Patent classifications
C08G16/04
WORKPIECE TREATING METHOD, TEMPORARY FIXING COMPOSITION, SEMICONDUCTOR DEVICE, AND PROCESS FOR MANUFACTURING THE SAME
In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece.
A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.
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LOW-TEMPERATURE CURABLE COMPOSITIONS
This invention pertains to a curable composition comprising a first component having beta-ketoacetate and/or malonate functionalities and a second component having two or more aldehyde functionalities. The compositions can be cured at room temperature or low temperatures to yield crosslinked networks that are capable of providing desirable properties for coating and adhesive applications. The reactive functionalities of beta-ketoacetate, malonate, and aldehyde can be either on polymers as the main binders or on small molecules as the crosslinkers. The curable compositions desirably are either solventless or organic solvent based.
ALKOXYLATED RESOL-TYPE PHENOL RESIN MANUFACTURING METHOD, ALKOXYLATED RESOL-TYPE PHENOL RESIN, RESIN COMPOSITION, AND COATING
In order to provide a curing agent (alkoxylated resole-type phenolic resin) with which a coating film having high hot-water resistance, high workability, and high adhesion to metals may be formed without limiting the main agent to be a bisphenol-A-type epoxy resin, the present invention provides a method for producing an alkoxylated resole-type phenolic resin. The method includes reacting a phenol (a1) including meta-cresol with an aldehyde (a2) in the presence of a basic compound to prepare a resole-type phenolic resin (A); and reacting the resole-type phenolic resin (A) with an alcohol (B) in the presence of an acidic compound having an acid dissociation constant (pKa) of 0 or less.
ALKOXYLATED RESOL-TYPE PHENOL RESIN MANUFACTURING METHOD, ALKOXYLATED RESOL-TYPE PHENOL RESIN, RESIN COMPOSITION, AND COATING
In order to provide a curing agent (alkoxylated resole-type phenolic resin) with which a coating film having high hot-water resistance, high workability, and high adhesion to metals may be formed without limiting the main agent to be a bisphenol-A-type epoxy resin, the present invention provides a method for producing an alkoxylated resole-type phenolic resin. The method includes reacting a phenol (a1) including meta-cresol with an aldehyde (a2) in the presence of a basic compound to prepare a resole-type phenolic resin (A); and reacting the resole-type phenolic resin (A) with an alcohol (B) in the presence of an acidic compound having an acid dissociation constant (pKa) of 0 or less.
ALKOXYLATED RESOL-TYPE PHENOL RESIN MANUFACTURING METHOD, ALKOXYLATED RESOL-TYPE PHENOL RESIN, RESIN COMPOSITION, AND COATING
In order to provide a curing agent (alkoxylated resole-type phenolic resin) with which a coating film having high hot-water resistance, high workability, and high adhesion to metals may be formed without limiting the main agent to be a bisphenol-A-type epoxy resin, the present invention provides a method for producing an alkoxylated resole-type phenolic resin. The method includes reacting a phenol (a1) including meta-cresol with an aldehyde (a2) in the presence of a basic compound to prepare a resole-type phenolic resin (A); and reacting the resole-type phenolic resin (A) with an alcohol (B) in the presence of an acidic compound having an acid dissociation constant (pKa) of 0 or less.