The present invention relates to a composition comprising; components a) b) and d); wherein, component a) is a metal compound having the structure (I), component b) is a spin on high carbon polymer, having a polymer backbone comprising mono-cyclic aromatic hydrocarbon, fused-ring ring hydrocarbon moieties, or mixtures of these, having a wt. % of carbon from about 81 wt. % to about 94 wt. %, which is soluble to at least about 5 wt. % in a spin casting solvent, and wherein at least one, of said mono-cyclic aromatic hydrocarbon or said fused-ring ring hydrocarbon moieties, present in said spin on high carbon polymer, is functionalized with at least one alkynyloxy moiety of structure (VIII), and component d) is a spin casting solvent. The present invention further relates to using this composition in methods for manufacturing electronic devices through either the formation of a patterned films of high K material comprised of a metal oxide on a semiconductor substrate, or through the formation of patterned metal oxide comprised layer overlaying a semiconductor substrate which may be used to selectively etch the semiconductor substrate with a fluorine plasma.

##STR00001##

To provide a novel resin having excellent dielectric properties, a method for producing the resin, a curable resin composition, and a cured product. The resin contains constituent units described in Group (1). R.sup.1 each independently represent a methylene group, a methylene oxy group, a methylene oxy methylene group, or an oxy methylene group. R.sup.2 and R.sup.3 each independently represent a halogen atom, an alkyl group having from 1 to 10 carbons, a halogenated alkyl group having from 1 to 10 carbons, a hydroxy alkyl group having from 1 to 10 carbons, or an aryl group having from 6 to 12 carbons. R.sup.4, R.sup.5, and R.sup.6 each independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 10 carbons, a halogenated alkyl group having from 1 to 10 carbons, a hydroxy group, a hydroxy alkyl group having from 1 to 10 carbons, or an aryl group having from 6 to 12 carbons.

##STR00001##

Cationic or zwitterionic polymer adhesives, adhesive articles, aqueous polymerizable pre-adhesive reaction mixtures, and methods of preparation that include internal incorporation of a phenolic resin. The aqueous polymerizable pre-adhesive reaction mixtures include one or more cationic (meth)acrylate monomers, one or more low Tg nonionic monomer having a (meth)acryloyl group, optionally one or more anionic (meth)acrylate monomers, and one or more phenolic resins.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.

Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.

[Problem to be Solved] An object is to provide a compound with good heat resistance. And another object is to provide a coating made exhibits less film shrinkage, good gap filling property and good planarization. [Solution] The present invention provides an ethynyl derived composite and a composition comprising thereof. And the present invention provides a method for manufacturing a coating by it, and a method for manufacturing a device.

[Problem to be Solved] An object is to provide a compound with good heat resistance. And another object is to provide a coating made exhibits less film shrinkage, good gap filling property and good planarization. [Solution] The present invention provides an ethynyl derived composite and a composition comprising thereof. And the present invention provides a method for manufacturing a coating by it, and a method for manufacturing a device.

A resist underlayer composition including a polymer having a polymer backbone and a substituted or unsubstituted fullerene group pendant to the polymer backbone, and a solvent in an amount of from 50 to 99.9 weight % based on the total resist underlayer composition.

The invention relates to a curable resin that represents an excellent substitute for phenolic resins and is therefore able to replace phenolic resins in all applications in which they are used. Said resin is characterised in that it comprises: (1) at least one prepolymer resulting from the prepolymerisation of a compound A comprising at least one aromatic or heteroaromatic ring, a first group OCH2-CCH and at least one second group selected from the groups OCH2-CCH2 and CH2-CHCH2, said groups being carried by the at least one aromatic or heteroaromatic ring; and (2) a compound B comprising at least two thiol groups (SH). The invention also relates to a material obtained by curing said curable resin, and in particular to an ablative composite material. The invention further relates to a material obtained by curing said curable resin.