT, AND INFRARED SENSOR
20200225577 · 2020-07-16 · ·

Provided is a composition with which a film capable of detecting infrared light with high sensitivity for use in an infrared sensor or the like can be formed. In addition, provided are a film, an optical filter, a solid image pickup element, and an infrared sensor. This composition includes: a color material that transmits infrared light and blocks visible light; a near infrared absorbing colorant; and a curable compound. In the composition, a ratio A/B of a minimum value A of an absorbance of the composition in a wavelength range of 400 to 700 nm to a maximum value B of an absorbance of the composition in a wavelength range of 1,400 to 1,500 nm is 4.5 or higher, and in a case where a film having a thickness of 1 m is formed using the composition, the film has a maximum value of a refractive index in a wavelength range of 800 nm or longer.