Patent classifications
C08F290/14
Polysiloxane monomer and method for preparing the same
A compound represented by the formula (1) is described, which has a linear polysiloxane structure at the end, a polymerizable group at the other end, and a polyether group or a hydrophilic group as a side chain bounded to a linking group which is represented by -(L.sup.1).sub.a-CH-L.sup.2- in the formula (1) and exists between the polysiloxane structure and the terminal polymerizable group. The compound has excellent compatibility with a hydrophilic monomer, and the surface wettability of hydrogel obtained from the compound as a monomer is improved. Methods are also described for preparing the polysiloxane monomer compound, a polymer having a repeating unit derived from the polymerization at the (meth)acryl group of the polysiloxane monomer compound, and an ophthalmic device containing the polymer.
Composition Comprising A Grafted Polylactic Acid
A composition is provided comprising an epoxide functional polymer comprising epoxide functional groups, wherein the epoxide functional polymer has a number average molecular weight of 1000 to 10.000 g/mol and a grafted polylactic acid, wherein the polylactic acid is grafted with an acid-functional ethylenically unsaturated polymerizable monomer and/or an acid anhydride-functional ethylenically unsaturated polymerizable monomer and has a total amount of carboxylic acid groups and carboxylic acid anhydride groups between 10.0 and 60.0 mg KOH/g.
Coating composition for flexible plastic film
The present invention relates to a coating composition for a flexible plastic film, and more specifically to a coating composition for producing a flexible plastic film having excellent flexibility while exhibiting high hardness. According to the present invention, the coating composition exhibits flexibility, bending property, high hardness, scratch resistance and high transparency, and hardly has a risk of damaging the film even in repetitive, continuous bending or long-time folding state, and thereby can be usefully applied to flexible mobile devices, display devices, front face and display unit of various instrument panels, and the like.
CURABLE COMPOSITION AND CURED ARTICLE THEREOF
The present invention relates to a curable composition containing (A) a side chain-containing cyclic molecule in which three or more side chains each having a polymerizable functional group introduced at a terminal are introduced ((A) cyclic polyfunctional monomer), and (B) a polymerizable monomer having a polymerizable functional group polymerizable with the side chain-containing cyclic molecule ((B) another polymerizable monomer). The present invention provides a curable composition from which a cured article having high abrasion resistance and enabling exhibition of excellent mechanical properties and photochromic properties is obtained. In particular, the present invention can provide a curable composition from which a cured article suitable for use as a polishing pad or a photochromic spectacle lens can be obtained.
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT
A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an alicyclic skeleton; (C) a photopolymerization initiator; and (D) one or more compounds selected from the group consisting of tetrazole and a tetrazole derivative.
Photopolymerizable Compositions Including a Urethane Component and a Monofunctional Reactive Diluent, Articles, and Methods
The present disclosure provides a photopolymerizable composition. The photopolymerizable composition includes at least one urethane component, at least one monofunctional reactive diluent, an initiator, and optionally an inhibitor. The present disclosure also provides an article including the reaction product of the photopolymerizable composition. Further, the present disclosure provides a method of making an article. The method includes (i) providing a photopolymerizable composition and (ii) selectively curing the photopolymerizable composition to form an article. The method optionally also includes (iii) curing unpolymerized urethane component and/or reactive diluent remaining after step (ii). Further, methods are provided, including receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying an article; and generating, with the manufacturing device by an additive manufacturing process, the article based on the digital object. A system is also provided, including a display that displays a 3D model of an article; and one or more processors that, in response to the 3D model selected by a user, cause a 3D printer to create a physical object of an article.
CURABLE COMPOSITION, CURED PRODUCT AND METHOD FOR FORMING INSULATING FILM
A curable composition which enables the formation of a cured product having a low dielectric constant, low dielectric loss tangent, high heat resistance, good elongation and excellent tensile strength and which has excellent film forming properties; a cured product of the curable composition; and a method for forming an insulating film using the curable composition. This curable composition contains a modified maleimide compound, a radical generator and a thiol compound. The curable composition may contain a photo-radical generator as the radical generator. The curable composition may contain a protonic acid.
Photopolymerizable compositions including a urethane component and a monofunctional reactive diluent, articles, and methods
The present disclosure provides a photopolymerizable composition. The photopolymerizable composition includes at least one urethane component, at least one monofunctional reactive diluent, an initiator, and optionally an inhibitor. The present disclosure also provides an article including the reaction product of the photopolymerizable composition. Further, the present disclosure provides a method of making an article. The method includes (i) providing a photopolymerizable composition and (ii) selectively curing the photopolymerizable composition to form an article. The method optionally also includes (iii) curing unpolymerized urethane component and/or reactive diluent remaining after step (ii). Further, methods are provided, including receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying an article; and generating, with the manufacturing device by an additive manufacturing process, the article based on the digital object. A system is also provided, including a display that displays a 3D model of an article; and one or more processors that, in response to the 3D model selected by a user, cause a 3D printer to create a physical object of an article.
Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.