The resin composition for encapsulating semiconductor of the present invention is a resin composition for encapsulating semiconductor including an epoxy resin, a curing agent, an inorganic filler, and carbon black fine particles, in which when the resin composition for encapsulating semiconductor is injection-molded to have a length of 80 mm, a width of 10 mm and a thickness of 4 mm under conditions of a mold temperature of 175 C., an injection pressure of 10 MPa, and a curing time of 120 seconds, and then heated at 175 C. for 4 hours to obtain a cured product, and then a surface of the obtained cured product is observed with a fluorescence microscope, a maximum particle diameter of aggregates of the carbon black fine particles is 50 m or less.

A hot melt epoxy resin system includes an epoxy resin composition and a curing agent/catalyst paste composition that is fast curable, isothermal press curable, hot demoldable capable under three minutes at 150 C. and Class A surface giving and suitable to use in the production of automotive interior composite parts, wherein the epoxy resin composition includes an epoxy resin mixture including a first resin and a second resin; at least one thermoplastic toughener; at least one UV hindered amine light stabilizer; at least one UV absorber and/or blocker; 1,3,5-tris(4-tert.-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione as anti-oxidant; hydrophobic fumed silica as air release/rheology agent and hexamethyldisiloxane as an internal mold release agent and the curing agent/catalyst paste composition comprises a paste mixture, which is comprising dicyandiamide (DICY) below a 10 m particle size and sebacic dihydrazide below a 10 m particle size.

A process for producing a viscous epoxy syrup from at least one liquid multifunctional epoxy, comprising the steps of: adding an initiator selected from the group consisting of electron-poor monoisocyanate, photoinitiator and thermal initiator to at least one liquid multifunctional epoxy; mixing the components; polymerizing the multifunctional epoxy such that the viscosity of the resulting epoxy syrup is at least twice as high, preferably at least four times as high and in particular at least ten times as high as the viscosity of the employed epoxy in the unreacted state
makes it possible to produce epoxy adhesives having pressure-sensitive properties.

A curable composition of the present invention includes a cationic polymerizable compound; a thermal polymerization initiator; and a storage stabilizer, in which the cationic polymerizable compound includes at least two selected from the group consisting of a glycidyl ether compound, an alicyclic epoxy compound, and an oxetane compound, a content of the thermal polymerization initiator is from 0.3 to 3 parts by mass with respect to 100 parts by mass of the cationic polymerizable compound, and chain curing is enabled by thermal energy generated by a polymerization reaction of the cationic polymerizable compound.

Thermally reworkable epoxy resins prepared through a Diels-Alder reaction are described herein. A maleimide component is reacted with an electron donating component having a furan ring attached to an epoxy ether to produce the epoxy resins. The epoxy component generated by this method can be cured with different diamines lo form a robust network of epoxy material. The robust epoxy material is used as a reversible thermoset and as an adhesive. The robust epoxy network is heated at 90 C. temperature in a retro Diels-Alder fashion to produce colorless starting materials of the maleimide component and the furan component.

The present disclosure relates to the technical field of the epoxy resin, specifically, relates to a preparation method a low-chlorine epoxy resin and use thereof, which can solve the problem of a high total chlorine content in the epoxy resin to a certain extent. The preparation method of a low-chloride epoxy resin comprises: loading a metal oxide as a stationary phase on a grid inside a reaction kettle; the reaction kettle being externally connected to an alternating-current power supply, and under a first pre-set condition, diluted epoxy resin containing a chlorine impurity, as a mobile phase, flowing through the grid loaded with the metal oxide; the epoxy resin containing a chlorine impurity contacting and reacting with the metal oxide to obtain a purified epoxy resin.

An apparatus includes a conduit with two process fluid inlets at one end of the conduit, one process fluid outlet at an opposing end, a heat exchange medium inlet, and a heat exchange medium outlet. One of the fluid inlets includes a tube extending into the conduit and a perforated node at the end of the tube, and the other of the fluid inlets is arranged up stream of the perforated node. The apparatus further includes hollow tubes positioned longitudinally within the conduit between the two process fluid inlets, the process fluid outlet, the heat exchange medium inlet and the heat exchange medium outlet. In addition, the apparatus includes a collection vessel positioned proximate the fluid outlet and fibers extending through each of the hollow tubes, wherein one end of the fibers is secured to the perforated node and the other end of the fibers extends into the collection vessel.

An apparatus includes a conduit with two process fluid inlets at one end of the conduit, one process fluid outlet at an opposing end, a heat exchange medium inlet, and a heat exchange medium outlet. One of the fluid inlets includes a tube extending into the conduit and a perforated node at the end of the tube, and the other of the fluid inlets is arranged up stream of the perforated node. The apparatus further includes hollow tubes positioned longitudinally within the conduit between the two process fluid inlets, the process fluid outlet, the heat exchange medium inlet and the heat exchange medium outlet. In addition, the apparatus includes a collection vessel positioned proximate the fluid outlet and fibers extending through each of the hollow tubes, wherein one end of the fibers is secured to the perforated node and the other end of the fibers extends into the collection vessel.

Certain embodiments of the invention described herein comprise a composition of matter, and method for preparing the same, which provide the benefits of pre-reaction molecular configuration favoring high liquidity properties, and post-reaction configuration that favors mechanical strength, stiffness, and properties associated with high viscous and/or solid-state materials. In some embodiments, the composition of matter can comprise relaxing photo-isomerizable fragments, of which a fraction can be transformed from trans to cis configurations upon exposure to a photon source. In some embodiments, the composition of matter further comprises thermally reactive fragments, of which can enable thermal solidification of a mixture upon exposure to elevated temperatures. In some embodiments, a composition of matter can be combined with reinforcing additives to form a prepreg combination.

Solvent free epoxy systems are disclosed that can include a hardener compound H comprising: a molecular structure (R.sub.1(Y.sup.1)n), wherein R.sub.1 is an ionic moiety, Y.sup.1 is a nucleophilic group, n is a between 2 and 10; and an ionic moiety A acting as a counter ion to R.sub.1; and an epoxy compound E comprising: a molecular structure (R.sub.2Z.sup.1)n), wherein R.sub.2 is an ionic moiety, Z.sup.1 comprises an epoxide group, n is a between 2 and 10, and an ionic moiety B acting as a counter ion to R.sub.2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of use are described.