Provided herein is a masterbatch including a grafted silicone polyether and a porous inorganic nanoparticle, bacteria repellant polymer composites including the same, and methods of preparation thereof.

The present invention aims to provide an electrolyte composition from which an electrolyte film having a higher battery performance than typical electrolyte films is obtained. The present invention provides an electrolyte composition containing an alkali metal salt. The composition further contains a photocurable and/or thermosetting monomer; and a salt dissociating agent. A content ratio of the alkali metal salt is 50% by mass or more relative to 100% by mass of the total amount of the alkali metal salt, the photocurable and/or thermosetting monomer, and the salt dissociating agent.

A polymerizable composition for an optical material includes: an allyl carbonate compound (A) including two or more allyloxycarbonyl groups at a terminal which is represented by General Formula (1); and a radical polymerization initiator (B). The radical polymerization initiator (B) includes at least one kind of radical polymerization initiator (B1) which is a peroxyester-based radical polymerization initiator, and a radical polymerization initiator (B2).

##STR00001##

A self-assembled film-forming composition for orthogonally inducing, with respect to a substrate, a microphase separation structure in a layer including a block copolymer, in the whole surface of a coating film, even at high heating temperatures at which arrangement failure of the microphase separation of the block copolymer occurs. The self-assembled film-forming composition includes a block copolymer, and at least two solvents having different boiling points as a solvent. The block copolymer is obtained by bonding: a non-silicon-containing polymer having, as a structural unit, styrene, a derivative thereof, or a structure derived from a lactide; and a silicon-containing polymer having, as a structural unit, styrene substituted with silicon-containing groups. The solvent includes: a low boiling point solvent (A) having a boiling point of 160° C. or lower; and a high boiling point solvent (B) having a boiling point of 170° C. or higher.

A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

Polymers having mechanical properties approaching or exceeding commercial elastomers and engineering thermoplastics, but improved biostability, are described herein. In one embodiment, the polymers have a hard segment containing one or more disulfoxide or disulfone moieties and a soft segment connected to the hard segment to form an elastomeric polymer. The polymer is resistant to oxidation and/or hydrolytic degradation, particularly in vivo, which allows for the use of these materials in implants/devices which are implanted for an extended period of time. The ratio or percentage by weight of soft segment to hard segment can be varied based on the physical and mechanical properties of the desired device.

The problem addressed by the present invention is to provide a block copolymer that can be used in a neutral solvent atmosphere and can produce a solid polymer membrane including nanoparticles. The problem is solved by a block copolymer represented by formula (1) below. ##STR00001## wherein in the formula, R.sub.1 represents a C1-20 linear, branched, or cyclic alkyl group, C6-20 aryl group, or C7-20 aralkyl group; R.sub.2 represents a group having a functional group having an acid dissociation constant pKa of from 0.5 to 7; R.sub.3, R.sub.4, and R.sub.5 each show H or a C1-20 linear, branched, or cyclic alkyl group; R.sub.6, R.sub.7, and R.sub.8 each represent a hydrogen, hydroxyl group, nitro group, carboxy group, or carbonyl group; X represents an amide or ester, but may not be included; Y represents an amide or ester, but may not be included; p represents an integer of 1-10, but may not be included; n represents an integer of 3-1000; m represents an integer of 3-1000; and t represents an integer of 3-1000, but n may not be included; the arrangement of n, m, and t is arbitrary, but n and m are adjacent when n is included.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

Provided are an intrinsic flame-retardant resin with a low polarity, and a preparation method therefor and the use thereof. The intrinsic flame-retardant resin with a low polarity has a structure as shown in formula I and is a phenolic compound or resin which is prepared by a three-step reaction of allyl etherification, rearrangement and terminating with a phosphorus-containing group. The resin does not contain polar hydroxyl groups in the molecular formula thereof, and has a stable molecular structure, low polarity and high reactivity, and does not generate polar hydroxyl groups during application and processing, thereby avoiding the influence of secondary hydroxyl groups on the performance of products thereof. While the resin improves the dielectric performance, same still has crosslinkable groups which lead to no significant change in high temperature resistance after curing. Introduction of the phosphorus-containing capping group allows the resin to have intrinsic flame-retardant performance. Using the resin in the preparation of a metal foil clad laminate facilitates reducing the dielectric constant and dielectric loss of the metal foil clad laminate, and results in higher high temperature resistance and improved flame retardancy, so that the metal foil clad laminate has a good comprehensive performance and broad application prospects.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.