C08G10/04

Sequential treatment with aqueous sulfonated aromatic polymer and aqueous polyethylene oxide for enhanced water retention

Treat an aggregation of particulates with two different aqueous mixtures, first with an aqueous mixture containing a sulfonated aromatic polymer component and then with an aqueous mixture containing polyethylene oxide.

RESIST UNDERLAYER FILM-FORMING COMPOSITION
20250231489 · 2025-07-17 · ·

[Problem] The purpose of the present invention is to provide a resist underlayer film-forming composition that can further improve properties of a resist underlayer film, such as curing properties, heat resistance, etching resistance, planarization properties and embedding properties. [Solution] Provided is a resist underlayer film-forming composition characterized by containing a solvent and a novolac resin containing a side chain having a structure represented by formula (D). In formula (D), Ar.sup.2 is an aromatic ring. Formula (D): OAr.sup.2. The novolac resin contains a conjugated unit structure A-B represented by formula (AB). A unit structure A contains a phenol unit structure and/or an amine unit structure.

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Cyanate ester compound, curable resin composition containing said compound, and cured product of said composition

The cyanate ester compound of the present invention is obtained by cyanating a modified naphthalene formaldehyde resin.

Cyanate ester compound, curable resin composition containing said compound, and cured product of said composition

The cyanate ester compound of the present invention is obtained by cyanating a modified naphthalene formaldehyde resin.

Cyanate ester compound and method for producing the same, and curable resin composition comprising the compound, and cured product thereof composition

To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.

Cyanate ester compound and method for producing the same, and curable resin composition comprising the compound, and cured product thereof composition

To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.

SEQUENTIAL TREATMENT WITH AQUEOUS SULFONATED AROMATIC POLYMER AND AQUEOUS POLYETHYLENE OXIDE FOR ENHANCED WATER RETENTION

Treat an aggregation of particulates with two different aqueous mixtures, first with an aqueous mixture containing a sulfonated aromatic polymer component and then with an aqueous mixture containing polyethylene oxide.

SEQUENTIAL TREATMENT WITH AQUEOUS SULFONATED AROMATIC POLYMER AND AQUEOUS POLYETHYLENE OXIDE FOR ENHANCED WATER RETENTION

Treat an aggregation of particulates with two different aqueous mixtures, first with an aqueous mixture containing a sulfonated aromatic polymer component and then with an aqueous mixture containing polyethylene oxide.

MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD

A material for forming an underlayer film for lithography, including a cyanic acid ester compound obtained by cyanation of a modified xylene formaldehyde resin, a composition including the material, and a pattern forming method using the composition.

Prepreg, metal foil-clad laminate, and printed wiring board

A prepreg having low water absorption, and having remarkably suppressed deterioration in insulation resistance over time, and further having excellent heat resistance, a metal foil-clad laminate using the prepreg, and a printed wiring board using the metal foil-clad laminate are provided. A prepreg of the present invention is obtained by impregnating or coating a base material (D) with a resin composition comprising: a naphthol-modified dimethylnaphthalene formaldehyde resin (A); an epoxy resin (B) having an epoxy equivalent of 200 to 400 g/eq.; and an inorganic filler (C).