The present invention relates to a catalyst system which improves the work life of acid-catalyzed resole resins at higher ambient temperatures and provides extended shelf life. The catalyst system comprises an inorganic acid catalyst and one or more polyhydric alcohols. In particular, the present invention relates to a catalyst system wherein the inorganic acid and the alcohol do not convert to an ester when added to the resole resin.

The present invention relates to a demulsification additive composition for demulsification of water-in-oil emulsion caused due to wash water in the crude oil, wherein the composition comprises: (a) one or more demulsifiers (the component (a)); and (b) a compound selected from the group comprising glyoxal, neutralized glyoxal, glyoxal derivative and a mixture thereof (the component (b)), and (c) further comprises phosphoric acid (the component (c)).

The present invention also relates to a method of using the present demulsification additive composition for demulsification of water-in-oil emulsion caused due to wash water in the crude oil.

The present invention also relates to a method for demulsification of water-in-oil emulsion caused due to wash water in the crude oil by employing the present demulsification additive composition.

The invention relates to a curable resin that represents an excellent substitute for phenolic resins and is therefore able to replace phenolic resins in all applications in which they are used. Said resin is characterised in that it comprises: (1) at least one prepolymer resulting from the prepolymerisation of a compound A comprising at least one aromatic or heteroaromatic ring, a first group OCH2-CCH and at least one second group selected from the groups OCH2-CCH2 and CH2-CHCH2, said groups being carried by the at least one aromatic or heteroaromatic ring; and (2) a compound B comprising at least two thiol groups (SH). The invention also relates to a material obtained by curing said curable resin, and in particular to an ablative composite material. The invention further relates to a material obtained by curing said curable resin.

The invention relates to a curable resin that represents an excellent substitute for phenolic resins and is therefore able to replace phenolic resins in all applications in which they are used. Said resin is characterised in that it comprises: (1) at least one prepolymer resulting from the prepolymerisation of a compound A comprising at least one aromatic or heteroaromatic ring, a first group OCH2-CCH and at least one second group selected from the groups OCH2-CCH2 and CH2-CHCH2, said groups being carried by the at least one aromatic or heteroaromatic ring; and (2) a compound B comprising at least two thiol groups (SH). The invention also relates to a material obtained by curing said curable resin, and in particular to an ablative composite material. The invention further relates to a material obtained by curing said curable resin.

The object of the invention is a component system for producing a binder for metal casting on the basis of phenolic resins of the benzyl ether type and isocyanates containing non-polar solvents.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

Provided are an intrinsic flame-retardant resin with a low polarity, and a preparation method therefor and the use thereof. The intrinsic flame-retardant resin with a low polarity has a structure as shown in formula I and is a phenolic compound or resin which is prepared by a three-step reaction of allyl etherification, rearrangement and terminating with a phosphorus-containing group. The resin does not contain polar hydroxyl groups in the molecular formula thereof, and has a stable molecular structure, low polarity and high reactivity, and does not generate polar hydroxyl groups during application and processing, thereby avoiding the influence of secondary hydroxyl groups on the performance of products thereof. While the resin improves the dielectric performance, same still has crosslinkable groups which lead to no significant change in high temperature resistance after curing. Introduction of the phosphorus-containing capping group allows the resin to have intrinsic flame-retardant performance. Using the resin in the preparation of a metal foil clad laminate facilitates reducing the dielectric constant and dielectric loss of the metal foil clad laminate, and results in higher high temperature resistance and improved flame retardancy, so that the metal foil clad laminate has a good comprehensive performance and broad application prospects.

Provided are an intrinsic flame-retardant resin with a low polarity, and a preparation method therefor and the use thereof. The intrinsic flame-retardant resin with a low polarity has a structure as shown in formula I and is a phenolic compound or resin which is prepared by a three-step reaction of allyl etherification, rearrangement and terminating with a phosphorus-containing group. The resin does not contain polar hydroxyl groups in the molecular formula thereof, and has a stable molecular structure, low polarity and high reactivity, and does not generate polar hydroxyl groups during application and processing, thereby avoiding the influence of secondary hydroxyl groups on the performance of products thereof. While the resin improves the dielectric performance, same still has crosslinkable groups which lead to no significant change in high temperature resistance after curing. Introduction of the phosphorus-containing capping group allows the resin to have intrinsic flame-retardant performance. Using the resin in the preparation of a metal foil clad laminate facilitates reducing the dielectric constant and dielectric loss of the metal foil clad laminate, and results in higher high temperature resistance and improved flame retardancy, so that the metal foil clad laminate has a good comprehensive performance and broad application prospects.

The invention relates to a binder based on phenolic resins of the benzyl ether type and isocyanate compounds having at least two isocyanate groups, containing free phenol and free hydroxybenzyl alcohols in the polyol component. The invention further relates to mold material mixtures containing the binder and to cores, molds, or risers produced with the mold material mixtures and to the use thereof in metal casting.

A cross-linked polymer including a structure wherein at least a portion of phenolic hydroxyl groups in the polymer is protected by a group represented by the following formula (1): ##STR00001##
wherein R.sup.1 represents an alkyl group having 1 to 5 carbons and n represents an integer from 1 to 5; and * represents a bond part of the phenolic hydroxyl group to a residue other than a hydrogen atom, and a structure wherein at least a portion of phenolic hydroxyl groups in the polymer is protected by a group represented by the following formula (2): ##STR00002##
wherein R.sup.2 represents a divalent saturated hydrocarbon group having 2 to 17 carbons, containing an aromatic ring; and * represents a bond part of the phenolic hydroxyl group to a residue other than a hydrogen atom, and the polymers are cross-linked to each other.