C08G18/025

Method for the synthesis of polymer carbodiimides with added cesium salts, polymer carbodiimides, and use thereof

The present invention relates to processes for producing polymeric carbodiimides by addition of cesium salts and to polymeric carbodiimides produced by this process and to the use thereof as a hydrolysis inhibitor, especially in polyurethane (PU)-based systems, preferably thermoplastic TPU, PU adhesives, PU casting resins, PU elastomers or PU foams.

Method for producing carbodiimide compound

A method for producing a carbodiimide compound, comprising a carbodiimide production step of reacting an aliphatic tertiary isocyanate compound (A) in the presence of an organic alkali metal compound (B) having Lewis basicity.

Process for carbodiimidization

The invention relates to polycarbodiimides and to a process for their preparation using special catalysts.

PROCESS FOR PREPARATION OF A CARBODIIMIDE AND/OR A POLYCARBODIIMIDE

A process can be used for the preparation of a carbodiimide and/or a polycarbodiimide, where the process is particularly essentially free of an alkali metal. The carbodiimide and/or polycarbodiimide obtained and/or obtainable by the process and uses thereof are also provided.

CARBODIIMIDE COMPOSITION
20240182625 · 2024-06-06 · ·

This carbodiimide composition is characterized by comprising a carbodiimide compound (A), a phosphite-based antioxidant (B), and a hindered phenol-based antioxidant (C), and is characterized in that the phosphite-based antioxidant (B) is contained in an amount of 1.5-5 parts by mass with respect to 100 parts by mass of the carbodiimide compound (A), and the hindered phenol-based antioxidant (C) is contained in an amount of 1.5-6 parts by mass with respect to 100 parts by mass of the carbodiimide compound (A). The carbodiimide composition can suppress foaming in a resin during molding, and provides a resin molded article having excellent hydrolysis resistance.

Epoxy resin composition

The present invention provides an epoxy resin composition, which is improved in terms of storage stability without deteriorating the characteristics of a cured resin, and is also superior in handling property, by using a curing accelerator having higher latency. The epoxy resin composition of the present invention comprises an epoxy resin, a curing agent, and a curing accelerator, wherein the curing accelerator is a reaction product between a carbodiimide compound and an imidazole compound, and is contained in an amount of 0.1 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.

Phenyl isocyanate conversion process

Phenyl isocyanates are removed from a solvent stream obtained from an MDI and/or PMDI manufacturing process by reaction in the presence of a carbodiimidization catalyst to form the corresponding N,N-diphenylcarbodiimides. The N,N-diphenylcarbodiimides can be recycled into the MDI and/or PMDI manufacturing process where they can react with MDI and/or PMDI to form uretonimines. The uretonimines have at most minimal effect on the properties and usefulness of the MDI and/or PMDI product and so can be left in the MDI and/or PMDI product.

COMPOSITIONS CONTAINING POLYMERIC CARBODIIMIDE, EPOXIDE AND POLYESTER-BASED POLYMERS, THEIR PRODUCTION AND USE

The present invention relates to compositions containing polymeric carbodiimide, epoxide and polyester-based polymers, their production and use.

CARBODIIMIDE-BASED AQUEOUS RESIN CROSSLINKING AGENT

A carbodiimide-based aqueous resin crosslinking agent excellent in the storage stability in the coexistence of an aqueous resin, comprising a polycarbodiimide (A) having substituents derived from hydrophilic organic compounds at both terminals thereof, at least one of the substituents being a substituent derived from a hydrophilic organic compound having a molecular weight of 340 or more, and a polycarbodiimide (B) having substituents derived from organic compounds having a molecular weight of 300 or less at both terminals thereof, wherein the mass ratio [(B)/(A)] of the polycarbodiimide (B) to the polycarbodiimide (A) is from 20/80 to 95/5.

Adhesives based on carbodimide chemistry

Described herein is a thermosetting resin composition, obtained from the reaction of at least: a polycarbodiimide (i), where the number of carbodiimide groups per molecule is in the range of from 1 to 10; a mixture of crystalline and amorphous polyols (ii), where the molar ratio of carbodiimide groups in the polycarbodiimide according to (i) to hydroxyl groups in the mixture according to (ii) is in the range of from 1:2 to 2:1 and where at least 25 weight-% of the mixture according to (ii) consists of at least one crystalline polyesterol, based on the overall weight of the mixture being 100 weight-%. Also described herein is a method of using the thermosetting resin composition as an adhesive, as well as processes for preparation of adhesives, an element including an adhesive layer on at least one substrate, and an adhesive film, obtained from one of the processes.